Abstract: In a memory module having an integrated-circuit buffer device coupled to one or more integrated-circuit memory devices, the buffer device receives write data signals from an external control component via a set of data inputs, the write data signals indicating write data to be stored within one or more of the memory devices. Logic within the buffer device sequentially applies controllable termination impedance configurations at the data inputs based on an indication received from the control component and an internal state of the buffer device, applying a first controllable termination impedance configuration at each of the data inputs during a first internal state of the buffer device corresponding to the reception of the write data signals on the data inputs, and applying a second controllable termination impedance configuration at each of the data inputs during a second internal state of the buffer device that succeeds the first internal state.

Abstract: A memory controller having a time-staggered request signal output. A first timing signal is generated while a second timing signal is generated having a first phase difference relative to the first timing signal. An address value is transmitted in response to the first timing signal and a control value is transmitted in response to the second timing signal, the address value and control value constituting portions of a first memory access request.

Abstract: A memory controller transmits a plurality of control values to a non-volatile memory device together with one or more programming commands. The plurality of control values include (i) a first control value that specifies a first termination resistance to be applied to an I/O node of the non-volatile memory device during an interval in which a first data signal transmitted on a bidirectional signaling line coupled to the I/O node is to be received within the non-volatile memory device and (ii) a second control value that specifies a second termination resistance to be applied to the I/O node during an interval in which a second data signal is transmitted on the bidirectional signaling line by another non-volatile memory device.

Abstract: An integrated circuit device transmits to a dynamic random access memory (DRAM) one or more commands that specify programming of a digital control value within the DRAM, the digital control value indicating a termination impedance that the DRAM is to couple to a data interface of the DRAM in response to receiving a write command and during reception of write data corresponding to the write command, and that the DRAM is to decouple from the data interface after reception of the write data corresponding to the write command. Thereafter, the integrated circuit device transmits to the DRAM a write command indicating that write data is to be sampled by a data interface of the DRAM during a first time interval and that cause the DRAM to couple the termination impedance to the data interface during the first time interval and decouple the termination impedance from the data interface after the first time interval.

Abstract: An identifier value stored within a programmable register of a memory device is compared with a selector address received, together with a memory access command, via a signaling interface having at least one I/O node coupled to a bidirectional signaling line. On-die termination circuitry is transitioned between first and second states or maintained in one or the other of the first and second states based, at least in part, on whether the selector address matches the identifier value, with transition to the first state including switchably coupling a first termination resistance between the I/O node and a supply voltage line.

Abstract: On-die termination circuitry within a non-volatile memory device applies a first termination resistance to an I/O node in response to a data storage command indicating that a data signal conveyed on a bidirectional signaling line is to be received within the non-volatile memory device via the I/O node, and applies a second termination resistance to the I/O node in response to information indicating that another memory device is to output a data signal onto the bidirectional signaling line.

Abstract: A non-volatile memory device determines, based at least partly on a first multi-bit device address received via a signaling interface and an incoming chip-select signal, whether the device is to participate in a memory access transaction by receiving or outputting data via an I/O node of the signaling interface. Based at least in part on that determination, on-die termination circuitry within the non-volatile memory device switchably couples or decouples a termination resistance between the I/O node and a supply voltage node during a data transmission phase of the memory access transaction.

Abstract: In a non-volatile memory device having an array of non-volatile storage elements, command, address and data signals are received at respective times via a time-multiplexed external signaling line, the data signals representing data to be stored within the array of non-volatile storage elements. A control signal is received via a signaling path external to the non-volatile memory device, and an on-die termination element is switchably coupled to the time-multiplexed signaling line at least in part in response to a transition of the control signal from a first logic state to a second logic state.

Abstract: A dynamic random access memory (DRAM) array is configured for selective repair and error correction of a subset of the array. Error-correcting code (ECC) is provided to a selected subset of the array to protect a row or partial row of memory cells where one or more weak memory cells are detected. By adding a sense amplifier stripe to the edge of the memory array, the adjacent edge segment of the array is employed to store ECC information associated with the protected subsets of the array. Bit replacement is also applied to defective memory cells. By implementing ECC selectively rather than to the entire array, integrity of the memory array is maintained at minimal cost to the array in terms of area and energy consumption.

Abstract: In a non-volatile memory device having an array of non-volatile storage elements, control information received via one or more control input nodes indicates, at different times, that (i) data signals representative of data to be stored within the array of non-volatile storage elements are to be received via a plurality of input/output (I/O) nodes of the non-volatile memory device, and (ii) data signals representative of data read from the array of non-volatile storage elements are to be output via the plurality of I/O nodes. First termination elements are switchably coupled to and decoupled from the I/O nodes based at least in part on the control information, and second termination elements are switchably coupled to and decoupled from the one or more control input nodes based at least in part on the control information.

Abstract: Components of a memory system, such as a memory controller and memory device, which detect accumulated memory read disturbances and correct such disturbances before they reach a level that causes errors. The memory device includes a memory array and a disturbance control circuit. The memory array includes a plurality of memory rows. Each memory row is associated with a disturbance warning circuit having a state that corresponds to an accumulated disturbance in the memory row. The disturbance control circuit determines, responsive to an activation of a memory row of the plurality of memory rows specified by a row access command, whether the disturbance condition is present in the memory row based on the state of the disturbance warning circuit associated with the memory row. If a disturbance condition is present, the disturbance control circuit causes a recovery operation to be performed on the memory row to reduce the accumulated disturbances.

Abstract: A dynamic random access memory (DRAM) array is configured for selective repair and error correction of a subset of the array. Error-correcting code (ECC) is provided to a selected subset of the array to protect a row or partial row of memory cells where one or more weak memory cells are detected. By adding a sense amplifier stripe to the edge of the memory array, the adjacent edge segment of the array is employed to store ECC information associated with the protected subsets of the array. Bit replacement is also applied to defective memory cells. By implementing ECC selectively rather than to the entire array, integrity of the memory array is maintained at minimal cost to the array in terms of area and energy consumption.

Abstract: Exemplary embodiments include a socket interposer having a plurality of connectors configured to attach to a server board, the server board including: a first processor socket having a processor form factor, and a first memory associated with the first processor socket, a processor inserted into the at least first processor socket, the processor having access to the first memory, and a second processor socket having the processor form factor, and a second memory associated with the second processor socket, wherein the plurality of connectors are configured to fit the processor form factor; and a multi-modal I/O interface having a first mode and a second mode, wherein in the first mode provides processor-to-processor communication, and the second mode provides the first processor with accessibility to the second memory associated with the second processor socket.

Abstract: Components of a memory system, such as a memory controller and a memory device, that reduce delay in exiting self-refresh mode by controlling the refresh timing of the memory device. The memory device includes a memory core. An interface circuit of the memory device receives an external refresh signal indicating an intermittent refresh event. A refresh circuit of the memory device generates an internal refresh signal indicating an internal refresh event of the memory device. A refresh control circuit of the memory device performs a refresh operation on a portion of the memory core responsive to the internal refresh event, at a time relative to the intermittent refresh event indicated by the external refresh signal.

Abstract: An integrated circuit device transmits to a dynamic random access memory (DRAM) one or more commands that specify programming of a digital control value within the DRAM, the digital control value indicating a termination impedance that the DRAM is to couple to a data interface of the DRAM in response to receiving a write command and during reception of write data corresponding to the write command, and that the DRAM is to decouple from the data interface after reception of the write data corresponding to the write command. Thereafter, the integrated circuit device transmits to the DRAM a write command indicating that write data is to be sampled by a data interface of the DRAM during a first time interval and that cause the DRAM to couple the termination impedance to the data interface during the first time interval and decouple the termination impedance from the data interface after the first time interval.

Abstract: An integrated circuit memory device stores a plurality of digital values that specify respective termination impedances. The memory device switchably couples respective sets of load elements to a data input/output (I/O) to apply the termination impedances specified by the digital values, including, applying a first termination impedance to the data I/O during an idle state of the memory device, applying a first one of two non-equal termination impedances to the data I/O while the memory device receives write data in a memory write operation and applying a second one of the two non-equal termination impedances to the data I/O while another memory device receives write data in a memory write operation. When outputting read data via the data I/O in a memory read operation, the memory device switchably couples to the data I/O at least a portion of the load elements included in the sets of load elements.

Abstract: In a memory module having an integrated-circuit buffer device coupled to one or more integrated-circuit memory devices, the buffer device receives write data signals from an external control component via a set of data inputs, the write data signals indicating write data to be stored within one or more of the memory devices. Logic within the buffer device sequentially applies controllable termination impedance configurations at the data inputs based on an indication received from the control component and an internal state of the buffer device, applying a first controllable termination impedance configuration at each of the data inputs during a first internal state of the buffer device corresponding to the reception of the write data signals on the data inputs, and applying a second controllable termination impedance configuration at each of the data inputs during a second internal state of the buffer device that succeeds the first internal state.

Abstract: According to one general aspect, an apparatus may include an expansion memory device, a connection printed circuit board, and a connection cable. The expansion memory device may include a plurality of memory chips. The connection printed circuit board may be configured to be physically coupled with a memory socket. The connection cable may be configured to electrically couple the connection printed circuit board with the expansion memory device and transmit electrical signals therebetween.

Abstract: Multiple devices, including a first device and a second device, have operational circuitry and opposing first and second surfaces. First and second electrical contacts are formed at the first surface, while a third electrical contact is formed at the second surface opposite the first electrical contact. The first electrical contact is electrically connected to the operational circuitry, and the second electrical contact is electrically connected to the third electrical contact. The first device and the second device are subsequently stacked such that the first surface of the second device is located adjacent the second surface of the first device such that the first electrical contact of the second device is aligned with the third electrical contact of the first device. The first electrical contact of the second device is electrically connected to the third electrical contact of the first device.

Abstract: In an illustrative embodiment, the memory circuit includes first and second data paths on which data is transferred for read and write memory operations and first and second mixer circuits for adjusting the phase of clock signals applied to their inputs. The mixer circuits are cross-coupled so that the outputs of the first and second mixers are both available to both the first and second data paths. One mixer is used to provide a first phase adjusted clock signal for use by the operating circuit and the other mixer is used to provide a second phase adjusted clock signal for use by a following operation whatever that may be.