Abstract: A system, in one embodiment, includes an ESD adhesive operatively coupled to leads of an electronic device for providing ESD protection thereto, the ESD adhesive including a mixture of a polymeric thin film and electrically conductive fillers dispersed in the polymeric thin film, and has a structural characteristic of being formed through at least partial evaporation of a solvent therefrom and being substantially free of agglomerates of the electrically conductive fillers. In another embodiment, a method for providing ESD protection to an element of an electronic device includes preventing formation of agglomerates of electrically conductive fillers in an ESD adhesive that includes a polymeric thin film, the electrically conductive fillers dispersed therein, and a solvent by subjecting the ESD adhesive to high-energy mixing during formation thereof, applying the ESD adhesive across exposed leads, such as leads of a cable, PCB, or other substrate, and evaporating solvent from the ESD adhesive.

Abstract: A system in one embodiment includes a cable having a plurality of cable leads, and a multi-diode chip having a pad-side not facing the cable. The multi-diode chip includes a plurality of sets of contact pads on the pad-side of the multi-diode chip, and a plurality of crossed diode sets, wherein each set of crossed diodes is coupled between a first contact pad and a second contact pad of one set of contact pads, wherein at least two of the plurality of cable leads are coupled via wire-bonding to one of the plurality of sets of contact pads of the multi-diode chip for providing electrostatic discharge (ESD) protection for at least one element of the electronic device coupled to the at least two cable leads.

Abstract: In one embodiment, a system includes a cable comprising a plurality of leads and an ESD dissipating adhesive coupled to the plurality of leads in a coverage area for providing ESD protection to an element of an electronic device. The ESD adhesive comprises a mixture of a polymeric thin film and electrically conductive fillers dispersed in the film, and the ESD adhesive has a resistivity from about 50 to 100 M?. In another embodiment, a method for providing ESD protection to an element of an electronic device includes applying an ESD adhesive across exposed leads of a cable and evaporating the solvent from the ESD adhesive. At least some of the leads are coupled to an element of an electronic device. The ESD adhesive comprises a polymeric thin film, electrically conductive fillers dispersed in the polymeric thin film, and a solvent for controlling a viscosity of the ESD adhesive.

Abstract: A system, in one embodiment, includes an ESD adhesive operatively coupled to leads of an electronic device for providing ESD protection thereto, the ESD adhesive including a mixture of a polymeric thin film and electrically conductive fillers dispersed in the polymeric thin film, and has a structural characteristic of being formed through at least partial evaporation of a solvent therefrom and being substantially free of agglomerates of the electrically conductive fillers. In another embodiment, a method for providing ESD protection to an element of an electronic device includes preventing formation of agglomerates of electrically conductive fillers in an ESD adhesive that includes a polymeric thin film, the electrically conductive fillers dispersed therein, and a solvent by subjecting the ESD adhesive to high-energy mixing during formation thereof, applying the ESD adhesive across exposed leads, such as leads of a cable, PCB, or other substrate, and evaporating solvent from the ESD adhesive.

Abstract: Described are embodiments to ensure that the equipment utilized to detect antigens is reliable and accurate. If it is determined that a read sensor is degraded a method of calibrating a read sensor of a read head is described. In one embodiment, a method of calibrating a magnetic read sensor includes measuring a first resistance of the magnetic read sensor upon an application of a forward bias current to the magnetic read sensor and measuring a second resistance of the magnetic read sensor upon an application of a reverse bias current to the magnetic read sensor. A calibration constant is determined based on at least the first measured resistance and the second measured resistance. In one embodiment the method further includes storing the determined calibration constant for the magnetic read sensor in memory. Further, in one embodiment the head module having the magnetic read sensor is swept over at least one nanoparticle to obtain a read response of the magnetic read sensor to the nanoparticle.

Abstract: Described are embodiments to ensure that the equipment utilized to detect antigens is reliable and accurate. Accordingly, one embodiment of the invention includes a calibration assembly having nanoparticles, with known magnetic properties, spaced apart at known y-axis locations along the calibration assembly. In one embodiment, the calibration assembly may be used to calibrate a matched filter of the write and read circuitry. Because the calibration assembly comprises nanoparticles with known magnetic properties the read response of the read circuitry to a particular nanoparticle may be stored in the matched filter as an ideal signal for that nanoparticle. The ideal signal stored in the matched filter may then be utilized for reliably and accurately detecting antigens.

Abstract: A device in one embodiment includes a plurality of tunnel junction resistors coupled in series; a first lead coupled to one end of the plurality of tunnel junction resistors coupled in series; and a second lead coupled to another end of the plurality of tunnel junction resistors coupled in series. A device in another embodiment includes a magnetoresistive sensor; a plurality of tunnel junction resistors coupled in series; a first lead coupling one end of the magnetoresistive sensor to one end of the plurality of tunnel junction resistors coupled in series; and a second lead coupling another end of the magnetoresistive sensor to another end of the plurality of tunnel junction resistors coupled in series.

Abstract: A magnetoresistive transducer head assembly includes a reader element, a writer element and a high impedance shunt electrically connecting the reader element and the writer element. The high impedance shunt provides a high impedance conductive path for maintaining electrostatic charge equipotential between the reader element and the writer element.

Abstract: A magnetoresistive transducer head assembly includes a reader element, a writer element and a high impedance shunt electrically connecting the reader element and the writer element. The high impedance shunt provides a high impedance conductive path for maintaining electrostatic charge equipotential between the reader element and the writer element.

Abstract: An audit device according to one embodiment includes a substrate; at least one test element coupled to the substrate; a connector adapted for coupling the at least one test element to leads of a cable; and a probe for detecting at least one of: voltage across and current through the at least one test element. Additional systems and methods are also presented.

Abstract: In one embodiment, a system includes a cable comprising a plurality of leads and an ESD dissipating adhesive coupled to the plurality of leads in a coverage area for providing ESD protection to an element of an electronic device. The ESD adhesive comprises a mixture of a polymeric thin film and electrically conductive fillers dispersed in the film, and the ESD adhesive has a resistivity from about 50 to 100 M?. In another embodiment, a method for providing ESD protection to an element of an electronic device includes applying an ESD adhesive across exposed leads of a cable and evaporating the solvent from the ESD adhesive. At least some of the leads are coupled to an element of an electronic device. The ESD adhesive comprises a polymeric thin film, electrically conductive fillers dispersed in the polymeric thin film, and a solvent for controlling a viscosity of the ESD adhesive.

Abstract: A system in one embodiment includes a cable having a plurality of cable leads, and a multi-diode chip having a pad-side not facing the cable. The multi-diode chip includes a plurality of sets of contact pads on the pad-side of the multi-diode chip, and a plurality of crossed diode sets, wherein each set of crossed diodes is coupled between a first contact pad and a second contact pad of one set of contact pads, wherein at least two of the plurality of cable leads are coupled via wire-bonding to one of the plurality of sets of contact pads of the multi-diode chip for providing electrostatic discharge (ESD) protection for at least one element of the electronic device coupled to the at least two cable leads.

Abstract: A read/write head for magnetic tapes configured with an in situ radio frequency (RF) shield is provided. The RF shield of the invention inhibits device elements reading data from reading RF radiation irradiated by other device elements writing data. The RF shield may be situated between the device elements of one module and the device elements of a second module. The dimensions and materials of the RF shield may be selected depending upon the operating frequencies of the head and skin depth of materials comprising the RF shield. The data cable may be bonded to device element pads of a module using ACF bonding. AFC bonding the cable to the module may allow a metal ground plane on the cable to be extended to provide additional RF shielding.

Abstract: A system according to one embodiment includes a power supply for charging a lead of a magnetic sensor to a voltage; an interface for operatively coupling the power supply to the lead of the magnetic sensor; a relay for selectively coupling the lead of the magnetic sensor to ground for causing a discharge event, wherein the discharge event reverses a magnetic orientation of a pinned layer of the magnetic sensor; and a shorting resistor between the relay and ground.

Abstract: A magnetic head comprises a plurality of elements selected from a group consisting of readers and writers. A servo sensor is positioned towards the elements, the servo sensor being adapted for sensing a first servo track of a magnetic medium. A fence is positioned towards the servo sensor and aligned therewith in a tape travel direction. A magnetic head in another embodiment includes a substrate and a reader positioned above the substrate, the reader having a sensor and shields sandwiching the sensor. A fence is positioned towards the reader on an opposite side thereof from the substrate, the fence being aligned with the reader in a travel direction of a magnetic medium passing thereby.

Abstract: An apparatus, system, and method are disclosed for dynamically controlling a recording head substrate bias voltage. The apparatus includes a midpoint module and a substrate module. The midpoint module calculates a midpoint voltage of a plurality of data read elements and servo read elements contained in the head. The substrate module calculates a substrate bias voltage. The apparatus, system, and method dynamically control the substrate bias voltage post-assembly, minimizing certain head degradations and extending the life of associated head readers.

Abstract: A device in one embodiment includes a plurality of tunnel junction resistors coupled in series; a first lead coupled to one end of the plurality of tunnel junction resistors coupled in series; and a second lead coupled to another end of the plurality of tunnel junction resistors coupled in series. A device in another embodiment includes a magnetoresistive sensor; a plurality of tunnel junction resistors coupled in series; a first lead coupling one end of the magnetoresistive sensor to one end of the plurality of tunnel junction resistors coupled in series; and a second lead coupling another end of the magnetoresistive sensor to another end of the plurality of tunnel junction resistors coupled in series.

Abstract: A magnetoresistive transducer head assembly includes a reader element, a writer element and a high impedance shunt electrically connecting the reader element and the writer element. The high impedance shunt provides a high impedance conductive path for maintaining electrostatic charge equipotential between the reader element and the writer element.

Abstract: A system for protecting an electronic device from an electrical event such as electrostatic discharge and other spurious events according to one embodiment of the present invention includes first and second leads adapted for passing an electric current through an electronic device, a first diode protection mechanism coupled to the leads such that the first diode protection mechanism is connected in parallel with the electronic device when the leads are coupled to the electronic device, and a second diode protection mechanism coupled in series with the electronic device when the leads are coupled to the electronic device.

Abstract: A magnetic head comprises a plurality of elements selected from a group consisting of readers and writers. A servo sensor is positioned towards the elements, the servo sensor being adapted for sensing a first servo track of a magnetic medium. A fence is positioned towards the servo sensor and aligned therewith in a tape travel direction. A magnetic head in another embodiment includes a substrate and a reader positioned above the substrate, the reader having a sensor and shields sandwiching the sensor. A fence is positioned towards the reader on an opposite side thereof from the substrate, the fence being aligned with the reader in a travel direction of a magnetic medium passing thereby.