Patents by Inventor Ikuo Ogasawara
Ikuo Ogasawara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9658285Abstract: A probe apparatus includes a movable mounting table for holding a test object provided with a plurality of power devices including diodes; a probe card arranged above the mounting table with probes; a measuring unit for measuring electrical characteristics of the power devices by bringing the probes into electrical contact with the test object in a state that a conductive film electrode formed on at least a mounting surface of the mounting table is electrically connected to a conductive layer formed on a rear surface of the test object; and a conduction member for electrically interconnecting the conductive film electrode and the measuring unit when measuring the electrical characteristics. The conduction member is interposed between an outer peripheral portion of the probe card and an outer peripheral portion of the mounting table.Type: GrantFiled: March 11, 2011Date of Patent: May 23, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Isao Kouno, Ken Taoka, Eiichi Shinohara, Ikuo Ogasawara
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Patent number: 9322844Abstract: A probe card 10 includes a first probe 11 configured to come into electric contact with an emitter electrode of a power device D; a block-shaped first connecting terminal 12 to which the first probe 11 is connected; a second probe 13 configured to come into electric contact with a gate electrode of the power device D; a block-shaped second connecting terminal 14 to which the second probe 13 is connected; a contact plate 15 configured to come into electric contact with a collector electrode of the power device D; and a block-shaped third connecting terminal 16 fixed to the contact plate 15. Further, the first connecting terminal 12, the second connecting terminal 14 and the third connecting terminal 16 electrically come into direct contact with corresponding connection terminals of a tester, respectively.Type: GrantFiled: July 30, 2012Date of Patent: April 26, 2016Assignee: TOKYO ELECTRON LIMITEDInventors: Eiichi Shinohara, Ikuo Ogasawara, Ken Taoka
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Publication number: 20140176173Abstract: A probe card 10 includes a first probe 11 configured to come into electric contact with an emitter electrode of a power device D; a block-shaped first connecting terminal 12 to which the first probe 11 is connected; a second probe 13 configured to come into electric contact with a gate electrode of the power device D; a block-shaped second connecting terminal 14 to which the second probe 13 is connected; a contact plate 15 configured to come into electric contact with a collector electrode of the power device D; and a block-shaped third connecting terminal 16 fixed to the contact plate 15. Further, the first connecting terminal 12, the second connecting terminal 14 and the third connecting terminal 16 electrically come into direct contact with corresponding connection terminals of a tester, respectively.Type: ApplicationFiled: July 30, 2012Publication date: June 26, 2014Applicant: TOKYO ELECTRON LIMITEDInventors: Eiichi Shinohara, Ikuo Ogasawara, Ken Taoka
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Patent number: 8678739Abstract: A carrier supporting apparatus is configured to support a carrier containing a plurality of plate-like objects to be processed, such that each object to be processed is arranged vertically at an interval in a horizontal attitude. The carrier includes multiple sets of supporting stages each arranged vertically at an interval, wherein each set of the supporting stages are configured to support the periphery of a bottom face of one object to be processed. The carrier supporting apparatus comprises a placing table adapted to place the carrier thereon, a lifting member that can be raised and lowered relative to the placing table, and a drive mechanism adapted to drive the lifting mechanism. When raised, the lifting member raises a bottom face of the object to be processed, which is supported on a set of the lowermost supporting stages in the carrier, and lifts it up from the supporting stages.Type: GrantFiled: June 20, 2005Date of Patent: March 25, 2014Assignee: Tokyo Electron LimitedInventors: Ikuo Ogasawara, Yoshiyasu Kato
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Publication number: 20130063171Abstract: A probe apparatus includes a movable mounting table for holding a test object provided with a plurality of power devices including diodes; a probe card arranged above the mounting table with probes; a measuring unit for measuring electrical characteristics of the power devices by bringing the probes into electrical contact with the test object in a state that a conductive film electrode formed on at least a mounting surface of the mounting table is electrically connected to a conductive layer formed on a rear surface of the test object; and a conduction member for electrically interconnecting the conductive film electrode and the measuring unit when measuring the electrical characteristics. The conduction member is interposed between an outer peripheral portion of the probe card and an outer peripheral portion of the mounting table.Type: ApplicationFiled: March 11, 2011Publication date: March 14, 2013Applicant: TOKYO ELECTRON LIMITEDInventors: Isao Kouno, Ken Taoka, Eiichi Shinohara, Ikuo Ogasawara
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Patent number: 8196983Abstract: A substrate attracting device includes an attracting body for attracting and holding a substrate to transfer the substrate. The attracting body includes a first attracting unit for attracting and holding a top surface of the substrate according to Bernoulli principle and a second attracting unit for vacuum-attracting and holding a bottom surface of the substrate.Type: GrantFiled: April 23, 2008Date of Patent: June 12, 2012Assignee: Tokyo Electron LimitedInventors: Munetoshi Nagasaka, Ikuo Ogasawara
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Publication number: 20090245979Abstract: A carrier supporting apparatus (10) according to the present invention is configured to support a carrier (C) containing, therein, a plurality of substantially plate-like objects (D) to be processed, such that each object to be processed is arranged vertically at an interval in a horizontal attitude. The carrier includes multiple sets of supporting stages (bottom faces of grooves (1A)) each arranged vertically at an interval, wherein each set of the supporting stages are configured to support the periphery of a bottom face of each one object (D) to be processed. The carrier supporting apparatus comprises a placing table (11) adapted to place the carrier (C) thereon, a lifting member (12) provided such that it can be raised and lowered relative to the placing table, and a drive mechanism adapted to drive the lifting mechanism to be raised and lowered.Type: ApplicationFiled: June 20, 2005Publication date: October 1, 2009Inventors: Ikuo Ogasawara, Yoshiyasu Kato
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Publication number: 20080267741Abstract: A substrate attracting device includes an attracting body for attracting and holding a substrate to transfer the substrate. The attracting body includes a first attracting unit for attracting and holding a top surface of the substrate according to Bernoulli principle and a second attracting unit for vacuum-attracting and holding a bottom surface of the substrate.Type: ApplicationFiled: April 23, 2008Publication date: October 30, 2008Applicant: TOKYO ELECTRON LIMITEDInventors: Munetoshi NAGASAKA, Ikuo OGASAWARA
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Patent number: 7411384Abstract: A wafer chuck is provided with a plurality of pins which protrude and retreat in a plurality of through holes formed in a vertical direction on a mounting table, and an ascending/descending mechanism for ascending and descending the pins. The wafer chuck receives a wafer by protruding the pins from the mounting plane of the mounting table. On each upper end surface of the pin, a receiving surface part is provided for substantially not making a gap between the pin and each of the corresponding through holes and a mechanism for aligning the receiving surface part with the mounting surface is provided.Type: GrantFiled: March 6, 2007Date of Patent: August 12, 2008Assignee: Tokyo Electron LimitedInventors: Ikuo Ogasawara, Yoshiyasu Kato
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Publication number: 20070152691Abstract: A wafer chuck is provided with a plurality of pins which protrude and retreat in a plurality of through holes formed in a vertical direction on a mounting table, and an ascending/descending mechanism for ascending and descending the pins. The wafer chuck receives a wafer by protruding the pins from the mounting plane of the mounting table. On each upper end surface of the pin, a receiving surface part is provided for substantially not making a gap between the pin and each of the corresponding through holes and a mechanism for aligning the receiving surface part with the mounting surface is provided.Type: ApplicationFiled: March 6, 2007Publication date: July 5, 2007Applicant: TOKYO ELECTRON LIMITEDInventors: Ikuo OGASAWARA, Yoshiyasu Kato
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Patent number: 4194486Abstract: An ignition device for rotary piston engines. The device has an ignition plug disposed in a bore formed in an inner wall surface of a casing of the engine. The plug is of the surface gap and air gap discharge type and has a discharge end constituted by inner and outer electrodes spaced apart from each other through a surface gap discharge distance defined by a surface of an insulative sleeve encircling the inner electrode and an air gap discharge distance defined between the insulative sleeve and the outer electrode. The surface gap discharge distance is not less than 0.6 mm and not greater than 1.3 mm. The air gap discharge distance is not less than 0.7 mm and not greater than 1.4 mm. The surface gap discharge distance is not greater than the air gap discharge distance. The outer electrode has a tip end axially retreated with respect to the surface of the insulative sleeve by a distance between 0.3-1.0 mm.Type: GrantFiled: February 14, 1978Date of Patent: March 25, 1980Assignees: Toyo Kogyo Co., Ltd., NGK Spark Plug Co., Ltd.Inventors: Haruhiko Satow, Tadakazu Ueda, Ikuo Ogasawara
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Patent number: D589474Type: GrantFiled: December 6, 2007Date of Patent: March 31, 2009Assignee: Tokyo Electron LimitedInventors: Ikuo Ogasawara, Munetoshi Nagasaka
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Patent number: D589912Type: GrantFiled: December 6, 2007Date of Patent: April 7, 2009Assignee: Tokyo Electron LimitedInventors: Ikuo Ogasawara, Munetoshi Nagasaka
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Patent number: D609652Type: GrantFiled: January 22, 2009Date of Patent: February 9, 2010Assignee: Tokyo Electron LimitedInventors: Munetoshi Nagasaka, Ikuo Ogasawara, Eiichi Shinohara