Wafer attracting plate
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Description
Claims
The ornamental design for wafer attracting plate, as shown and described.
Referenced Cited
U.S. Patent Documents
Patent History
Patent number: D609652
Type: Grant
Filed: Jan 22, 2009
Date of Patent: Feb 9, 2010
Assignee: Tokyo Electron Limited (Tokyo)
Inventors: Munetoshi Nagasaka (Nirasaki), Ikuo Ogasawara (Nirasaki), Eiichi Shinohara (Nirasaki)
Primary Examiner: Selina Sikder
Attorney: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
Application Number: 29/331,222
Type: Grant
Filed: Jan 22, 2009
Date of Patent: Feb 9, 2010
Assignee: Tokyo Electron Limited (Tokyo)
Inventors: Munetoshi Nagasaka (Nirasaki), Ikuo Ogasawara (Nirasaki), Eiichi Shinohara (Nirasaki)
Primary Examiner: Selina Sikder
Attorney: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
Application Number: 29/331,222
Classifications
Current U.S. Class:
Electron Or Vacuum Tube (23) (D13/180)