Abstract: Provided is an upright vacuum cleaner. The upright vacuum cleaner includes a suction nozzle comprising a plurality of wheels, a main body relatively rotatable with respect to the suction nozzle, and a steering device steering the plurality of wheels to correspond to the movement of the main body.

Abstract: Provided is a digital image signal processing method and apparatus which generates a first continuous-captured image in a continuous-photographing mode, generates a first name of the first continuous-captured image according to DCF rules, generates a second name of a second continuous-captured image following the first continuous-captured image according to the DCF rules, generates first continuous-photographing number information indicating an order of continuous-photographing of the first continuous-captured image, and generates a first file comprising the first continuous-captured image, the first name, the second name, and the first continuous-photographing number information. In this way, continuous-captured images and images obtained before and after the continuous-captured images can be effective played back.

Abstract: The present embodiments relate to a vacuum cleaner. The vacuum cleaner according to present embodiments includes a main body; a wheel for moving the main body; a driving unit for driving the wheel; a sensor for sensing movement of the main body; and a controller for controlling the driving unit according to data sensed by the sensor.

Abstract: A nozzle for a vacuum cleaner is provided, the nozzle having a structure in which suction performance may be improved. The nozzle may include a nozzle body, and an agitator rotatably installed in the nozzle body. Air may follow a first flow path through the nozzle, and a second flow path which diverges from the second flow path at the agitator, so as to uniformly distribute air flow through the nozzle.

Abstract: The present invention relates to an optical film comprising: a blended resin including 1) an acrylic copolymer resin containing an alkyl methacrylate monomer and a (metha) acrylic monomer containing an alicyclic or an aromatic ring, 2) a copolymer resin containing an alkyl methacrylate monomer, an aromatic vinyl monomer, and an acid anhydride monomer, and 3) a resin containing an aromatic or an alicyclic ring in the main chain of a polymer. The present invention also relates to a method for manufacturing the optical film, and a liquid crystal display device comprising the optical film. The optical film according to the present invention is excellent in heat resistance, optical transparency, mechanical strength, durability, and the like.

Abstract: Provided is an upright vacuum cleaner. The upright vacuum cleaner includes a suction nozzle comprising a plurality of wheels, a main body relatively rotatable with respect to the suction nozzle, and a steering device steering the plurality of wheels to correspond to the movement of the main body.

Abstract: Provided is a digital image signal processing method and apparatus which generates a first continuous-captured image in a continuous-photographing mode, generates a first name of the first continuous-captured image according to DCF rules, generates a second name of a second continuous-captured image following the first continuous-captured image according to the DCF rules, generates first continuous-photographing number information indicating an order of continuous-photographing of the first continuous-captured image, and generates a first file comprising the first continuous-captured image, the first name, the second name, and the first continuous-photographing number information. In this way, continuous-captured images and images obtained before and after the continuous-captured images can be effective played back.

Abstract: The present invention discloses a vacuum cleaner including a main body (1) of the vacuum cleaner, a wheel (2) rotatably mounted at the body, a driving unit for driving the wheel (2), a sensor (71) positioned at the main body, for sensing an inclined direction of the main body (1), and a control unit for controlling the driving unit according to the inclined direction of the main body (1) sensed by the sensor (71). In this configuration, the posture of the main body (1) of the vacuum cleaner can be controlled according to the inverted pendulum control theory. Therefore, the main body (1) of the vacuum cleaner can maintain the posture thereof not to fall down.

Abstract: The present invention relates to an optical film comprising: a blended resin including 1) an acrylic copolymer resin containing an alkyl methacrylate monomer and a (metha) acrylic monomer containing an alicyclic or an aromatic ring, 2) a copolymer resin containing an alkyl methacrylate monomer, an aromatic vinyl monomer, and an acid anhydride monomer, and 3) a resin containing an aromatic or an alicyclic ring in the main chain of a polymer. The present invention also relates to a method for manufacturing the optical film, and a liquid crystal display device comprising the optical film. The optical film according to the present invention is excellent in heat resistance, optical transparency, mechanical strength, durability, and the like.

Abstract: A nozzle for a vacuum cleaner is provided, the nozzle having a structure in which suction performance may be improved. The nozzle may include a nozzle body, and an agitator rotatably installed in the nozzle body. Air may follow a first flow path through the nozzle, and a second flow path which diverges from the second flow path at the agitator, so as to uniformly distribute air flow through the nozzle.

Abstract: A vacuum cleaner is provided that includes a vacuum cleaner main body having a suction pump, a suction nozzle portion that sucks impurities by a suction force supplied by the suction pump, a suction passage that connects the suction nozzle portion to the suction pump, an agitator installed at the suction passage, and a driving device that makes the agitator perform a linear translation. As the agitator is formed narrow and long, a bottom surface of the suction nozzle portion may maintain a small suction area. Therefore the vacuum cleaner attains a high surface pressure which is an advantage of an ordinary type suction nozzle portion, and a high drag coefficient of impurities which is an advantage of a brush type suction nozzle portion.

Abstract: Disclosed are a metal interconnection of a semiconductor device and a method for manufacturing the same, capable of improving the reliability of the semiconductor device. The metal interconnection of the semiconductor device includes a first metal interconnection formed on a semiconductor substrate; an interlayer dielectric layer formed on the semiconductor substrate including the first metal interconnection, the interlayer dielectric layer being selectively removed to form a via hole and a trench on the via hole; a metal diffusion blocking layer formed in the via hole and the trench formed on the via hole; a second metal interconnection buried in the via hole and the trench below a top portion of the metal diffusion blocking layer; and a protection layer covering the interlayer dielectric layer, the metal diffusion blocking layer, and the second metal interconnection.

Abstract: The present embodiments relate to a vacuum cleaner. The vacuum cleaner according to present embodiments includes a main body; a wheel for moving the main body; a driving unit for driving the wheel; a sensor for sensing movement of the main body; and a controller for controlling the driving unit according to data sensed by the sensor.

Abstract: A method for forming an isolation layer for a semiconductor device is provided. The preferred method is capable of securing a gap fill margin during formation of an isolation layer. A device isolation layer formed according to a preferred method includes a trench formed in a device separation area of a semiconductor substrate; a thermal oxidation layer formed in a part of the trench; an oxidation silicon layer formed on the thermal oxidation layer; and an oxidation isolation layer formed on the oxidation silicon layer and filling the trench.

Abstract: The present invention discloses a vacuum cleaner including a main body (1) of the vacuum cleaner, a wheel (2) rotatably mounted at the body, a driving unit for driving the wheel (2), a sensor (71) positioned at the main body, for sensing an inclined direction of the main body (1), and a control unit for controlling the driving unit according to the inclined direction of the main body (1) sensed by the sensor (71). In this configuration, the posture of the main body (1) of the vacuum cleaner can be controlled according to the inverted pendulum control theory. Therefore, the main body (1) of the vacuum cleaner can maintain the posture thereof not to fall down.

Abstract: A tungsten plug structure of a semiconductor device wherein a method for forming the same is performed at least twice to form a tungsten plug having a low aspect ratio, thereby obtaining an overlap margin between the tungsten plug and a metal line and minimizing contact resistance between the tungsten plug and a lower metal line layer. The plug structure of a semiconductor device includes a silicon substrate in which various elements for the semiconductor device are formed, a first dielectric film formed on the silicon substrate, having a first contact hole, a first plug buried in the first contact hole of the first dielectric film, having a low aspect ratio, a second dielectric film formed on an entire surface including the first dielectric film, having a second contact hole on the first plug, a second plug buried in the second contact hole of the second dielectric film, having a low aspect ratio, and a metal line formed on the second plug.

Abstract: The present invention discloses a vacuum cleaner including a vacuum cleaner main body having a suction pump, a suction nozzle portion for sucking impurities by a suction force supplied by the suction pump, a suction passage for connecting the suction nozzle portion to the suction pump, an agitator installed at the suction passage, and a driving unit for making the agitator perform linear translation. As the agitator is formed narrow and long, the bottom surface of the suction nozzle portion can maintain a small suction area. Therefore, the vacuum cleaner attains a high surface pressure which is an advantage of an ordinary type suction nozzle portion, and a high drag coefficient of impurities which is an advantage of a brush type suction nozzle portion.

Abstract: A dual damascene interconnection in a semiconductor device is formed to be capable of preventing fluorine (F) component from being diffused through sidewalls of a via hole and a trench. The dual damascene interconnection includes a lower metal interconnection film, an intermetal insulating film having a via hole and a trench and formed on the lower metal interconnection film, first and second insulative spacer films formed on sidewalls of the via hole and the trench, respectively, a barrier metal layer covering the first and second insulative spacer films and the lower metal interconnection film in the via hole and the trench, and an upper metal interconnection film formed on the barrier metal layer, the via hole and the trench being filled with the upper metal interconnection film.

Abstract: A method for forming an isolation layer for a semiconductor device is provided. The preferred method is capable of securing a gap fill margin during formation of an isolation layer. A device isolation layer formed according to a preferred method includes a trench formed in a device separation area of a semiconductor substrate; a thermal oxidation layer formed in a part of the trench; an oxidation silicon layer formed on the thermal oxidation layer; and an oxidation isolation layer formed on the oxidation silicon layer and filling the trench.

Abstract: Provided is a method for forming a metal wiring through a damascene process in a semiconductor device. The method includes: forming a metal diffusion barrier on a semiconductor substrate having a via hole and a trench therein; depositing a metal on the metal diffusion barrier, and filling the via hole and trench with the metal; performing a CMP process until an insulating layer is exposed, thereby forming the metal wiring from the metal; etching the exposed insulating layer by predetermined amount; and forming a passivation layer on the entire surface of the semiconductor substrate.