Patents by Inventor In-seon Park

In-seon Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11445120
    Abstract: Disclosed are an information processing method and information processing apparatus which execute an installed artificial intelligence (AI) algorithm and/or machine learning algorithm to process a spoken utterance of a user in a 5G communication environment. The information processing method according to an embodiment of the present disclosure may include receiving a spoken utterance of a user and extracting, from the spoken utterance, a demonstrative pronoun referring to a target indicated by the user, determining an image capture region to be scanned by a camera according to the type of the demonstrative pronoun, recognizing the target indicated by the user from a result of scanning the image capture region, and feeding back a result of processing the spoken utterance to the user on the basis of a result of recognizing the target indicated by the user.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: September 13, 2022
    Assignee: LG ELECTRONICS INC.
    Inventors: In Jung Yang, Mi Seon Park, Ji-Won Kim
  • Publication number: 20220238912
    Abstract: The present invention provides a lithium ion conductive composite solid electrolyte including an oxide-based crystalline solid electrolyte and a sulfide-based solid electrolyte, wherein the oxide-based solid electrolyte is a garnet-type solid electrolyte represented by a general formula of Li7-3y-zAlyLa3Zr2-zMzO12, wherein M is at least one element selected from the group consisting of niobium (Nb), tantalum (Ta), and tungsten (W), y satisfies 0?y?1, and z satisfies 0?z<2, the sulfide-based solid electrolyte is an argyrodite-based ceramic represented by a general formula of Li7-aPS6-aXa, wherein X is at least one element selected from the group consisting of chlorine (Cl), bromine (Br), and iodine (I), and a satisfies 0?a?2, and the oxide-based solid electrolyte and the sulfide-based solid electrolyte are mixed in a weight ratio of 5.1:4.9 to 8:2.
    Type: Application
    Filed: April 20, 2021
    Publication date: July 28, 2022
    Applicant: Inha University Research and Business Foundation
    Inventors: Hae Jin HWANG, Young Seon PARK, Eunjeong YI, Jaemin LEE
  • Publication number: 20220206716
    Abstract: A method for operating a memory controller, the method including: receiving a first command from a first host; storing the first command in a queue; when the first command has a higher priority than a second command currently being performed, pausing an operation of the second command and performing a read operation of the first command; and continuing the operation of the second command after completion of the read operation of the first command.
    Type: Application
    Filed: October 5, 2021
    Publication date: June 30, 2022
    Inventors: Wan-Soo CHOI, Young Wook Kim, Hyun Seon PARK
  • Publication number: 20220183596
    Abstract: The present disclosure relates to a body attachment device for continuous glucose monitoring and, more particularly, to a body attachment device for continuous glucose monitoring characterized in that as a user command for applying operating power of the body attachment device is inputted by an optical method or a touch method, operation of the body attachment device can be controlled by easily initiating application of battery power not only before the body attachment device is attached to the body but also after the body attachment device has been attached to the body. In addition, as the operation of the body attachment device is controlled by light or touch, it is possible to prevent erroneous operation of the body attachment device that occurs when a user touches, by mistake, a physical operation button formed in the body attachment device while using the body attachment device. Furthermore, the operating power can be stably provided.
    Type: Application
    Filed: August 19, 2020
    Publication date: June 16, 2022
    Inventors: Jin Won LEE, Hyo Seon PARK, Yun Ho LEE
  • Patent number: 11352495
    Abstract: The present invention relates to a thermoplastic resin. More particularly, the present invention relates to a thermoplastic resin that is a graft copolymer having a seed-shell structure and includes a bimodal seed including a large-diameter rubbery polymer having an average particle diameter of greater than 2,000 ? and 3,500 ? or less and a small-diameter rubbery polymer having an average particle diameter of 500 ? to 2,000 ?; and an aromatic vinyl-vinyl cyan shell, wherein the aromatic vinyl cyan compound is included in an amount of 5% by weight to 28% by weight based on a total weight of the aromatic vinyl-vinyl cyan shell. In accordance with the present invention, a thermoplastic resin having a composition capable of improving graft density, and a thermoplastic resin composition capable of increasing dispersion and having high gloss due to inclusion of the thermoplastic resin are provided.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: June 7, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Joo Byung Chai, Tae Young Jeon, Yu Sung Jung, Jong Beom Kim, Chang Sull Kim, Eun Seon Park, Young Min Kim
  • Publication number: 20220153899
    Abstract: The present invention provides a method of preparing a graft copolymer, which comprises graft emulsion polymerization of a diene-based rubber polymer with an aromatic vinyl-based monomer and a vinyl cyanide-based monomer in the presence of an azo-based initiator having a solubility in water at 20° C. of 10 g/100 g or more and a 10-hour half-life decomposition temperature in water of 80° C. or less, wherein the graft emulsion polymerization is initiated at 45 to 55° C. According to the present invention, a method of preparing a graft copolymer, which allows polymerization to be performed at low temperatures and ensures excellent polymerization stability, can be provided.
    Type: Application
    Filed: July 21, 2020
    Publication date: May 19, 2022
    Inventors: Tae Young JEON, Joo Byung CHAI, Yu Sung JUNG, Jong Beom KIM, Eun Seon PARK
  • Patent number: 11286314
    Abstract: Provided are a method for preparing a conjugated diene-based polymer and a method for preparing a graft copolymer including the same. The method for preparing a conjugated diene-based polymer includes enlarging a first conjugated diene-based polymer in multiple stages to prepare a second conjugated diene-based polymer, wherein the multi-stage enlargement includes a primary enlargement stage and a secondary enlargement stage, and a weight ratio of acids added in the primary enlargement stage and the secondary enlargement stage is 70:30 to 90:10. A graft copolymer prepared by the above-described method can be used to form a thermoplastic resin molded article excellent in all of plating characteristics, mechanical properties, surface characteristics, colorability, and processability.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: March 29, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Joo Byung Chai, Yu Sung Jung, Jong Beom Kim, Chang Sull Kim, Eun Seon Park, Tae Young Jeon
  • Publication number: 20220059926
    Abstract: An antenna module includes an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having a semiconductor chip embedded therein; and an electronic component disposed at a side of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The antenna module includes a connection substrate connected to a portion of the antenna substrate, the connection substrate having an extension portion extending outward from the side of the antenna substrate, and the electronic component is disposed on the extension portion of the connection substrate to electrically connect to an inner wiring layer of the antenna substrate.
    Type: Application
    Filed: November 3, 2021
    Publication date: February 24, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Won Wook SO, Jin Seon PARK, Young Sik HUR, Jung Chul GONG, Yong Ho BAEK
  • Patent number: 11245070
    Abstract: An electronic device including a semiconductor memory. The semiconductor memory may include a variable resistance element. The variable resistance element may include a first magnetic layer formed over a first auxiliary layer, a tunnel barrier layer formed over the first magnetic layer, a second magnetic layer formed over the tunnel barrier layer, a second auxiliary layer formed over the second magnetic layer, and a hard mask formed over the second auxiliary layer. Side surfaces of the first magnetic layer may be substantially aligned with side surfaces of the first auxiliary layer, and the side surfaces of the first magnetic layer may deviate from side surfaces of the hard mask.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: February 8, 2022
    Assignee: SK hynix Inc.
    Inventors: Ga-Young Ha, Ki-Seon Park, Jong-Han Shin
  • Publication number: 20220037792
    Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
    Type: Application
    Filed: October 20, 2021
    Publication date: February 3, 2022
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hak Gu KIM, Ho Kyung KANG, Seong Jong CHEON, Young Sik HUR, Jin Seon PARK, Yong Duk LEE
  • Patent number: 11216141
    Abstract: A touch sensor includes a base layer, electrode units, and loop-shaped first lines. The electrode units are disposed on the base layer. The electrode units are arranged in a first direction and a second direction crossing the first direction. The loop-shaped first lines are in a same layer as the electrode units. The loop-shaped first lines are disposed between some of the electrode units, which are adjacent in the second direction. The loop-shaped first lines include resistance lines extending in the first direction and connection lines extending in the second direction. Some of the resistance lines, which are adjacent in the second direction, are connected by a connection line among the connection lines. The connection lines are spaced apart from each other in the first direction.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: January 4, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jong Seon Park, Hwan Hee Jeong
  • Patent number: 11214645
    Abstract: The present invention relates to a method for preparing a graft copolymer including polymerizing a conjugated diene-based monomer to prepare a small-size conjugated diene-based polymer; enlarging the small-size conjugated diene-based polymer to prepare a large-size conjugated diene-based polymer; and polymerizing the small-size conjugated diene-based polymer, the large-size conjugated diene-based polymer, an aromatic vinyl-based monomer and a vinyl cyan-based monomer to prepare a graft copolymer, wherein a weight ratio of the small-size conjugated diene-based polymer and the large-size conjugated diene-based polymer is 10:90 to 40:60 in preparing the graft copolymer.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: January 4, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Joo Byung Chai, Yu Sung Jung, Jong Beom Kim, Chang Sull Kim, Eun Seon Park, Tae Young Jeon, Young Min Kim
  • Patent number: 11217543
    Abstract: An antenna module includes a fan-out semiconductor package including an IC, an encapsulant encapsulating at least a portion of the IC, a core member having a first side surface facing the IC or the encapsulant, and a connection member including at least one wiring layer electrically connected to the IC and the core member and at least one insulating layer; and an antenna package including a plurality of first directional antenna members configured to transmit or receive a first RF signal. The fan-out semiconductor package further includes at least one second directional antenna member disposed on a second side surface of the core member opposing the first side surface of the core member, stood up from a position electrically connected to at least one wiring layer, and configured to transmit or receive a second RF signal.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: January 4, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Doo Il Kim, Yong Ho Baek, Jin Seon Park, Young Sik Hur
  • Patent number: 11196042
    Abstract: The present invention relates to a method for preparing silicon-based active material particles for a secondary battery and silicon-based active material particles. The method for preparing silicon-based active material particles according to an embodiment of the present invention comprises the steps of: providing silicon powder; dispersing the silicon powder into an oxidant solvent to provide a mixture prior to grinding; fine-graining the silicon powder by applying mechanical compression and shear stress to the silicon powder in the mixture prior to grinding to produce silicon particles; producing a layer of chemical oxidation on the fine-grained silicon particles with the oxidant solvent while applying mechanical compression and shear stress to produce silicon-based active material particles; and drying the resulting product comprising the silicon-based active material particles to yield silicon-based active material particles.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: December 7, 2021
    Inventors: Young Tai Cho, Yong Gil Choi, Seung Chul Park, Seon Park, Hee Young Seo, Jee Hye Park, Yong Eui Lee, Chul Hwan Kim
  • Publication number: 20210371876
    Abstract: A Thy1 gene promoter specifically expressed in neurons and a recombinant vector including the Thy1 gene promoter are provided. The Thy1 gene promoter may be utilized to regulate an expression of a target gene in preparation of an animal model similar to a human.
    Type: Application
    Filed: August 15, 2021
    Publication date: December 2, 2021
    Applicant: Jeju National University Industry-Academic Cooperation Foundation
    Inventors: Se Pill PARK, Young Sok CHOI, Ok Hee LEE, Mi Seon PARK, Young Ho KIM, Eun Young KIM, Seung Eun LEE
  • Patent number: 11183765
    Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: November 23, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hak Gu Kim, Ho Kyung Kang, Seong Jong Cheon, Young Sik Hur, Jin Seon Park, Yong Duk Lee
  • Patent number: 11177449
    Abstract: Provided are P-type semiconductor layer, P-type multilevel element, and manufacturing method for the element. The P-type multilevel element comprises a gate electrode, an active structure overlapping the gate electrode, a gate insulating layer disposed between the gate electrode and the active structure, and source and drain electrodes electrically connected to both ends of the active structure, respectively. The active structure has a first P-type active layer, a second P-type active layer, and a barrier layer disposed between the first P-type active layer and the second P-type active layer. A threshold voltage for forming a channel in the first P-type active layer and a threshold voltage for forming a channel in the second P-type active layer have different values.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: November 16, 2021
    Assignee: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY
    Inventors: Myung Mo Sung, Jin Seon Park, Hongbum Kim, Hongro Yun
  • Patent number: 11177551
    Abstract: An antenna module includes: an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having at least one semiconductor chip embedded therein; and an electronic component disposed on the lower surface or a side surface of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The electronic component has a thickness greater than that of the semiconductor chip.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: November 16, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Won Wook So, Jin Seon Park, Young Sik Hur, Jung Chul Gong, Yong Ho Baek
  • Patent number: 11171332
    Abstract: The present invention relates to a method for producing silicon-based active material particles for a secondary battery and silicon-based active material particles. A method for producing silicon-based active material particles for a secondary battery according to an embodiment of the present invention may comprise: a step of providing silicon powder; a step of providing a pre-pulverization mixture in which the silicon powder is dispersed in a solvent for dispersion comprising an antioxidant; a step of applying mechanical compression and shear stress to the silicon powder of the pre-pulverization mixture to refine the silicon powder, thereby forming silicon particles having an oxygen content controlled by the antioxidant; and a step of drying the resulting material comprising the silicon particles to obtain silicon-based active material particles.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: November 9, 2021
    Assignee: Nexeon Ltd.
    Inventors: Seung Chul Park, Eui Joon Song, Min Young Cheong, Jong Hun Lee, Young Tai Cho, Yong Gil Choi, Seon Park, Sung Hwan Kang, Hee Young Seo, Jee Hye Park, Tae Jin Yang
  • Patent number: 11167347
    Abstract: A material feeding apparatus is disclosed. An apparatus for removing a surface oxide of a metal material and feeding the metal material to a melting furnace, according to an embodiment of the present disclosure, includes: a housing including a material dropping chamber for feeding and discharging the metal material and a material etching chamber for performing a plasma etching process; and a pretreatment casing configured to reciprocate between the material dropping chamber and the material etching chamber in the housing, wherein the pretreatment casing receives the metal material from the material dropping chamber to store the metal material, moves to the material etching chamber to plasma-etch a surface oxide layer of the stored metal material, and then returns to the material dropping chamber to drop the etched metal material into the melting furnace.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: November 9, 2021
    Assignee: POSCO
    Inventors: Seung Ho Lim, Goo Hwa Kim, Kyung Hoon Nam, Yeong Seon Park