Patents by Inventor In-seon Park

In-seon Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210316196
    Abstract: The present invention relates to an anti-slice golf tee and, more specifically, is a technology relating to an anti-slice golf tee, which supports a golf ball while surrounding a part of the golf ball, thereby suppressing the rotation force of the golf ball during a tee shot to prevent slicing of the golf ball and allowing an impact point to be concentrated on the center portion of the golf ball. That is, the present invention relates to an anti-slice golf tee comprising: a head part shaped to surround one side of a golf ball; a support part connected to the head part and formed to be perpendicularly fixable on the ground; an insertion groove concavely formed at the inner center portion of the head part; and a hitting member separately inserted in the insertion groove so as to allow an impact point to be concentrated on the center portion of the head part, wherein the hitting member has a space formed therein.
    Type: Application
    Filed: July 31, 2019
    Publication date: October 14, 2021
    Inventor: Yun Seon PARK
  • Patent number: 11133592
    Abstract: A radio frequency module is provided. The module includes a core member, a front-end integrated circuit (FEIC), a first connection member, a second connection member disposed on an upper surface of the core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the second connection member, and configured to input or output a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, through a wiring layer, a substrate disposed on a lower surface of the first connection member; and an electrical connection structure configured to electrically connect the first connection member and the substrate. The FEIC is configured to input or output the first RF signal and a second RF signal which has a power different from a power of the first RF signal.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: September 28, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ho Kyung Kang, Seong Jong Cheon, Hak Gu Kim, Young Sik Hur, Jin Seon Park, Yong Duk Lee
  • Publication number: 20210290118
    Abstract: An apparatus for controlling operations of a continuous glucose monitoring system. When a continuous glucose monitoring system is located within a certain distance from a user terminal, power of a battery is supplied to the continuous glucose monitoring system through a power switch switched on by an enable signal generated by a near field communication module, thereby operating the continuous glucose monitoring system without user intervention. The near field communication module provides connection information to the user terminal, thereby automatically performing a pairing connection with the user terminal using the near field communication module and a bluetooth communication module. When the pairing connection with the user terminal is completed, an enable signal generated by the bluetooth communication module is provided to the power switch, thereby maintaining the pairing connection with the user terminal even when the user terminal is outside of range for near field communication.
    Type: Application
    Filed: June 21, 2019
    Publication date: September 23, 2021
    Inventors: Jin Won LEE, Choong Beom YOU, Hyo Seon PARK, Ha Na LEE
  • Patent number: 11118191
    Abstract: A Thy1 gene promoter specifically expressed in neurons and a recombinant vector including the Thy1 gene promoter are provided. The Thy1 gene promoter may be utilized to regulate an expression of a target gene in preparation of an animal model similar to a human.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: September 14, 2021
    Assignee: Jeju National University Industry-Academic Cooperation Foundation
    Inventors: Se Pill Park, Young Sok Choi, Ok Hee Lee, Mi Seon Park, Young Ho Kim, Eun Young Kim, Seung Eun Lee
  • Patent number: 11111118
    Abstract: Disclosed is a vehicle jack device. The vehicle jack device according to an exemplary embodiment of the present invention includes: a base portion in which an inserting hole into which a hinge shaft is inserted is formed and which is supported on a bottom side; a pair of lower arms of which a first portion is installed in the hinge shaft of the base portion in a rotatable way and in which a reinforcing rib is formed in a lengthwise direction; a pair of upper arms respectively installed in a second portion of the lower arm, and on which a reinforcing rib is formed in a lengthwise direction; a bracket member for fixing a first portion of the upper arm in a rotatable way; and a driver installed between the lower arm and the upper arm and providing a tucking driving force to the lower arm and the upper arm.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: September 7, 2021
    Assignees: LG CHEM, LTD., TAE JUNG TECHNICAL MFG CO., LTD.
    Inventors: Dong Kyu Lim, Tai-Soo Shin, Sun Woo Kim, Se Jung Lee, Ji Eun Im, Ilhwan Sa, Woosuk Choi, Ho Seon Park, Ku Hee Anh
  • Patent number: 11104789
    Abstract: The present invention relates to a method for preparing a graft copolymer, which includes polymerizing a first conjugated diene-based polymer, a second conjugated diene-based polymer, an aromatic vinyl-based monomer and a vinyl cyan-based monomer, wherein particle size distribution of the first conjugated diene-based polymer is 0.346 to 0.404, and particle size distribution of the second conjugated diene-based polymer is 0.196 to 0.304, a graft copolymer and a thermoplastic resin molded article.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: August 31, 2021
    Assignee: LG Chem, Ltd.
    Inventors: Jong Beom Kim, Joo Byung Chai, Yu Sung Jung, Chang Sull Kim, Eun Seon Park, Tae Young Jeon, Young Min Kim
  • Patent number: 11101840
    Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: August 24, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hak Gu Kim, Ho Kyung Kang, Seong Jong Cheon, Young Sik Hur, Jin Seon Park, Yong Duk Lee
  • Patent number: 11095037
    Abstract: An antenna module includes: a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) disposed on a first surface of the connection member and electrically connected to the at least one wiring layer; an antenna package including antenna members configured to transmit or receive a radio frequency (RF) signal, a feed vias each having one end electrically connected to a respective one of the antenna members and another end electrically connected to the at least one wiring layer, and a dielectric layer having a height greater than a height of the at least one insulating layer, and having a first surface facing a second surface of the connection member; and dielectric members disposed in positions corresponding to the antenna members on the second surface of the antenna package.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: August 17, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Doo Il Kim, Yong Ho Baek, Jin Seon Park, Young Sik Hur
  • Publication number: 20210247862
    Abstract: A touch sensing unit includes a first touch electrode disposed in a touch sensor area. A second touch electrode is disposed in the touch sensor area. A first touch line is disposed in a touch peripheral area. The first touch line is electrically connected to the first touch electrode. The touch peripheral area is disposed on a periphery of the touch sensor area. A second touch line is disposed in the touch peripheral area. The second touch line is electrically connected to the second touch electrode. The touch peripheral area includes first and second regions. In the first region, a width of the first touch line is smaller than a width of the second touch line. In the second region, the width of the first touch line is equal to the width of the second touch line.
    Type: Application
    Filed: April 19, 2021
    Publication date: August 12, 2021
    Inventors: HWAN HEE JEONG, Kl CHEOL KIM, JONG SEON PARK
  • Publication number: 20210242595
    Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
    Type: Application
    Filed: June 3, 2020
    Publication date: August 5, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hak Gu KIM, Ho Kyung KANG, Seong Jong CHEON, Young Sik HUR, Jin Seon PARK, Yong Duk LEE
  • Publication number: 20210242594
    Abstract: A radio frequency module is provided. The module includes a core member, a front-end integrated circuit (FEIC), a first connection member, a second connection member disposed on an upper surface of the core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the second connection member, and configured to input or output a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, through a wiring layer, a substrate disposed on a lower surface of the first connection member; and an electrical connection structure configured to electrically connect the first connection member and the substrate. The FEIC is configured to input or output the first RF signal and a second RF signal which has a power different from a power of the first RF signal.
    Type: Application
    Filed: June 3, 2020
    Publication date: August 5, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ho Kyung KANG, Seong Jong CHEON, Hak Gu KIM, Young Sik HUR, Jin Seon PARK, Yong Duk LEE
  • Publication number: 20210238738
    Abstract: A layer forming method according to one embodiment of the present invention contains a source gas dosing/pressurizing step of dosing a source gas into a chamber having a substrate loaded therein in a state in which the outlet of the chamber is closed, thereby increasing the pressure in the chamber and adsorbing the source gas onto the substrate; a first main purging step of purging the chamber, after the source gas dosing/pressurizing step; a reactive gas dosing step of dosing a reactive gas into the chamber, after the first main purging step; and a second main purging step of purging the chamber, after the reactive gas dosing step.
    Type: Application
    Filed: April 20, 2021
    Publication date: August 5, 2021
    Applicant: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANGUNIVERSITY)
    Inventors: Myung Mo SUNG, Jinwon JUNG, Jin Seon PARK
  • Publication number: 20210242896
    Abstract: A chip radio frequency package includes a substrate including a first cavity, first and second connection members, a core member, a radio frequency integrated circuit (RFIC) disposed on an upper surface of the substrate, and a first front-end integrated circuit (FEIC) disposed in the first cavity. The core member includes a core insulating layer and a core via that penetrates the core insulating layer. The first connection member has a structure in which a first insulating layer and a first wiring layer are stacked. The second connection member has a second structure in which a second insulating layer and a second wiring layer are stacked. The RFIC inputs or outputs a base signal and a first radio frequency (RF) signal having a frequency higher than a frequency of the base signal, and the first FEIC inputs or outputs the first RF signal and a second RF signal.
    Type: Application
    Filed: August 17, 2020
    Publication date: August 5, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hak Gu KIM, Ho Kyung KANG, Seong Jong CHEON, Young Sik HUR, Jin Seon PARK, Yong Duk LEE
  • Patent number: 11066542
    Abstract: The present invention relates to a method of preparing a thermoplastic resin, a method of preparing a thermoplastic resin composition including the same, and a method of manufacturing an injection-molded article using the thermoplastic resin composition. By using a mixture of molecular weight modifiers having different reactivities according to the present invention, coagulation may be performed using a small amount of coagulant, productivity may be increased, and a molded article, which is manufactured using a thermoplastic resin, having excellent appearance characteristics along with superior mechanical strength, processability, or the like may be provided.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: July 20, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Jong Beom Kim, Joo Byung Chai, Yu Sung Jung, Chang Sull Kim, Eun Seon Park, Tae Young Jeon, Young Min Kim
  • Publication number: 20210181050
    Abstract: A pressure sensing device includes a pressure signal receiver configured to receive an analog pressure signal from a pressure sensor, a converter configured to convert the analog pressure signal to a digital pressure signal, and a processor configured to convert a pressure value of the digital pressure signal to a bit value corresponding to the pressure value and output the bit value. The processor is configured to convert the pressure value to a first bit value by a first bit resolution in response to the pressure value being included in a first pressure interval, and convert the pressure value to a second bit value by a second bit resolution in response to the pressure value being included in a second pressure interval. The second pressure interval is a pressure interval greater than the first pressure interval, and the first bit resolution is greater than the second bit resolution.
    Type: Application
    Filed: December 11, 2020
    Publication date: June 17, 2021
    Applicant: Tyco Electronics AMP Korea Co. Ltd.
    Inventors: Hyung Jin Kim, Eul-Chul Byeon, Yong Seon Park
  • Publication number: 20210169134
    Abstract: A flavouring component for a smoking article comprising a rod of flavouring material. The flavouring material comprises a carrier material and flavouring particles adhered to to the carrier material by means of a binder. The flavouring material is formed by passing the carrier material through a mixture comprising the binder and the flavouring particles. Also disclosed is a smoking article including such a flavouring component, and an apparatus and method for manufacturing such a flavouring component.
    Type: Application
    Filed: February 11, 2021
    Publication date: June 10, 2021
    Inventors: Gary FALLON, Kie Seon PARK
  • Publication number: 20210163736
    Abstract: The present invention relates to a thermoplastic resin. More particularly, the present invention relates to a thermoplastic resin that is a graft copolymer having a seed-shell structure and includes a bimodal seed including a large-diameter rubbery polymer having an average particle diameter of greater than 2,000 ? and 3,500 ? or less and a small-diameter rubbery polymer having an average particle diameter of 500 ? to 2,000 ?; and an aromatic vinyl-vinyl cyan shell, wherein the aromatic vinyl cyan compound is included in an amount of 5% by weight to 28% by weight based on a total weight of the aromatic vinyl-vinyl cyan shell. In accordance with the present invention, a thermoplastic resin having a composition capable of improving graft density, and a thermoplastic resin composition capable of increasing dispersion and having high gloss due to inclusion of the thermoplastic resin are provided.
    Type: Application
    Filed: August 2, 2017
    Publication date: June 3, 2021
    Inventors: Joo Byung CHAI, Tae Young JEON, Yu Sung JUNG, Jong Beom KIM, Chang Sull KIM, Eun Seon PARK, Young Min KIM
  • Publication number: 20210168293
    Abstract: Disclosed are an information processing method and information processing apparatus which execute an installed artificial intelligence (AI) algorithm and/or machine learning algorithm to process a spoken utterance of a user in a 5G communication environment. The information processing method according to an embodiment of the present disclosure may include receiving a spoken utterance of a user and extracting, from the spoken utterance, a demonstrative pronoun referring to a target indicated by the user, determining an image capture region to be scanned by a camera according to the type of the demonstrative pronoun, recognizing the target indicated by the user from a result of scanning the image capture region, and feeding back a result of processing the spoken utterance to the user on the basis of a result of recognizing the target indicated by the user.
    Type: Application
    Filed: February 11, 2020
    Publication date: June 3, 2021
    Applicant: LG ELECTRONICS INC.
    Inventors: In Jung YANG, Mi Seon PARK, Ji-Won KIM
  • Patent number: 11015243
    Abstract: A layer forming method according to one embodiment of the present invention comprises: a source gas dosing/pressurizing step of dosing a source gas into a chamber having a substrate loaded therein in a state in which the outlet of the chamber is closed, thereby increasing the pressure in the chamber and adsorbing the source gas onto the substrate; a first main purging step of purging the chamber, after the source gas dosing/pressurizing step; a reactive gas dosing step of dosing a reactive gas into the chamber, after the first main purging step; and a second main purging step of purging the chamber, after the reactive gas dosing step.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: May 25, 2021
    Assignee: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Myung Mo Sung, Jinwon Jung, Jin Seon Park
  • Patent number: 10991831
    Abstract: A layer according to one embodiment of the present invention may exhibit a first number of electron states in a low-level electron energy range in a conduction band, and exhibit a second number of electron states in a high-level electron energy range higher than the low-level electron energy level in the conduction band, wherein localized states may exist between the low-level electron energy range and the high-level electron energy level.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: April 27, 2021
    Assignee: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Myung Mo Sung, Jinwon Jung, Hongbum Kim, Jin Seon Park