Patents by Inventor In Suk Jeong

In Suk Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210247965
    Abstract: A random number generation method and random number generator using a ZnS scintillator. The random number generator includes: a radioisotope emission layer emitting an alpha particle or a beta particle that is emitted when an atomic nucleus decays; a polymer layer disposed under the radioisotope emission layer; an inorganic scintillator layer disposed between the radioisotope emission layer and the polymer layer and applied with an inorganic scintillator substance; and a wafer layer disposed under the polymer layer and including a photodiode detecting light produced from the inorganic scintillator layer.
    Type: Application
    Filed: November 19, 2018
    Publication date: August 12, 2021
    Applicant: EYL INC.
    Inventors: Bu Suk JEONG, Dae Hyun NAM, Jung Hyun BAIK, Seong Joon CHO, Jun Ha JIN
  • Patent number: 11087768
    Abstract: The present disclosure provides a method for providing a personalized voice recognition service using an artificial intelligence automatic speaker identification method and a service providing server used therein. The present disclosure is implemented through processes of, by a service providing server, receiving a service provision request message including a voice of a speaker from a user terminal, analyzing the voice included in the service provision request message to identify the speaker of the voice, generating a control command needed to provide a customized service for the speaker based on speaker identification information, and transmitting the generated control command to an external electronic device.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: August 10, 2021
    Assignee: POWERVOICE CO., LTD.
    Inventors: Hee-suk Jeong, Hyung Yup Lee, Se Hun Chin, Hyung Taek Lim
  • Publication number: 20210209216
    Abstract: A pattern authentication method for preventing a smudge and a shoulder surfing attack. The pattern authentication method includes: a pattern registration step; and a pattern authentication step, in which the pattern registration step includes: a step of receiving a pattern from a user by an input unit of a pattern authentication device; a step of matching and storing a code value corresponding to the pattern input from the user by a matching unit; and a step of generating a user KDI (Key Derivation ID) by matching the code value to a quantum random number generated by a quantum random number generator by a KDI generator.
    Type: Application
    Filed: March 27, 2019
    Publication date: July 8, 2021
    Applicant: EYL INC.
    Inventors: Jung Hyun BAIK, Seong Joon CHO, Bu Suk JEONG, Dae Hyun NAM, Kang Won SUH
  • Publication number: 20210175140
    Abstract: In one example, a semiconductor device, comprising a substrate having a top side and a bottom side, an electronic device on the top side of the substrate, a first encapsulant on the top side of the substrate contacting a side of the electronic device, a second encapsulant on the bottom side of the substrate, wherein the second encapsulant includes an undercut at an end of the second encapsulant, and a cover layer comprising a top cover on a top side of the first encapsulant and a side cover on a side of the first encapsulant and a side of the substrate, wherein the side cover extends adjacent to the undercut. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: December 4, 2019
    Publication date: June 10, 2021
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Suk Jeong, Min Jae Kong, Hyun Hye Jung
  • Publication number: 20210166881
    Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a plurality of first and second internal electrodes disposed inside the ceramic body, exposed to the first and second surfaces, and having ends exposed to the third or fourth surface, and a first side margin portion and a second side margin portion disposed on side portions of the plurality of first and second internal electrodes exposed to the first and second surfaces. A ratio Db/Da satisfies 1.00 to 1.07, inclusive, where ‘Db’ is a distance, in a stacking direction of the dielectric layer, between both end points of respective edge regions of the first side margin portion and the second side margin portion, and ‘Da’ is a distance in a central region of the ceramic body in the stacking direction.
    Type: Application
    Filed: May 19, 2020
    Publication date: June 3, 2021
    Inventors: Dong Hun KIM, Hyun Min LEE, Jong Suk JEONG, Dong Geon YOO, Ji Hyun LEE, Seok Hyun YOON
  • Publication number: 20210124617
    Abstract: An edge computing method for flexibly allocating a computing resource includes receiving an edge module and a container resource allocation value, generating a container based on the container resource allocation value and arranging the edge module in the generated container. The edge module is distributed to an edge computing device to perform a predetermined data processing. The container is a software component of the edge computing device providing an isolated computing environment for driving the edge module. The edge computing device is installed on-premise. The edge computing device can flexibly adjust available computing resources according to the current working situation and a resource requirement. In response to an environment, in which data traffic is flexible according to time or situation, such as a manufacturing plant, allocated resources of the edge computing device can be quickly adjusted, thereby a stable service can be provided.
    Type: Application
    Filed: October 28, 2019
    Publication date: April 29, 2021
    Inventors: Hyo Keun CHOI, Kyu Yull YI, Jin Seon LEE, Su Hyun KIM, Suk Jeong LEE
  • Publication number: 20210126846
    Abstract: An edge computing device controlling method includes executing some function modules of a plurality of function modules for processing a service request from a user device on a first edge computing device of a plurality of edge computing devices and additionally executing the some function modules on a second edge computing device of the plurality of edge computing devices when additional resource is required for the some function modules.
    Type: Application
    Filed: October 28, 2019
    Publication date: April 29, 2021
    Inventors: Kyu Yull YI, Jin Seon LEE, Hyo Keun CHOI, Suk Jeong LEE, Su Hyun KIM
  • Patent number: 10978235
    Abstract: An inductor includes a body including a coil and an encapsulant and an external electrode on an outer surface of the body. The encapsulant includes a first core surrounding the coil and a second core surrounding the first core. The first core includes a magnetic powder having high current characteristics, and the second core includes a magnetic powder having high capacity characteristics.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: April 13, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Suk Jeong, Han Wool Ryu, Seong Jae Lee, Sang Kyun Kwon, Chang Hak Choi
  • Patent number: 10907229
    Abstract: A hot-work mold steel includes 0.37 to 0.46 wt % of carbon (C), 0.25 to 0.5 wt % of silicon (Si), 0.36 to 0.56 wt % of manganese (Mn), 2.0 to 5.0 wt % of chromium (Cr), 1.4 to 2.6 wt % of molybdenum (Mo), 0.4 to 0.8 wt % of vanadium (V), 0.0007 to 0.004 wt % of boron (B), 0.002 to 0.022 wt % of aluminum (Al), 0.001 to 0.09 wt % of titanium (Ti) and the remainder of iron (Fe) and inevitable impurities. The hot-work mold steel exhibits superior thermal conductivity, hardenability, durability, and nitriding characteristics, and increased resistance to heat check and melt-out. A die-casting mold made of the steel has improved thermal conductivity regardless of mold size and a prolonged life cycle and can improve the surface quality in manufactured parts.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: February 2, 2021
    Assignee: Doosan Heavy Industries Construction Co., Ltd
    Inventors: Kuk Cheol Kim, Byoung Koo Kim, Jeong Wook Kim, Jae Suk Jeong
  • Patent number: 10707012
    Abstract: A chip electronic component includes a magnetic body including magnetic metal powder particles, an internal coil unit embedded in the magnetic body, and a cover unit disposed on at least one of upper and lower surfaces of the magnetic body and including a magnetic metal plate. The magnetic metal plate is cracked and includes a plurality of metal fragments.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: July 7, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Suk Jeong, Kang Heon Hur, Seong Jae Lee, Jung Wook Seo, Hiroyuki Matsumoto, Chul Min Sim, Jong Sik Yoon
  • Publication number: 20200181724
    Abstract: A hot-work mold steel includes 0.37 to 0.46 wt % of carbon (C), 0.25 to 0.5 wt % of silicon (Si), 0.36 to 0.56 wt % of manganese (Mn), 2.0 to 5.0 wt % of chromium (Cr), 1.4 to 2.6 wt % of molybdenum (Mo), 0.4 to 0.8 wt % of vanadium (V), 0.0007 to 0.004 wt % of boron (B), 0.002 to 0.022 wt % of aluminum (Al), 0.001 to 0.09 wt % of titanium (Ti) and the remainder of iron (Fe) and inevitable impurities. The hot-work mold steel exhibits superior thermal conductivity, hardenability, durability, and nitriding characteristics, and increased resistance to heat check and melt-out. A die-casting mold made of the steel has improved thermal o conductivity regardless of mold size and a prolonged life cycle and can improve the surface quality in manufactured parts.
    Type: Application
    Filed: January 9, 2020
    Publication date: June 11, 2020
    Inventors: Kuk Cheol KIM, Byoung Koo KIM, Jeong Wook KIM, Jae Suk JEONG
  • Publication number: 20200126929
    Abstract: A method for forming a semiconductor device with an electromagnetic interference shield is disclosed and may include coupling a semiconductor die to a first surface of a substrate, encapsulating the semiconductor die and portions of the substrate using an encapsulant, placing the encapsulated substrate and semiconductor die on an adhesive tape, and forming an electromagnetic interference (EMI) shield layer on the encapsulant, on side surfaces of the substrate, and on portions of the adhesive tape adjacent to the encapsulated substrate and semiconductor die. The adhesive tape may be peeled away from the encapsulated substrate and semiconductor die, thereby leaving portions of the EMI shield layer on the encapsulant and on the side surfaces of the substrate with other portions of the EMI shield layer remaining on portions of the adhesive tape. Contacts may be formed on a second surface of the substrate opposite to the first surface of the substrate.
    Type: Application
    Filed: September 26, 2019
    Publication date: April 23, 2020
    Applicant: Amkor Technology, Inc.
    Inventors: Jin Suk Jeong, Kyeong Sool Seong, Kye Ryung Kim, Young Ik Kwon, Ki Dong Sim
  • Patent number: 10563277
    Abstract: A hot-work mold steel includes 0.37 to 0.46 wt % of carbon (C), 0.25 to 0.5 wt % of silicon (Si), 0.36 to 0.56 wt % of manganese (Mn), 2.0 to 5.0 wt % of chromium (Cr), 1.4 to 2.6 wt % of molybdenum (Mo), 0.4 to 0.8 wt % of vanadium (V), 0.0007 to 0.004 wt % of boron (B), 0.002 to 0.022 wt % of aluminum (Al), 0.001 to 0.09 wt % of titanium (Ti) and the remainder of iron (Fe) and inevitable impurities. The hot-work mold steel exhibits superior thermal conductivity, hardenability, durability, and nitriding characteristics, and increased resistance to heat check and melt-out. A die-casting mold made of the steel has improved thermal conductivity regardless of mold size and a prolonged life cycle and can improve the surface quality in manufactured parts.
    Type: Grant
    Filed: May 28, 2018
    Date of Patent: February 18, 2020
    Assignee: Doosan Heavy Industries Construction Co., Ltd
    Inventors: Kuk Cheol Kim, Byoung Koo Kim, Jeong Wook Kim, Jae Suk Jeong
  • Publication number: 20190378518
    Abstract: The present disclosure provides a method for providing a personalized voice recognition service using an artificial intelligence automatic speaker identification method and a service providing server used therein. The present disclosure is implemented through processes of, by a service providing server, receiving a service provision request message including a voice of a speaker from a user terminal, analyzing the voice included in the service provision request message to identify the speaker of the voice, generating a control command needed to provide a customized service for the speaker based on speaker identification information, and transmitting the generated control command to an external electronic device.
    Type: Application
    Filed: April 7, 2017
    Publication date: December 12, 2019
    Inventors: Hee-suk JEONG, Hyung Yup LEE, Se Hun CHIN, Hyung Taek LIM
  • Publication number: 20190300976
    Abstract: A hot-work mold steel includes 0.37 to 0.46 wt % of carbon (C), 0.25 to 0.5 wt % of silicon (Si), 0.36 to 0.56 wt % of manganese (Mn), 2.0 to 5.0 wt % of chromium (Cr), 1.4 to 2.6 wt % of molybdenum (Mo), 0.4 to 0.8 wt % of vanadium (V), 0.0007 to 0.004 wt % of boron (B), 0.002 to 0.022 wt % of aluminum (Al), 0.001 to 0.09 wt % of titanium (Ti) and the remainder of iron (Fe) and inevitable impurities. The hot-work mold steel exhibits superior thermal conductivity, hardenability, durability, and nitriding characteristics, and increased resistance to heat check and melt-out. A die-casting mold made of the steel has improved thermal conductivity regardless of mold size and a prolonged life cycle and can improve the surface quality in manufactured parts.
    Type: Application
    Filed: May 28, 2018
    Publication date: October 3, 2019
    Inventors: Kuk Cheol Kim, Byoung Koo Kim, Jeong Wook Kim, Jae Suk Jeong
  • Patent number: 10361847
    Abstract: Provided is a quantum random pulse generator having enhanced security using a phenomenon in which a radioactive isotope naturally collapses. The quantum random pulse generator includes a photodiode detection unit which has a photodiode disposed at the center of the photodiode detection unit on a top surface, a radioactive isotope emission unit which emits alpha particles discharged when an atomic nucleus naturally collapses toward a photodiode, and a plate which is disposed on a top surface of the radioactive isotope emission unit and supports the radioactive isotope emission unit. The alpha particles discharged by the emission unit come into contact with the photodiode to generate a random pulse.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: July 23, 2019
    Assignee: EYL INC.
    Inventors: Jung Hyun Baik, Seong Joon Cho, Bu Suk Jeong, Dae Hyun Nam
  • Publication number: 20190221351
    Abstract: An inductor includes a body including a coil and an encapsulant and an external electrode on an outer surface of the body. The encapsulant includes a first core surrounding the coil and a second core surrounding the first core. The first core includes a magnetic powder having high current characteristics, and the second core includes a magnetic powder having high capacity characteristics.
    Type: Application
    Filed: August 10, 2018
    Publication date: July 18, 2019
    Inventors: Jong Suk JEONG, Han Wool RYU, Seong Jae LEE, Sang Kyun KWON, Chang Hak CHOI
  • Patent number: 10296905
    Abstract: Provided is a settlement authentication method and system using a quantum random number generator. The method includes the steps of requesting, by a mobile terminal, a random number from a bank server and a POS terminal each including a quantum random number generator, periodically receiving a first quantum random number generated by the POS terminal and a second quantum random number generated by the bank server, and simultaneously sending a first quantum random number most recently received from the POS terminal to the bank server and a second quantum random number most recently received from the bank server to the POS terminal when the mobile terminal requests settlement.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: May 21, 2019
    Assignee: EYL INC.
    Inventors: Jung Hyun Baik, Seong Joon Cho, Bu Suk Jeong, Dae Hyun Nam
  • Patent number: 10289378
    Abstract: Disclosed are a device and a method for outputting a sound wave for content synchronization between devices and operation control of an external device, and the external device. The device for outputting a sound wave according to one embodiment of the present invention includes: a storage unit configured to store content data of content; a playing unit configured to play the content data; and an output unit configured to output a sound wave as a result of the playing of the content data, wherein the sound wave allows an external device to initiate an operation associated with the content.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: May 14, 2019
    Assignee: POWERVOICE CO., LTD.
    Inventors: Hee Suk Jeong, Se Hun Chin, Hyung Yup Lee
  • Publication number: 20190118373
    Abstract: The parallel robotics system is disclosed. The parallel robotics system includes a base, a plurality of first active joints each moving independently from each other in a first direction in the base, a plurality of second active joints connected to the first active joints, respectively, and each moving independently from each other in a second direction perpendicular to the first direction, and a truss structure connected to the plurality of second active joints and moving depending on a movement of each of the plurality of first active joints and a movement of each of the plurality of second active joints.
    Type: Application
    Filed: August 13, 2018
    Publication date: April 25, 2019
    Inventors: Won Suk JEONG, Chang Uk KANG, Jin Hun KIM