Abstract: A method for detecting a particular syndrome based on hemodynamic analysis that includes steps of: obtaining a piece of hemodynamic data representing a hemodynamic waveform; performing moving average (MA) filtering on the hemodynamic waveform to obtain a filtered waveform; determining troughs in order to determine waveform segments of the filtered waveform; determining smoothness of the waveform segments; and determining a relation between the hemodynamic waveform and a particular syndrome based on the smoothness of the waveform segments, and generating a detection result.

Abstract: The present disclosure relates to methods of manufacturing at least a portion of a magnetic layer of a magnetic recording disk. The methods include forming a plurality of sacrificial, discrete structures via imprint lithography. The sacrificial, discrete structures are used to form a plurality of three-dimensional segregant structures in a magnetic layer of the magnetic recording disk. The present disclosure also relates to corresponding magnetic recording disks.

Abstract: A method for detecting a particular syndrome based on hemodynamic analysis that includes steps of: obtaining a piece of hemodynamic data representing a hemodynamic waveform; performing moving average (MA) filtering on the hemodynamic waveform to obtain a filtered waveform; determining troughs in order to determine waveform segments of the filtered waveform; determining systolic peaks for determining first and second portions of the waveform segments; determining smoothness of the second portions; and determining a relation between the hemodynamic waveform and a particular syndrome based on the smoothness of the second portions, and generating a detection result.

Abstract: The present disclosure relates to magnetic recording disks having a magnetic recording layer that includes a plurality of three-dimensional segregant structures. Each three-dimensional segregant structure extends from a first radius of the recording disk to a second radius of the recording disk, and each three-dimensional segregant structure is made of a first segregant material. The magnetic recording layer also includes a plurality of magnetic grains between adjacent three-dimensional segregant structures, and a second segregant material between adjacent magnetic grains. The present disclosure also relates to corresponding methods of manufacturing such a magnetic recording layer.

Abstract: Apparatus and methods relating to DNA sequencing are provided. In one embodiment, a DNA sequencing device includes a nanochannel having a width that is approximately 0.3 nm to approximately 20 nm. A pair of electrodes having portions exposed to the nanochannel may form a tunneling current electrode (TCE) with an electrode gap of approximately 0.1 nm to approximately 2 nm, and more particularly about 0.3 nm to about 1 nm. In one embodiment, at least one of the pair of electrodes is formed as a suspended electrode. An actuator may be associated with the suspended electrode to displace it relative to the other electrode. In various embodiments, the nanochannel and/or the electrodes may be formed using thermal reflow processes to reduce the size of such features.

Abstract: Provided are apparatuses, a non-transitory computer-readable medium or media, and methods for supporting reading of a fundus image of a subject. In certain aspects, disclosed a method including the steps of: extracting a first feature information from a first fundus image of the subject based on a machine learning model; generating a second fundus image having a second feature information by mapping an adversarial factor to the first fundus image so that the first feature information is changed; and displaying the first fundus image having the first feature information and the second fundus image having the second feature information on a display device.

Abstract: A photosensitive resin composition and a display device including the same are provided.

Abstract: A first wafer has a first stop layer deposited on a substrate, the substrate used to form a base support structure. A second wafer has a second stop layer deposited on a sacrificial substrate, and a filter layer deposited on the second stop layer. A rib layer is deposited on one of: the first stop layer of the first layer; or a third stop layer that is deposited over the filter layer. A rib pattern is formed in the rib layer. The first and second wafers are flip bonded such that the rib pattern is joined between the filter layer and the first stop layer. Elongated voids are formed within the filter layer. The base support structure is formed within the substrate of the first wafer such that there is a fluid flow path between the base support structure, the rib layer, and the elongated voids of the filter layer.

Abstract: An integrated circuit device may include an integrated circuit die coupled to a substrate, and a porous material on the die or a thermal interface material and extending beyond the edges of the die and over the substrate. An integrated circuit system may include a substrate with a power supply and an integrated circuit die, such that a porous material on the die extends over the substrate beyond a footprint of the die. A porous material may be formed on and beyond an edge of a received integrated circuit die coupled to a substrate or a thermal interface material on the die.

Abstract: An integrated circuit assembly may be formed comprising an electronic substrate, at least one integrated circuit device electrically attached to the electronic substrate, a heat dissipation device, a thermal interface material between the at least one integrated circuit device and the heat dissipation device, and a metal foam surrounding the at least one integrated circuit device and contacting the thermal interface material. The integrated circuit assembly may further include a stiffener attached to the electronic substrate and surrounding the at least one integrated circuit device, wherein the metal foam is disposed between the stiffener, the at least one integrated circuit device, the electronic substrate, and the heat dissipation device.

Abstract: Provided is a catalyst structure for electrochemical CO2 reduction. The catalyst structure includes carbon nanofibers doped with nitrogen (N), and copper (Cu) particles dispersed on the carbon nanofibers. At least portions of the carbon nanofibers at interfaces with the Cu particles may have a pyridinic-N structure.

Abstract: A DNA sequencing device, and related methods, include a nanopore or nanochannel structure, and a nanoelectrode. The nanoelectrode includes electrode members having free ends exposed within the nanopore or nanochannel structure, an electrode gap defined between of the free ends, and plated portions formed on the free ends to provide a reduced sized for the electrode gap.

Abstract: A display device includes a base layer, a first pixel transistor, a first gate line, a first data line electrically connected to the first pixel transistor, a first pixel electrode electrically connected to the first pixel transistor and overlapping the first data line in a plan view, and a porous layer. The porous layer is disposed between the first data line and the first pixel electrode and includes a matrix including a polymer resin and a plurality of void portions defined in the matrix. The display device is capable of displaying a sharp image because the porous layer alleviates or prevents a crosstalk between the first data line and the first pixel electrode.

Abstract: A method for detecting a location of a segment of a feeding tube is provided. The feeding tube has a proximal end, a hollow tube body and a distal end, and is placed inside the body of a patient. An audio collecting component is placed on a predetermined part of the patient. The method includes steps of pumping air into the proximal end of the feeding tube, collecting sound to obtain audio data by the audio collecting component, performing audio analysis on the audio data, and determining whether a segment of the hollow tube body is at a part inside the body of the patient that corresponds with the location of the audio collecting component based on result of the audio analysis.

Abstract: This application discloses a computing system to identify structures of an integrated circuit capable of being fabricated utilizing a lithographic mask described by mask layout data and to generate process windows for the identified structures based, at least in part, on the mask layout data and a failure definition for the identified structures. The computing system utilizes process windows for the identified structures to determine failure rates for the identified structures based on a distribution of the manufacturing parameters. The computing system determines frequency of occurrences for the identified structures from the mask layout data and generates a die yield metric for the integrated circuit by aggregating the failure rates for the identified structures based on the frequency of occurrences for the identified structures in the integrated circuit. These increases in yield of the integrated circuit allow manufacturers to produce more units per fixed processing cost of the wafer.

Abstract: A heat-assisted magnetic recording (HAMR) device is configured to write regions of neutral polarity on a magnetic media during a same pass of the recording head in which other regions are written of positive polarity and negative polarity. The various disclosed write techniques may facilitate creation of “zero state” (substantially net zero polarity) transition zones between each pair of data bits of opposite polarity and/or may facilitate the encoding of three different logical states (e.g., 1, 0, and ?1) on the media.

Abstract: A method of training a deep neural network for generating a cinemagraph is disclosed. The method may include preparing a foreground layer input by using an input video, preparing a background layer input by using the input video, providing a foreground layer output and a background layer output from the DNN by inputting, to the DNN, the foreground layer input and the background layer input, providing an output video by synthesizing the foreground layer output with the background layer output, and updating intrinsic parameters of the DNN a plurality of times, based on the input video, the foreground layer input, the foreground layer output, the background layer output, and the output video.

Abstract: In an embodiment, an apparatus is disclosed that includes a duty cycle controller. The duty cycle controller includes a tuning circuit comprising a first field-effect transistor. The first field-effect transistor is configured to implement a capacitor. The duty cycle controller further includes an edge delay circuit. The edge delay circuit includes a second field-effect transistor that, when activated by an input clock signal of the duty cycle controller, is configured to connect a voltage source to an output clock signal of the duty cycle controller. The edge delay circuit further includes a third field-effect transistor that, when activated, is configured to connect the first field-effect transistor of the tuning circuit to the output clock signal.

Abstract: Disclosed herein are an apparatus and method for apparatus for synchronizing consensus node information in a blockchain network. The apparatus for synchronizing consensus node information includes one or more processors, and execution memory for storing at least one program that is executed by the one or more processors, wherein the at least one program is configured to receive a committed message for block consensus from the blockchain network and verify nodes participating in the block consensus, set a block number required to participate in the block consensus to a block size of a start block of a section corresponding to the block consensus, and broadcast consensus node information including the block number to the blockchain network.

Abstract: An Integrated Circuit (IC) assembly, comprising an IC package coupled to a substrate, and a subassembly comprising a thermal interface layer. The thermal interface layer comprises a phase change material (PCM) over the IC package. At least one thermoelectric cooling (TEC) apparatus is thermally coupled to the thermal interface layer.