Abstract: A pressure detecting device includes a semiconductor substrate (30, 200, 300, 400) for outputting an electrical signal corresponding to an applied pressure received from a pressure transmitting member (20) having electrically conductive properties disposed on the front surface of the semiconductor substrate (30, 200, 300, 400). The substrate (30, 200, 300, 400) and the pressure transmitting member (20) are accommodated in a housing (10). A lead member (50) electrically independent of the housing (10) is accommodated in the housing (10) at the back surface side of the semiconductor substrate (30, 200, 300, 400), and the lead member (50) and an electrode (35b) of the substrate (30, 200, 300, 400) are electrically connected to each other through conductive adhesive material (40). The housing (10) preferably includes a first portion (101), a second portion (102) having smaller thermal conductivity than the first portion, and an electrically conductive partition portion (103).

Abstract: A pressure sensor includes a metal stem having a diaphragm, and a semiconductor substrate in which an insulation layer is inserted between first and second semiconductor layers. A plurality of strain gauges are formed on a predetermined area of the first semiconductor layer of the semiconductor substrate, for converting a bending of the diaphragm to an electrical signal. In the pressure sensor, the strain gauges have pattern shapes insulated and separated from each other by trenches extending from a surface of the first semiconductor layer to the insulation layer. Furthermore, the second semiconductor layer has a recess portion, which is recessed from a surface of the second semiconductor layer to the insulation layer and is provided at a position corresponding to the predetermined area. The diaphragm is inserted into the recess portion, and the insulation layer is attached to a surface of the diaphragm in the recess portion.

Abstract: A sensor includes a detector for detecting physical quantity, a membrane, and a stress relaxation area. A stress is expected to concentrate in the stress relaxation area in a case of manufacturing process of the sensor or a case of operating the sensor. The detector is disposed on the membrane except for the stress relaxation area.

Abstract: A pressure sensor includes a metal stem having a diaphragm, and a semiconductor substrate in which an insulation layer is inserted between first and second semiconductor layers. A plurality of strain gauges are formed on a predetermined area of the first semiconductor layer of the semiconductor substrate, for converting a bending of the diaphragm to an electrical signal. In the pressure sensor, the strain gauges have pattern shapes insulated and separated from each other by trenches extending from a surface of the first semiconductor layer to the insulation layer. Furthermore, the second semiconductor layer has a recess portion, which is recessed from a surface of the second semiconductor layer to the insulation layer and is provided at a position corresponding to the predetermined area. The diaphragm is inserted into the recess portion, and the insulation layer is attached to a surface of the diaphragm in the recess portion.

Abstract: An optical scanner is provided with a laser diode for emitting a laser beam, a cylinder lens arranged in a laser route of the laser beam, and a static electricity force driving device (or electromagnetic force driving device) for moving the cylinder lens in a direction perpendicular to the laser route. Thus, the incidence position of the laser beam with respect to the cylinder lens is changeable. Accordingly, the laser beam having entered the cylinder lens is refracted at different refraction angles to be dispersed, thus being capable of scanning an object.

Abstract: One end of a rod-like pressure-conveying member is disposed in a sensing unit, and the other end extends into and through an insertion hole of an engine. A combustion pressure, to which the other end of the rod-like member is exposed, is conveyed to the sensing unit through the pressure-conveying member for the detection of the combustion pressure. The pressure-conveying member resonates at a knocking frequency fn of the engine and the knocking frequency fn is detected based on the resonance of the pressure-conveying member.

Abstract: A semiconductor pressure sensor includes a semiconductor substrate having a diaphragm for receiving pressure and a bridge circuit for detecting a distortion of the diaphragm corresponding to the pressure. The bridge circuit includes a pair of first gauge resistors and a pair of second gauge resistors. The first gauge resistors are disposed on a center of the diaphragm, and the second gauge resistors are disposed on a periphery of the diaphragm. Each first gauge resistor has a first resistance, which is larger than a second resistance of each second gauge resistor. The TNO property of the sensor is improved, so that the sensor has high detection accuracy.

Abstract: A pressure sensor chip includes a diaphragm and pads. A flexible printed circuit board (FPC) includes a resin sheet having a through-hole and wiring patterns that are formed within the resin sheet and sealed. The resin sheet is press-fitted to the pressure sensor chip such that the diaphragm is bared at the through-hole. The wiring patterns are connected to the pads, and junctions between the wiring patterns and the pads are sealed with the resin sheet.

Abstract: A pressure detector such as a combustion pressure sensor includes a pressure-sensitive element disposed in a cylindrical housing. Electrical signals responsive to pressure applied to the pressure-responsive element are generated in the element and led to output terminals through conductor patterns formed on the surface of a connecting member disposed between the pressure-responsive element and the output terminals. The conductor patterns may be formed in grooves formed on the surface of the connecting member. In place of the connecting member, a disc-shaped thin conductive member made of an anisotropiccally conductive material may be used.

Abstract: The TMR device has a structure including a lower electrode layer, a pinned layer, a tunnel barrier layer, a free layer, and an upper electrode layer which are successively formed on a substrate. The tunnel barrier layer has substantially a stoichiometric composition. The tunnel barrier layer may be a thin film of an oxide of AL formed by ALD method.

Abstract: A motor-assisted turbocharger is composed of a turbine driven by energy of exhaust gas, a compressor rotated by the turbine and a rotary electric machine for assisting rotation of the compressor. The turbine, the compressor and the rotary electric machine are connected to each other by a common rotating shaft. A polygon nut having magnetic member facing fixed magnetic sensor is connected to an axial end of the rotating shaft. A magnetic field formed between the magnetic member and the magnetic sensor changes according to rotation of the rotating shaft. A rotational speed and a rotational position (or angle) of the compressor are detected based on the changes in the magnetic field. Operation of the turbocharger is electronically controlled based on the detected rotational speed and the rotational position.

Abstract: A pressure sensor mainly includes a sensor chip, a circuit chip, and a substrate. The sensor chip is configured to generate an electrical signal representative of a pressure being sensed and includes a sensing area and a plurality of contact pads. The circuit chip includes a circuit configured to process the electrical signal and a plurality of contact pads. The substrate includes a resin sheet having an opening and a plurality of conductors within the resin sheet. The substrate is joined to both the sensor chip and circuit chip so that the sensing area of the sensor chip is to be exposed to the pressure being sensed through the opening of the resin sheet, the contact pads of the sensor chip and circuit chip are electrically connected to the conductors of the substrate, and all the contact pads and conductors are hermetically embedded in the resin sheet of the substrate.

Abstract: A pressure sensor includes a sensor chip and a circuit chip. The sensor chip, which is configured to generate an electrical signal representative of a pressure being sensed, has a surface including a sensing area and a plurality of electrical contact pads disposed on the surface. The circuit chip includes a circuit configured to process the electrical signal and has a surface on which a plurality of electrical contact pads of the circuit chip are disposed. The circuit chip is joined to the sensor chip so that the electrical contact pads of the circuit chip are respectively electrically connected to those of the sensor chip, all the electrical contact pads of the circuit chip and the sensor chip are hermetically sealed and isolated from the fluid, and the surfaces of the circuit chip and the sensor chip face each other with the electrical contact pads of the same interposed therebetween.

Abstract: A semiconductor dynamic quantity sensor detects a dynamic force and a fault diagnosis through the use of a single bridge circuit. Sensor output terminals are connected to midpoints between gauge resistors to make a combination of the midpoints at which an equal electric potential is measured when no pressure is applied to a diaphragm of the sensor. Fault diagnostic output terminals are connected to wiring patterns in the same manner as the first output terminals. One of the sensor output terminals has three selectable terminals connected to different positions of the midpoint. One of the diagnostic output terminals also has three selectable terminals connected to different positions of the wiring patterns. Accordingly, an offset voltage of the sensor output and the fault diagnostic output can be adjusted appropriately when one of the selectable terminals are selected as appropriate.

Abstract: A light-receiving element having a light-receiving portion is formed on a chip surface. A digital circuit element, an analog circuit element and a circuit adjusting element are provided for cooperatively processing a detection signal produced from the light-receiving element. And, a light-shielding film is provided for selectively setting a light-receiving region on the chip surface.

Abstract: A pressure sensor includes: a casing; a sensor chip with a gauge resistor; a boss disposed on the gauge resistor; a metallic diaphragm capable of distorting in accordance with a pressure; and a load transmission member disposed between the metallic diaphragm and the boss. The casing accommodates the sensor chip, the boss and the load transmission member. The casing is covered with the metallic diaphragm. The pressure applied to the diaphragm is detected such that the load corresponding to the pressure is applied to the gauge resistor through the metallic diaphragm, the load transmission member and the boss so that the pressure is measured on the basis of a resistance change of the gauge resistor. The gauge resistor is larger than the boss.

Abstract: A pedestrian detection device, a related method, an air bag system and a vehicle are disclosed. The pedestrian detection device 20 includes an infrared ray sensor 30A, which detects a temperature of a detection object approaching to or in contact with the vehicle 10 to provide a temperature signal, an impact sensor 27a to 27c, which generate impact signals when the vehicle encounters a collision, and an impact collision generation unit 21 operative to generate a pedestrian collision signal upon discrimination that the detection object is a pedestrian, discrimination that the impact signal is being outputted, and discrimination that a direction in which the pedestrian is present and a direction in which the impact is applied to the vehicle falls in a substantially same direction.

Abstract: A pressure sensor includes: a casing; a sensor chip with a gauge resistor; a boss disposed on the gauge resistor; a metallic diaphragm capable of distorting in accordance with a pressure; and a load transmission member disposed between the metallic diaphragm and the boss. The casing accommodates the sensor chip, the boss and the load transmission member. The casing is covered with the metallic diaphragm. The pressure applied to the diaphragm is detected such that the load corresponding to the pressure is applied to the gauge resistor through the metallic diaphragm, the load transmission member and the boss so that the pressure is measured on the basis of a resistance change of the gauge resistor. The gauge resistor is larger than the boss.

Abstract: A motor-assisted turbocharger is composed of a turbine driven by energy of exhaust gas, a compressor rotated by the turbine and a rotary electric machine for assisting rotation of the compressor. The turbine, the compressor blade and the rotary electric machine are connected to each other by a common rotating shaft. The compressor blade made of a material including a magnetic material faces an inner surface of a housing in which a magnetic sensor is embedded. A magnetic field in an air gap between the compressor blade and the magnetic sensor changes according to rotation of the compressor blade. The magnetic sensor detects changes in the magnetic field to thereby detect the rotational speed of the compressor blade. In place of the magnetic field, other physical amounts in the air gap, such as pressure, sound frequencies, capacitance or the like may be used for detecting the rotational speed.

Abstract: A control circuit sends a drive signal to a transmitting section. The transmitting section generates ultrasonic waves based on the drive signal. The ultrasonic waves are transmitted toward a side surface portion Ta of a tire T. A receiving section receives reflection sounds as ultrasonic waves reflected from the side surface portion Ta of the tire T. The receiving section sends a detection signal to the control circuit. Based on both the drive signal and the detection signal, the control circuit detects a shape change (i.e. degree of deformation) of the side surface portion Ta of the tire T. Then, the control circuit 14 calculates the stress (particularly, the lateral stress) acting from the road surface P to the wheel W based on the detection result of the shape change. Then, the control circuit produces a data signal D representing the calculated stress.