Patents by Inventor Iqbal Rajwani
Iqbal Rajwani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11908542Abstract: Prior knowledge of access pattern is leveraged to improve energy dissipation for general matrix operations. This improves memory access energy for a multitude of applications such as image processing, deep neural networks, and scientific computing workloads, for example. In some embodiments, prior knowledge of access pattern allows for burst read and/or write operations. As such, burst mode solution can provide energy savings in both READ (RD) and WRITE (WR) operations. For machine learning or inference, the weight values are known ahead in time (e.g., inference operation), and so the unused bytes in the cache line are exploited to store a sparsity map that is used for disabling read from either upper or lower half of the cache line, thus saving dynamic capacitance.Type: GrantFiled: December 23, 2019Date of Patent: February 20, 2024Assignee: Intel CorporationInventors: Charles Augustine, Somnath Paul, Turbo Majumder, Iqbal Rajwani, Andrew Lines, Altug Koker, Lakshminarayanan Striramassarma, Muhammad Khellah
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Patent number: 11874715Abstract: Dynamic power budget allocation in a multi-processor system is described. In an example, an apparatus includes a plurality of processor units; and a power control component, the power control component to monitor power utilization of each of the plurality of processor units, wherein power consumed by the plurality of processor units is limited by a global power budget. The apparatus is to assign a workload to each of the processor units and is to establish an initial power budget for operation of each of the processor units, and, upon the apparatus determining that one or more processor units require an increased power budget based on one or more criteria, the apparatus is to dynamically reallocate an amount of the global power budget to the one or more processor units.Type: GrantFiled: October 14, 2022Date of Patent: January 16, 2024Assignee: INTEL CORPORATIONInventors: Nikos Kaburlasos, Iqbal Rajwani, Bhushan Borole, Kamal Sinha, Sanjeev Jahagirdar
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Publication number: 20240013338Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: ApplicationFiled: September 20, 2023Publication date: January 11, 2024Applicant: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Publication number: 20240005443Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: ApplicationFiled: August 24, 2023Publication date: January 4, 2024Applicant: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Patent number: 11763416Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: GrantFiled: October 13, 2021Date of Patent: September 19, 2023Assignee: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Patent number: 11756150Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: GrantFiled: February 17, 2022Date of Patent: September 12, 2023Assignee: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Publication number: 20230123514Abstract: Embodiments herein relate to optimizing the duration of a sense amp enable signal in a memory device such as SRAM. A control circuit asserts the sense amp enable signal in response to a clock signal from a replica column of the SRAM. A feedback path extends from the sense amps back to the control circuit. In one approach, a change in a feedback signal on the feedback path indicates the sense amps have all received the sense amp enable signal. In another approach, a change in a feedback signal on the feedback path indicates the sense amps have all completed their sensing operations. In some cases, a selection can be made among multiple feedback paths.Type: ApplicationFiled: October 18, 2021Publication date: April 20, 2023Inventors: Gururaj K. Shamanna, Naveen Kumar M., Jagadeesh Chandra Salaka, Pascal A. Meinerzhagen, Sravan K. Puchakayala, Iqbal Rajwani
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Publication number: 20230030396Abstract: Dynamic power budget allocation in a multi-processor system is described. In an example, an apparatus includes a plurality of processor units; and a power control component, the power control component to monitor power utilization of each of the plurality of processor units, wherein power consumed by the plurality of processor units is limited by a global power budget. The apparatus is to assign a workload to each of the processor units and is to establish an initial power budget for operation of each of the processor units, and, upon the apparatus determining that one or more processor units require an increased power budget based on one or more criteria, the apparatus is to dynamically reallocate an amount of the global power budget to the one or more processor units.Type: ApplicationFiled: October 14, 2022Publication date: February 2, 2023Applicant: Intel CorporationInventors: Nikos Kaburlasos, Iqbal Rajwani, Bhushan Borole, Kamal Sinha, Sanjeev Jahagirdar
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Patent number: 11493974Abstract: Dynamic power budget allocation in a multi-processor system is described. In an example, an apparatus includes a plurality of processor units; and a power control component, the power control component to monitor power utilization of each of the plurality of processor units, wherein power consumed by the plurality of processor units is limited by a global power budget. The apparatus is to assign a workload to each of the processor units and is to establish an initial power budget for operation of each of the processor units, and, upon the apparatus determining that one or more processor units require an increased power budget based on one or more criteria, the apparatus is to dynamically reallocate an amount of the global power budget to the one or more processor units.Type: GrantFiled: August 14, 2020Date of Patent: November 8, 2022Assignee: Intel CorporationInventors: Nikos Kaburlasos, Iqbal Rajwani, Bhushan Borole, Kamal Sinha, Sanjeev Jahagirdar
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Patent number: 11410266Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: GrantFiled: October 13, 2020Date of Patent: August 9, 2022Assignee: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Patent number: 11386521Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, higher or lower density memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.Type: GrantFiled: January 29, 2021Date of Patent: July 12, 2022Assignee: Intel CorporationInventors: Altug Koker, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Josh Mastronarde, Naveen Matam, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Publication number: 20220188967Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets, With such an interchangeable design, cache or DRAM memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.Type: ApplicationFiled: March 2, 2022Publication date: June 16, 2022Applicant: Intel CorporationInventors: Altug Koker, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Josh Mastronarde, Naveen Matam, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Publication number: 20220180468Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: ApplicationFiled: February 17, 2022Publication date: June 9, 2022Applicant: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Publication number: 20220036500Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: ApplicationFiled: October 13, 2021Publication date: February 3, 2022Applicant: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Publication number: 20210256654Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, higher or lower density memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.Type: ApplicationFiled: January 29, 2021Publication date: August 19, 2021Applicant: Intel CorporationInventors: Altug Koker, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Josh Mastronarde, Naveen Matam, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Publication number: 20210193196Abstract: Prior knowledge of access pattern is leveraged to improve energy dissipation for general matrix operations. This improves memory access energy for a multitude of applications such as image processing, deep neural networks, and scientific computing workloads, for example. In some embodiments, prior knowledge of access pattern allows for burst read and/or write operations. As such, burst mode solution can provide energy savings in both READ (RD) and WRITE (WR) operations. For machine learning or inference, the weight values are known ahead in time (e.g., inference operation), and so the unused bytes in the cache line are exploited to store a sparsity map that is used for disabling read from either upper or lower half of the cache line, thus saving dynamic capacitance.Type: ApplicationFiled: December 23, 2019Publication date: June 24, 2021Applicant: Intel CorporationInventors: Charles Augustine, Somnath Paul, Turbo Majumder, Iqbal Rajwani, Andrew Lines, Altug Koker, Lakshminarayanan Striramassarma, Muhammad Khellah
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Publication number: 20210133913Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: ApplicationFiled: October 13, 2020Publication date: May 6, 2021Applicant: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Publication number: 20210064111Abstract: Dynamic power budget allocation in a multi-processor system is described. In an example, an apparatus includes a plurality of processor units; and a power control component, the power control component to monitor power utilization of each of the plurality of processor units, wherein power consumed by the plurality of processor units is limited by a global power budget. The apparatus is to assign a workload to each of the processor units and is to establish an initial power budget for operation of each of the processor units, and, upon the apparatus determining that one or more processor units require an increased power budget based on one or more criteria, the apparatus is to dynamically reallocate an amount of the global power budget to the one or more processor units.Type: ApplicationFiled: August 14, 2020Publication date: March 4, 2021Applicant: Intel CorporationInventors: Nikos Kaburlasos, Iqbal Rajwani, Bhushan Borole, Kamal Sinha, Sanjeev Jahagirdar
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Patent number: 10909652Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, higher or lower density memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.Type: GrantFiled: March 15, 2019Date of Patent: February 2, 2021Assignee: Intel CorporationInventors: Altug Koker, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Josh Mastronarde, Naveen Matam, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier
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Patent number: 10803548Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.Type: GrantFiled: March 15, 2019Date of Patent: October 13, 2020Assignee: Intel CorporationInventors: Naveen Matam, Lance Cheney, Eric Finley, Varghese George, Sanjeev Jahagirdar, Altug Koker, Josh Mastronarde, Iqbal Rajwani, Lakshminarayanan Striramassarma, Melaku Teshome, Vikranth Vemulapalli, Binoj Xavier