Patents by Inventor Isabel De Sousa
Isabel De Sousa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11791270Abstract: A direct bonded heterogeneous integration (DBHi) device includes a substrate including a trench formed in a top surface of the substrate. The DBHi device further includes a first chip coupled to the substrate on a first side of the trench by a plurality of first interconnects. The DBHi device further includes a second chip coupled to the substrate on a second side of the trench by a plurality of second interconnects. The second side of the trench is arranged opposite the first side of the trench. The DBHi device further includes a bridge coupled to the first chip and to the second chip by a plurality of third interconnects such that the bridge is suspended in the trench. The DBHi device further includes a non-conductive paste material surrounding the plurality of third interconnects to further couple the bridge to the first chip and to the second chip.Type: GrantFiled: May 10, 2021Date of Patent: October 17, 2023Assignee: International Business Machines CorporationInventors: Kamal K Sikka, Maryse Cournoyer, Pascale Gagnon, Charles C. Bureau, Catherine Dufort, Dale Curtis McHerron, Vijayeshwar Das Khanna, Marc A. Bergendahl, Dishit Paresh Parekh, Ravi K. Bonam, Hiroyuki Mori, Yang Liu, Paul S. Andry, Isabel De Sousa
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Publication number: 20220359401Abstract: A direct bonded heterogeneous integration (DBHi) device includes a substrate including a trench formed in a top surface of the substrate. The DBHi device further includes a first chip coupled to the substrate on a first side of the trench by a plurality of first interconnects. The DBHi device further includes a second chip coupled to the substrate on a second side of the trench by a plurality of second interconnects. The second side of the trench is arranged opposite the first side of the trench. The DBHi device further includes a bridge coupled to the first chip and to the second chip by a plurality of third interconnects such that the bridge is suspended in the trench. The DBHi device further includes a non-conductive paste material surrounding the plurality of third interconnects to further couple the bridge to the first chip and to the second chip.Type: ApplicationFiled: May 10, 2021Publication date: November 10, 2022Inventors: Kamal K. Sikka, Maryse Cournoyer, Pascale Gagnon, Charles C. Bureau, Catherine Dufort, Dale Curtis McHerron, Vijayeshwar Das Khanna, Marc A. Bergendahl, Dishit Paresh Parekh, RAVI K. BONAM, HIROYUKI MORI, Yang Liu, Paul S. Andry, Isabel De Sousa
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Patent number: 11209598Abstract: A photonic package is provided. The photonic package includes a base substrate defining an aperture, a top die and a photonic integrated circuit (PIC) die. The top die includes a body with first and second top die sections. The first top die section is connectable with the base substrate. The PIC die includes body with first and second PIC die sections. The PIC die is disposable in the aperture such that the second PIC die section is connectable with the second top die section and the first PIC die section extends beyond the second top die section and is exposed for connection to a waveguide assembly.Type: GrantFiled: February 28, 2019Date of Patent: December 28, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Barnim Alexander Janta-Polczynski, Isabel De Sousa, Jean Audet, Maryse Cournoyer, Sylvain Pharand, Roxan Lemire, Louis-Marie Achard, Paul Francis Fortier
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Patent number: 10896862Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.Type: GrantFiled: February 28, 2018Date of Patent: January 19, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
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Publication number: 20200279840Abstract: A photonic package is provided. The photonic package includes a base substrate defining an aperture, a top die and a photonic integrated circuit (PIC) die. The top die includes a body with first and second top die sections. The first top die section is connectable with the base substrate. The PIC die includes body with first and second PIC die sections. The PIC die is disposable in the aperture such that the second PIC die section is connectable with the second top die section and the first PIC die section extends beyond the second top die section and is exposed for connection to a waveguide assembly.Type: ApplicationFiled: February 28, 2019Publication date: September 3, 2020Inventors: BARNIM ALEXANDER JANTA-POLCZYNSKI, Isabel De Sousa, Jean Audet, Maryse Cournoyer, Sylvain Pharand, Roxan Lemire, Louis-Marie Achard, Paul Francis Fortier
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Publication number: 20180190565Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.Type: ApplicationFiled: February 28, 2018Publication date: July 5, 2018Inventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
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Patent number: 9941184Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.Type: GrantFiled: October 24, 2017Date of Patent: April 10, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
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Publication number: 20180047655Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.Type: ApplicationFiled: October 24, 2017Publication date: February 15, 2018Inventors: Isabel DE SOUSA, Annique LAVOIE, Eric SALVAS, Michel TURGEON
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Patent number: 9881848Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.Type: GrantFiled: October 23, 2015Date of Patent: January 30, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
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Patent number: 9761505Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.Type: GrantFiled: October 23, 2015Date of Patent: September 12, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
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Patent number: 9646913Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.Type: GrantFiled: October 23, 2015Date of Patent: May 9, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
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Patent number: 9576878Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.Type: GrantFiled: October 23, 2015Date of Patent: February 21, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
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Publication number: 20160042976Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.Type: ApplicationFiled: October 23, 2015Publication date: February 11, 2016Inventors: Isabel DE SOUSA, Annique LAVOIE, Eric SALVAS, Michel TURGEON
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Publication number: 20160042977Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.Type: ApplicationFiled: October 23, 2015Publication date: February 11, 2016Inventors: Isabel DE SOUSA, Annique LAVOIE, Eric SALVAS, Michel TURGEON
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Publication number: 20160043016Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.Type: ApplicationFiled: October 23, 2015Publication date: February 11, 2016Inventors: Isabel DE SOUSA, Annique LAVOIE, Eric SALVAS, Michel TURGEON
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Publication number: 20160043015Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.Type: ApplicationFiled: October 23, 2015Publication date: February 11, 2016Inventors: Isabel DE SOUSA, Annique LAVOIE, Eric SALVAS, Michel TURGEON
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Patent number: 9257308Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.Type: GrantFiled: August 26, 2015Date of Patent: February 9, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
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Patent number: 9257307Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.Type: GrantFiled: August 26, 2015Date of Patent: February 9, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
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Patent number: 9252029Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.Type: GrantFiled: August 26, 2015Date of Patent: February 2, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon
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Patent number: 9252121Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.Type: GrantFiled: January 23, 2014Date of Patent: February 2, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Isabel De Sousa, Annique Lavoie, Eric Salvas, Michel Turgeon