Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

Abstract: A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes dispensing a thermal interface material (TIM) on an electronic assembly. The method further includes removing volatile species of the TIM, prior to lid placement on the electronic assembly. The method further includes placing the lid on the TIM, over the electronic assembly. The method further includes pressing the lid onto the electronic assembly.

Abstract: A stencil printing method and apparatus for printing paste material in a given pattern on a substrate from a paste dispenser through a stencil to define the stencil pattern on a substrate. The apparatus is provided with a cleaning module that can be moved against the printing face of the stencil and moved, along a given path beneath the stencil, for cleaning the printing face of the stencil. The cleaning module includes a blade assembly mounted there on transverse to the path of movement of the cleaning module. The print apparatus further including selectively operable means for actuating the blade assembly during a select cleaning cycle to engage the leading end of its blade with the underside of the stencil as the cleaning module is passed beneath said stencil whereby the leading edge of the blade scrapes debris from the underside of said stencil.

Abstract: A vacuum controlled fixture is provided for positioning columns on sites of an electronic substrate. The fixture includes an internal chamber having spaced apart first and second surfaces extending beneath its principal face. A regular array of column receiving holes extends from the principal face through the first surface of the chamber, and a plurality of vacuum ducts extend from ports in the second surface of the chamber to a vacuum source to evacuate the internal chamber. The ports in the second face of the chamber are laterally offset from the receiving holes in the first face of the chamber to allow seating of the interior ends of the columns on coplanar portions of the rear surface. The ports are preferably centered, equidistant from the closest adjacent receiving holes, thereby providing centering of the columns by means of a vacuum driven air flow around the latter.

Abstract: A vacuum controlled fixture is provided for positioning columns on sites of an electronic substrate. The fixture includes an internal chamber having spaced apart first and second surfaces extending beneath its principal face. A regular array of column receiving holes extends from the principal face through the first surface of the chamber, and a plurality of vacuum ducts extend from ports in the second surface of the chamber to a vacuum source to evacuate the internal chamber. The ports in the second face of the chamber are laterally offset from the receiving holes in the first face of the chamber to allow seating of the interior ends of the columns on coplanar portions of the rear surface. The ports are preferably centered, equidistant from the closest adjacent receiving holes, thereby providing centering of the columns by means of a vacuum driven air flow around the latter.

Abstract: A vacuum controlled fixture for positioning columns arrayed on a principal face thereof, on sites of an electronic substrate. The fixture includes an internal chamber having spaced apart first and second surfaces extending beneath its principal face. A regular array of column receiving holes extends from the principal face through the first surface of the chamber, and a plurality of vacuum ducts extend from ports in the second surface of the chamber to a vacuum source to evacuate the internal chamber. The ports in the second face of the chamber are laterally offset from the receiving holes in the first face of the chamber to allow seating of the interior ends of the columns on coplanar portions of the rear surface.