Abstract: A chip mounting substrate comprising: a mounting base defined by a first surface and a second surface opposite to the first surface; a plurality of first lands disposed on the first surface, being classified into first and second groups of the first lands; and a plurality of second lands disposed on the second surface so as to face to the first lands, being classified into first and second groups of the second lands.

Abstract: A chip mounting substrate comprising: a mounting base defined by a first surface and a second surface opposite to the first surface; a plurality of first lands disposed on the first surface, being classified into first and second groups of the first lands; and a plurality of second lands disposed on the second surface so as to face to the first lands, being classified into first and second groups of the second lands.

Abstract: A wiring board includes an insulating board defined by a first surface and a second surface opposing to the first surface; first signal strips disposed on the first surface; a first power distribution plane provided on the first surface so as to occupy a residual area of the first signal strips; lands disposed on the second surface; via metals penetrating the insulating board so as to connect the lands to the corresponding first signal strips; a second power distribution plane provided on the second surface.

Abstract: A chip mounting substrate comprising: a mounting base defined by a first surface and a second surface opposite to the first surface; a plurality of first lands disposed on the first surface, being classified into first and second groups of the first lands; and a plurality of second lands disposed on the second surface so as to face to the first lands, being classified into first and second groups of the second lands.

Abstract: A semiconductor module includes first and second semiconductor chips having first and second element surfaces where first and second electrode pads are provided. The first semiconductor chip is provided on a second main surface of a substrate with the first element surface facing the substrate. The second semiconductor chip is provided on the first semiconductor chip with a surface opposite to the second element surface facing a surface opposite to the first element surface. First and second wiring patterns are provided on the first and second main surfaces and connected to each other. The first and second wiring patterns have first and second connection parts. First and second connection wire connect the first and second electrode pads to the first and second connection parts respectively. An external terminal is provided on the first wiring pattern. A sealing member covers the second connection wire.

Abstract: The cup dispenser is disposed of an opening or openings 1b formed on one side face of the casing 1 of the dispenser and a receiving container 4 attached to each opening 1b provided with a cup pusher 41 connected to a coil spring 42. The opening 1b is attached with a delivery opening 3 which incorporates a membrane or membranes 32 each having a circular opening 32a. The set of cups 7 received in the receiving container 4 can be pulled out one by one through the delivery opening 3.

Abstract: A damper device including first and second support members, one of which is fixed to a support element and the other of which is fixed to a suspended element, an elastic block made of a deformable, elastic material for elastically coupling the two support members and a sealed space formed therein filled with a liquid. One partition member has its periphery fixed to the first support member and divides the sealed space into two chambers. The partition member has therein a member movable along a short distance. Fluid passages are formed in a wall portion of the first support member so as to communicate between the two chambers and to impart flow resistance to the liquid flowing therethrough. The partition member can be suspended to the first support member by an elastic sheet and be movable along the axial direction of the first support member. A solenoid is mounted on the inner wall of the first support member. When the solenoid is energized, the partition member can be fixed to the first support member.

Abstract: An elastically damping device for the suspension of an engine of a vehicle, by which the engine vibrations are prevented from being transmitted to the body of the vehicle, is disclosed. The damping device is provided with a first fluid chamber and a second fluid chamber, each of which is defined by an elastically deformable wall. The fluid chambers are separated from each other by means of a partition plate, of which at least one portion is formed into a movable plate being movable in such a direction as to lower the increased inner pressure of the fluid chambers, and which has a restricted passageway for communicating the fluid chambers. The damping device of the present invention further comprises two stopper portions for stopping the movement of the movable plate and an electromagnetic coil for operating one or two stopper portions so as to control the movable distance of the movable plate in accordance with the driving condition of the vehicle.

Abstract: An elastically damping device for the suspension of an engine comprises a conical first fluid chamber which is formed in the bottom portion of a frustoconical elastically deformable block, and a second fluid chamber which is formed on the upper surface of the block by fixing the open end of an elastically deformable thin sheet thereto. The top portion of the first fluid chamber and the second fluid chamber are interconnected to each other by way of an open passageway which is formed in the block. The first fluid chamber, the second fluid chamber and the open passageway are filled with a liquid. This device is supported on a body of a vehicle by a first supporting plate which is connected to the under surface of the block and the engine is mounted on the block by a second supporting plate which is connected to the upper surface of the block.

Abstract: In a molding composed of a molding body comprising a front surface, a bottom, a side portion and a hollow portion, and of an adhesive layer constituted at the bottom, the thin molding side portion extends along the front surface, and the bottom is provided with a projection which projects on one side or both sides of the bottom separate from the front surface and the molding side portion. When the front surface is pushed, the pushing force applied to the front surface produces the fulcrum of the bending moment at the molding side portion and the plane pressure from the fulcrum to the front surface in the direction towards the inside of the bottom, and at the same time the contact pressure applied to the point of action of force is distributed in the plane pressure distribution towards the front surface which attenuates from the peak value below the point of action of force to both sides gradually.

Abstract: A halo-salycylanilide of the following formula ##STR1## wherein R.sub.1 represents hydrogen or acyl group, R.sub.2 represents alkyl group, and both X.sub.1 and X.sub.2 represent halogen, has high antifungal and bactericidal activity.

Abstract: A zig-zag sewing machine equipped with pattern cams and a pattern cam selection arrangement has a compartment in which various accessories of the sewing machine are accommodated. One lid covers the compartment and another lid overlies the above-mentioned lid, the lids being provided, at their surfaces facing one another, with a table of indicia and with lines connecting the indicia with other indicia provided on a pattern cam selector dial so as to enable the user of the sewing machine to adjust the sewing machine for the particular selected stitch pattern. The lids are mounted for pivoting on a common shaft, and a sliding element is mounted on the shaft for displacement therealong and is visible when the one lid is either open or closed, the position of the slide element being selected in dependence on the selected pattern and also being indicative of the accessory to be used.