Abstract: Provided is a display device comprising at least one sensing pixel including a sensing pixel circuit, a sensing unit including sensing circuit, and a temperature output unit to calculate a temperature of the display panel based on the sensing data. The sensing data is generated from a sensing pixel including a driving transistor in which a current generated according to temperature varies, and a temperature is measured from the sensing data.

Abstract: A method of a first terminal may include: identifying first RB set(s) to be used for SL communication among consecutive RB sets through an LBT procedure; identifying a first subchannel group included in the first RB set(s) and a second subchannel group including a first PRB in the first RB set(s), the first PRB being not included in the first subchannel group; configuring the first PRB within the second subchannel group as an SL communication resource; and transmitting, to a second terminal, control information indicating that the first PRB is configured as the SL communication resource.

Abstract: This embodiment comprises: a step for preparing a sample wafer; a step for forming a first oxide film on the sample wafer at a temperature of 700-800° C.; a step for forming a second oxide film on the first oxide film at a temperature of 800-1000° C.; a step for forming a third oxide film on the second oxide film at a temperature of 1000-1100° C.; a step for forming a fourth oxide film on the third oxide film at a temperature of 1100-1200° C.; a step for removing the first to fourth oxide films; a step for forming a haze on the surface of the sample wafer by etching the sample wafer from which the first to fourth oxide films have been removed; and a step for evaluating a defective region of the sample wafer on the basis of the haze.

Abstract: The present invention relates to a technical idea for providing a delivery service on regular and irregular roads using autonomous vehicles. More specifically, the present invention relates to technology in which, on a regular road, a lead vehicle and at least one droid vehicle are coupled to each other and a delivery service is provided based on autonomous driving; and on an irregular road, the coupling between the lead vehicle and the droid vehicle is automatically released and the droid vehicle provides a delivery service by remotely controlling the driving of the droid vehicle by the lead vehicle in the last mile delivery section corresponding to the irregular road.

Abstract: This embodiment comprises: a step for preparing a sample wafer; a step for forming a first oxide film on the sample wafer at a temperature of 700-800° C.; a step for forming a second oxide film on the first oxide film at a temperature of 800-1000° C.; a step for forming a third oxide film on the second oxide film at a temperature of 1000-1100° C.; a step for forming a fourth oxide film on the third oxide film at a temperature of 1100-1200° C.; a step for removing the first to fourth oxide films; a step for forming a haze on the surface of the sample wafer by etching the sample wafer from which the first to fourth oxide films have been removed; and a step for evaluating a defective region of the sample wafer on the basis of the haze.

Abstract: Provided is a method of estimating a speed of a vehicle includes obtaining time domain acoustic data from an acoustic storage apparatus when the vehicle passes over a horizontally grooved road; calculating frequency domain acoustic data from the time domain acoustic data by using Fourier transformation; calculating, from the frequency domain acoustic data, a resonance frequency of sound generated between tires of the vehicle and horizontal groovings in the road; and estimating the speed when the vehicle passes over the horizontally grooved road by multiplying the resonance frequency by an interval of the horizontal groovings.

Abstract: A method of identifying a wafer defect region is disclosed. The method includes preparing a sample wafer, forming a primary oxide film on the sample wafer at a temperature of 800° C. to 1000° C., forming a secondary oxide film on the primary oxide film at a temperature of 1000° C. to 1100° C., forming a tertiary oxide film on the secondary oxide film at a temperature of 1100° C. to 1200° C., removing the primary to tertiary oxide films, etching one surface of the sample wafer from which the primary to tertiary oxide films are removed to form haze on one surface of the sample wafer, and identifying a defect region of the sample wafer based on the haze.

Abstract: A wafer defect analysis method according to one embodiment comprises the steps of: thermally treating a wafer at different temperatures; measuring an oxygen precipitate index of the thermally treated wafer; determining a characteristic temperature at which the oxygen precipitate index is maximized; and discriminating a type of defect region of the wafer depending on the determined characteristic temperature.

Abstract: A wafer defect analysis method according to one embodiment comprises the steps of: thermally treating a wafer at different temperatures; measuring an oxygen precipitate index of the thermally treated wafer; determining a characteristic temperature at which the oxygen precipitate index is maximized; and discriminating a type of defect region of the wafer depending on the determined characteristic temperature.

Abstract: A wafer defect analysis method according to one embodiment comprises the steps of: thermally treating a wafer at different temperatures; measuring an oxygen precipitate index of the thermally treated wafer; determining a characteristic temperature at which the oxygen precipitate index is maximized; and discriminating a type of defect region of the wafer depending on the determined characteristic temperature.

Abstract: A method of identifying a wafer defect region is disclosed. The method includes preparing a sample wafer, forming a primary oxide film on the sample wafer at a temperature of 800° C. to 1000° C., forming a secondary oxide film on the primary oxide film at a temperature of 1000° C. to 1100° C., forming a tertiary oxide film on the secondary oxide film at a temperature of 1100° C. to 1200° C., removing the primary to tertiary oxide films, etching one surface of the sample wafer from which the primary to tertiary oxide films are removed to form haze on one surface of the sample wafer, and identifying a defect region of the sample wafer based on the haze.

Abstract: Provided is a method of determining a recording time of an event data recorder (EDR) includes obtaining, from the EDR of a vehicle, main engine revolutions per minute (RPM) record data of which the recording time is unknown; obtaining, from an acoustic storage apparatus, time domain acoustic data including acoustic information of an event time of the vehicle; calculating frequency domain acoustic data from the time domain acoustic data by using Fourier transformation; calculating RPM estimation data of the vehicle of the event time from the frequency domain acoustic data by using order analysis; and determining whether a time when the EDR records the RPM record data is identical to the event time by comparing the RPM estimation data of the vehicle with the RPM record data.

Abstract: Provided is a method of estimating a speed of a vehicle includes obtaining time domain acoustic data from an acoustic storage apparatus when the vehicle passes over a horizontally grooved road; calculating frequency domain acoustic data from the time domain acoustic data by using Fourier transformation; calculating, from the frequency domain acoustic data, a resonance frequency of sound generated between tires of the vehicle and horizontal groovings in the road; and estimating the speed when the vehicle passes over the horizontally grooved road by multiplying the resonance frequency by an interval of the horizontal groovings.

Abstract: Provided is a method of estimating velocity of a vehicle, in which at least one black box is installed, the method including: receiving acoustic information from the black box, the acoustic information being synchronized with time of a certain image; transforming the acoustic information of a time domain to frequency data of a frequency domain via fast Fourier transformation (FFT); calculating revolutions per minute (RPM) of a main engine from the frequency data by using order analysis; and calculating velocity of the vehicle at the time of the certain image by using the RPM of the main engine and vehicle information.

Abstract: A wafer defect analysis method according to one embodiment comprises the steps of: thermally treating a wafer at different temperatures; measuring an oxygen precipitate index of the thermally treated wafer; determining a characteristic temperature at which the oxygen precipitate index is maximized; and discriminating a type of defect region of the wafer depending on the determined characteristic temperature.

Abstract: A method for analyzing the shape of a wafer according to an embodiment comprises the steps of: acquiring a sectional image showing a wafer to be analyzed; finding a coordinate row of the surface contour of the wafer in the sectional image; and obtaining shape analysis data, including information about the shape of the wafer, using the coordinate row.

Abstract: A method for analyzing the shape of a wafer according to an embodiment comprises the steps of: acquiring a sectional image showing a wafer to be analyzed; finding a coordinate row of the surface contour of the wafer in the sectional image; and obtaining shape analysis data, including information about the shape of the wafer, using the coordinate row.

Abstract: A semiconductor memory device is disclosed. The device comprises at least one data input/output reference signal input and output pin and a plurality of integrated circuits, each with a data input/output reference signal input and output pad connected to the data input/output reference signal input and output pin. Each integrated circuit further comprises a data input/output reference signal input and output buffer for buffering a data input/output reference signal input from the data input/output reference signal input and output pad when data is input. This buffer also buffers an internally generated data input/output reference signal, and outputs the buffered signal when data is output. The internally generated data input/output reference signal output can be disabled on each integrated circuit in response to a control signal, thus allowing a single one of the plurality of integrated circuits to be selected to generate the reference signal.

Abstract: A memory device having a high bus efficiency on a network, an operating method of the memory device, and a memory system including the memory device are provided. The memory device includes banks, a programming register, and a controller. Each of the banks has a plurality of memory cells arranged in a matrix of rows and columns. In a write operation, the programming register stores simultaneous write information on how many banks there are in which data are stored. In a read operation, the controller selects one of the banks subjected to the write operation in response to the simultaneous write information to read out the memory cell data in the selected bank.

Abstract: A method for generating an initializing signal capable of preventing inner circuits installed in a semiconductor memory device from being initially unstably operated due to the application of external electric power. The method includes the steps of: (a) receiving a precharge command for precharging the semiconductor memory device; (b) activating the initializing signal to a first level in response to the received precharge command; (c) receiving a refresh command for refreshing the semiconductor memory device after receipt of the precharge command; (d) receiving a mode set command for setting an operational mode of the semiconductor memory device after receipt of the refresh command; and (e) deactivating the initializing signal to a second level in response to the received mode set command.