Patents by Inventor Jae Lim

Jae Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11492109
    Abstract: Disclosed is a method of determining location information of a signal source. A method of determining location information of a signal source by using an unmanned aerial vehicle according to an embodiment of the present disclosure includes determining, at a first location, first location information and first posture information of the unmanned aerial vehicle provided with a linear array antenna; determining, at the first location, a first measurement azimuth between the signal source and the linear array antenna; determining, at least one second location, at least one second location information and at least one second posture information of the unmanned aerial vehicle having the linear array antenna; determining, at the at least one second location, at least one second measurement azimuth between the signal source and the linear array antenna; and predicting the location information of the signal source using the information described above.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: November 8, 2022
    Assignee: Electronics and Telecommunications Research Institute
    Inventor: Kwang Jae Lim
  • Publication number: 20220348713
    Abstract: A film for an electronic board, according to one embodiment, has a low dielectric constant of 2.9 or lower at a frequency of 10-40 GHz, and thus can cause the signal transmission rate for a high frequency use, such as fifth generation (5G) mobile communication, to be superior to that of a conventional film for an electronic board. In addition, the film for an electronic board has flexibility and physicochemical characteristics that are greater than or equal to those of a conventional film, so as to be applicable to the manufacture of a laminate of a conductive film such as FCCL and an electronic board such as a FPCB, thereby enabling processability, durability, transmission capacity and the like to be improved.
    Type: Application
    Filed: September 24, 2020
    Publication date: November 3, 2022
    Inventors: Young Min HEO, Ilho NOH, Sang Mook KIM, Byeong Jae LIM
  • Publication number: 20220330423
    Abstract: A film for an electronic substrate according to an embodiment has a moisture-absorption rate of less than 0.3% of the initial weight when immersed in water for 24 hours, and thus is less susceptible than existing films for electronic substrates are to changes in dimension or degradation in electrical characteristics caused by containing moisture according to changes in temperature and humidity. Also, the film for an electronic substrate is equal or superior to existing films in terms of flexibility and physicochemical characteristics, and thus may be applied to the manufacture of laminates with a conductive film such as FCCL and electronic substrates such as FPCB to improve processability, durability, transmission capacity, etc.
    Type: Application
    Filed: September 18, 2020
    Publication date: October 13, 2022
    Inventors: Young Min HEO, Ilho NOH, Sang Mook KIM, Byeong Jae LIM
  • Publication number: 20220270983
    Abstract: A semiconductor device has a substrate and a semiconductor die disposed over the substrate. An encapsulant is deposited over the semiconductor die and substrate with a surface of the semiconductor die exposed from the encapsulant. A first shielding layer is formed over the semiconductor die. In some embodiments, the first shielding layer includes a stainless steel layer in contact with the surface of the semiconductor die and a copper layer formed over the stainless steel layer. The first shielding layer may further include a protective layer formed over the copper layer. One embodiment has a heatsink bonded to the semiconductor die through a solder layer. A second shielding layer can be formed over a side surface of the semiconductor die.
    Type: Application
    Filed: May 11, 2022
    Publication date: August 25, 2022
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Dong Won Son, Byeonghoon Kim, Sung Ho Choi, Sung Jae Lim, Jong Ho Shin, SungWon Cho, ChangOh Kim, KyoungHee Park
  • Patent number: 11375107
    Abstract: Disclosed herein are an apparatus and method for guiding multi-view capture. The apparatus for guiding multi-view capture includes one or more processors and an execution memory for storing at least one program that is executed by the one or more processors, wherein the at least one program is configured to receive a single-view two-dimensional (2D) image obtained by capturing an image of an object of interest through a camera, generate an orthographic projection image and a perspective projection image for the object of interest from the single-view 2D image using an image conversion parameter that is previously learned from multi-view 2D images for the object of interest, generate a 3D silhouette model for the object of interest using the orthographic projection image and the perspective projection image, and output the 3D silhouette model and a guidance interface for the 3D silhouette model.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: June 28, 2022
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Seong-Jae Lim, Ki-Nam Kim, Tae-Joon Kim, Seung-Uk Yoon, Seung-Wook Lee, Bon-Woo Hwang
  • Patent number: 11355452
    Abstract: A semiconductor device has a substrate and a semiconductor die disposed over the substrate. An encapsulant is deposited over the semiconductor die and substrate with a surface of the semiconductor die exposed from the encapsulant. A first shielding layer is formed over the semiconductor die. In some embodiments, the first shielding layer includes a stainless steel layer in contact with the surface of the semiconductor die and a copper layer formed over the stainless steel layer. The first shielding layer may further include a protective layer formed over the copper layer. One embodiment has a heatsink bonded to the semiconductor die through a solder layer. A second shielding layer can be formed over a side surface of the semiconductor die.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: June 7, 2022
    Assignee: STATS ChipPAC Pte. Ltd.
    Inventors: Dong Won Son, Byeonghoon Kim, Sung Ho Choi, Sung Jae Lim, Jong Ho Shin, SungWon Cho, ChangOh Kim, KyoungHee Park
  • Publication number: 20220162310
    Abstract: The present invention relates to: an antibody to T cell Immunoreceptor with Ig and Tyrosine-Based Inhibitory Motif Domains (TIGIT), or an antigen-binding fragment thereof; a nucleic acid encoding same; a vector carrying the nucleic acid; a cell transformed with the vector; a method for producing the antibody or the antigen-binding fragment thereof; and a composition and a composition for combined administration, which comprise same and are for preventing or treating cancer.
    Type: Application
    Filed: May 22, 2020
    Publication date: May 26, 2022
    Inventors: Hye-Young PARK, Eun Jung SONG, Eun Hee LEE, Hye In YUM, Hye Mi NAM, Mun Kyung KIM, Jee Won LEE, Joong Hyuk SHEEN, Min Kyu HUR, So Jung LIM, Ok Jae LIM, Yang Mi LIM, Jong Hwa WON
  • Publication number: 20220150971
    Abstract: Provided is a method for transmitting, by a transmitter, a first data having periodicity through a channel of an unlicensed band: The transmitter adjusts at least one of transmission timing of the first data and clear channel assessment (CCA) timing for the channel to occupy the channel. The transmitter determines whether the channel may be occupied by performing a CCA on the channel at the CCA timing. The transmitter transmits the first data through the channel at the transmission timing of the first data, when it is determined that the channel may be occupied.
    Type: Application
    Filed: January 27, 2022
    Publication date: May 12, 2022
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Eunkyung KIM, Jae Sun CHA, Chanho YOON, Seung-Kwon BAEK, Jae Joon PARK, Kwang Jae LIM, Sung Cheol CHANG
  • Publication number: 20220135679
    Abstract: A bispecific anti-GPNMB/anti-CD3 antibody specifically binds to CD3 (cluster of differentiation 3) and GPNMB (glycoprotein non-metastatic melanoma protein B) and uses thereof are disclosed. The bispecific antibody shows high affinity and specificity to CD3 and GPNMB and thus can induce death of cancer cells expressing GPNMB and inhibit proliferation thereof. Therefore, the bispecific antibody can be used as an effective therapeutic agent for cancers expressing GPNMB.
    Type: Application
    Filed: April 6, 2020
    Publication date: May 5, 2022
    Applicant: GREEN CROSS CORPORATION
    Inventors: Jae Chan PARK, Eun Jung SONG, So Jung LIM, Jae-Chul LEE, Hae Naem KWON, Su A LEE, Ok Jae LIM, Mun Kyung KIM, Hyun Jung CHO, Gil-Jung KIM, Jee Won LEE, Sung Keun KIM, Jong Wha WON, Shin A JANG
  • Patent number: 11313942
    Abstract: Disclosed is a method of identifying location information of a signal source, the method including: identifying, at a first position, first position information and first posture information of an UAV equipped with a linear array antenna; identifying, after identifying a first measured azimuth between the signal source and the antenna at the first position, a first corrected azimuth; identifying, at at least one second position, at least one piece of second position information and at least one of second posture information of the UAV; identifying, after identifying at least one second measured azimuth between the signal source and the antenna at the at least one second position, at least one second corrected azimuth; and estimating the location information of the signal source by using the first position information, the first posture information, the first corrected azimuth, the second position information, the second posture information, and the second corrected azimuth.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: April 26, 2022
    Assignee: Electronics and Telecommunications Research Institute
    Inventor: Kwang Jae Lim
  • Publication number: 20220101604
    Abstract: Disclosed herein are a learning-based three-dimensional (3D) model creation apparatus and method. A method for operating a learning-based 3D model creation apparatus includes generating multi-view feature images using supervised learning, creating a three-dimensional (3D) mesh model using a point cloud corresponding to the multi-view feature images and a feature image representing internal shape information, generating a texture map by projecting the 3D mesh model into three viewpoint images that are input, and creating a 3D model using the texture map.
    Type: Application
    Filed: December 14, 2021
    Publication date: March 31, 2022
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Seong-Jae LIM, Tae-Joon KIM, Seung-Uk YOON, Seung-Wook LEE, Bon-Woo HWANG, Jin-Sung CHOI
  • Patent number: 11272541
    Abstract: Provided is a method for transmitting, by a transmitter, a first data having periodicity through a channel of an unlicensed band: The transmitter adjusts at least one of transmission timing of the first data and clear channel assessment (CCA) timing for the channel to occupy the channel. The transmitter determines whether the channel may be occupied by performing a CCA on the channel at the CCA timing. The transmitter transmits the first data through the channel at the transmission timing of the first data, when it is determined that the channel may be occupied.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: March 8, 2022
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Eunkyung Kim, Jae Sun Cha, Chanho Yoon, Seung-Kwon Baek, Jae Joon Park, Kwang Jae Lim, Sung Cheol Chang
  • Patent number: 11232632
    Abstract: Disclosed herein are a learning-based three-dimensional (3D) model creation apparatus and method. A method for operating a learning-based 3D model creation apparatus includes generating multi-view feature images using supervised learning, creating a three-dimensional (3D) mesh model using a point cloud corresponding to the multi-view feature images and a feature image representing internal shape information, generating a texture map by projecting the 3D mesh model into three viewpoint images that are input, and creating a 3D model using the texture map.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: January 25, 2022
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Seong-Jae Lim, Tae-Joon Kim, Seung-Uk Yoon, Seung-Wook Lee, Bon-Woo Hwang, Jin-Sung Choi
  • Publication number: 20210320358
    Abstract: A battery module including a plurality of battery cells; and a spacer between the battery cells, the spacer including a support frame, and at least one pressing member coupled to the support frame, the at least one pressing member including a plate surface facing one of the battery cells and being in contact with an outside of a can of the one battery cell.
    Type: Application
    Filed: March 23, 2021
    Publication date: October 14, 2021
    Inventors: Hoo Min LEE, Seon Ung CHOI, Jae lim RYU, Jong hyun LEE, Han Ho KIM
  • Patent number: 11138785
    Abstract: A method and a system for generating a 3D image of a character through steps of: receiving an identifier of a template and a two-dimensional (2D) image of the character generated based on the template corresponding to a type of the character; acquiring template information of the template from a template library by using the identifier, and extracting an effective parameter for machine learning to be performed to generate the 3D image based on the template information and the 2D image; and generating the 3D image of the character by performing the machine learning based on the effective parameter and the template information are provided.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: October 5, 2021
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Jin Sung Choi, Seung Wook Lee, Tae-Joon Kim, Seung Uk Yoon, Seong Jae Lim, Bon Woo Hwang, Chang Joon Park
  • Publication number: 20210287595
    Abstract: A display apparatus includes a display panel, a driving controller and a data driver. The driving controller processes input image data according to a variable input frequency and generates a data signal having a varied frame length. The data driver converts the data signal into a data voltage and outputs the data voltage to the display panel. The driving controller determines a variable frequency mode and generates an asymmetric data signal including a positive data signal and a negative data signal which are asymmetric with respect to a common voltage for a same grayscale value in the variable frequency mode.
    Type: Application
    Filed: March 11, 2021
    Publication date: September 16, 2021
    Inventors: Tae Hyeong AN, Hoi Sik MOON, Yoon Gu KIM, Jin Pil KIM, Jae Sung BAE, Nam Jae LIM, Ik Hyun AHN, Seung Young CHOI
  • Patent number: 11089624
    Abstract: A method and an apparatus for allocating uplink resources includes transmitting an uplink grant (UL Grant) for an unlicensed component carrier (UCC) to a plurality of terminals, wherein the UL Grant for a first terminal among the plurality of terminals includes a resource allocation information in which a transmission timing of the uplink data of a second terminal among the plurality of terminals is considered.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: August 10, 2021
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Eunkyung Kim, Chanho Yoon, Seung-Kwon Baek, Wooram Shin, Kwang Jae Lim, Young Jo Ko
  • Publication number: 20210158606
    Abstract: Disclosed herein are an apparatus and method for generating a 3D model. The apparatus for generating a 3D model includes one or more processors, and an execution memory for storing at least one program that is executed by the one or more processors, wherein the at least one program is configured to receive two-dimensional (2D) original image layers for respective viewpoints, and generate pieces of 2D original image information for respective objects by performing original image alignment on the 2D original image layers for respective viewpoints for each predefined object type, generate 3D model layers for respective objects from the pieces of 2D original image information for respective objects using multiple learning models corresponding to the predefined object types, and generate a 3D model by synthesizing the 3D model layers for respective objects.
    Type: Application
    Filed: November 17, 2020
    Publication date: May 27, 2021
    Inventors: Seung-Wook LEE, Ki-Nam KIM, Tae-Joon KIM, Seung-Uk YOON, Seong-Jae LIM, Bon-Woo HWANG, Chang-Joon PARK
  • Publication number: 20210136280
    Abstract: Disclosed herein are an apparatus and method for guiding multi-view capture. The apparatus for guiding multi-view capture includes one or more processors and an execution memory for storing at least one program that is executed by the one or more processors, wherein the at least one program is configured to receive a single-view two-dimensional (2D) image obtained by capturing an image of an object of interest through a camera, generate an orthographic projection image and a perspective projection image for the object of interest from the single-view 2D image using an image conversion parameter that is previously learned from multi-view 2D images for the object of interest, generate a 3D silhouette model for the object of interest using the orthographic projection image and the perspective projection image, and output the 3D silhouette model and a guidance interface for the 3D silhouette model.
    Type: Application
    Filed: October 30, 2020
    Publication date: May 6, 2021
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Seong-Jae LIM, Ki-Nam KIM, Tae-Joon KIM, Seung-Uk YOON, Seung-Wook LEE, Bon-Woo HWANG
  • Patent number: 10940713
    Abstract: A thermochromic writing instrument capable of causing curiosity and interest of a user by configuring an eraser to be easily separated from the main body of the thermochromic writing instrument and to be shaped into various character dolls. A rotation member is inserted into a pen body and a hollow upper cover is detachably coupled to an outside of the upper portion of the pen body, a first eraser is connected to the rotation member by a connection member, a connection portion of an operation member is disposed in a groove formed at one side of the side wall of the pen body, the first body portion of the operation member is inserted into the pen body and a clip portion of the operation member is exposed to the outside of the pen body.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: March 9, 2021
    Assignee: Heemangnote Co., Ltd.
    Inventor: Seung Jae Lim