Abstract: A printed circuit board includes a coreless substrate including an insulating body and a plurality of core wiring layers disposed on or within the insulating body, a build-up insulating layer covering at least a portion of each of an upper surface and a lower surface of the coreless substrate, and a build-up wiring layer disposed on at least one of an upper surface and a lower surface of the build-up insulating layer. A through-opening penetrates through the insulating body and is configured to receive an electronic component therein, and the first build-up insulating layer extends into the through-opening to embed the electronic component.

Abstract: Provided is a liquid crystal display comprising: a liquid crystal cell; an upper polarizing plate provided on one surface of the liquid crystal cell and including a first polarizer and a low moisture-permeable film disposed on one surface of the first polarizer so as to face the liquid crystal cell; and a lower polarizing plate provided on the other surface of the liquid crystal cell and including a second polarizer, wherein a ratio of a shrinkage force in a direction parallel to the absorption axis of the second polarizer of the low moisture-permeable film to a shrinkage force in an absorption-axial direction of the second polarizer is 30% or more.

Abstract: Provided is a polarizing plate and a display device. The polarizing plate has excellent durability against an external environment, for example, moisture, due to a protective film of a polarizer, and can prevent color distortion upon observation with polarized sunglasses, and a display device comprising the polarizing plate.

Abstract: A fan-out sensor package includes: a redistribution portion having a through-hole and including a wiring layer and vias; a first semiconductor chip having an active surface having a sensing region of which at least a portion is exposed through the through-hole and first connection pads disposed in the vicinity of the sensing region; a second semiconductor chip disposed side by side with the first semiconductor chip in a horizontal direction and having second connection pads; dam members disposed in the vicinity of the first connection pads; an encapsulant encapsulating the redistribution portion, the first semiconductor chip, and the second semiconductor chip; and electrical connection structures electrically connecting the first connection pads and the second connection pads to the wiring layer or the vias of the redistribution portion.

Abstract: A fan-out sensor package includes: a sensor chip having a first connection pads and an optical layer; an encapsulant encapsulating at least portions of the sensor chip; a connection member disposed on the sensor chip and the encapsulant and including a redistribution layer electrically connected to the first connection pads; through-wirings penetrating through the encapsulant and electrically connected to the redistribution layer; and electrical connection structures disposed on the other surface of the encapsulant opposing one surface of the encapsulant on which the connection member is disposed and electrically connected to the through-wirings, wherein the sensor chip and the connection member are physically spaced apart from each other by a predetermined distance, and the first connection pads and the redistribution layer are electrically connected to each other through first connectors disposed between the sensor chip and the connection member.