Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including first and second wiring layer disposed on different levels; a first semiconductor chip disposed in the first through-hole; a second semiconductor chip disposed on the first semiconductor chip in the first through-hole so that a second inactive surface faces a first inactive surface; conductive wires disposed on the core member and a second active surface and electrically connecting second connection pads and the second wiring layer to each other; an encapsulant covering at least portions of the core member, the first semiconductor chip, the second semiconductor chip, and the conductive wires and filling at least portions of the first through-hole; and a connection member disposed on the core member and a first active surface and electrically connecting first connection pads and the first wiring layer to each other.

Abstract: A fan-out sensor package includes: a redistribution portion having a through-hole and including a wiring layer and vias; a first semiconductor chip having an active surface having a sensing region of which at least a portion is exposed through the through-hole and first connection pads disposed in the vicinity of the sensing region; a second semiconductor chip disposed side by side with the first semiconductor chip in a horizontal direction and having second connection pads; dam members disposed in the vicinity of the first connection pads; an encapsulant encapsulating the redistribution portion, the first semiconductor chip, and the second semiconductor chip; and electrical connection structures electrically connecting the first connection pads and the second connection pads to the wiring layer or the vias of the redistribution portion.

Abstract: A fan-out sensor package includes: a sensor chip having a first connection pads and an optical layer; an encapsulant encapsulating at least portions of the sensor chip; a connection member disposed on the sensor chip and the encapsulant and including a redistribution layer electrically connected to the first connection pads; through-wirings penetrating through the encapsulant and electrically connected to the redistribution layer; and electrical connection structures disposed on the other surface of the encapsulant opposing one surface of the encapsulant on which the connection member is disposed and electrically connected to the through-wirings, wherein the sensor chip and the connection member are physically spaced apart from each other by a predetermined distance, and the first connection pads and the redistribution layer are electrically connected to each other through first connectors disposed between the sensor chip and the connection member.

Abstract: A fan-out semiconductor package includes: a core member having a first through-hole and including first and second wiring layer disposed on different levels; a first semiconductor chip disposed in the first through-hole; a second semiconductor chip disposed on the first semiconductor chip in the first through-hole so that a second inactive surface faces a first inactive surface; conductive wires disposed on the core member and a second active surface and electrically connecting second connection pads and the second wiring layer to each other; an encapsulant covering at least portions of the core member, the first semiconductor chip, the second semiconductor chip, and the conductive wires and filling at least portions of the first through-hole; and a connection member disposed on the core member and a first active surface and electrically connecting first connection pads and the first wiring layer to each other.

Abstract: A lamp socket including a socket terminal, a backlight assembly having the lamp socket and a display device having the backlight assembly are provided. The socket terminal includes a base part, an extending part, a stopper part, an electrode insertion part and a wire connection member. The extending part is extended from the base part, is angled with respect to the base part, and includes a space to receive an electrode of a lamp. The stopper part extends from the extending part and isolates the space at an end of the extending part. The electrode insertion part is extended from the stopper part, wherein application of pressure on the electrode insertion part separates sides of the stopper part to provide access to the space. The wire connection member is extended from the base part.

Abstract: A lamp socket, a liquid crystal display, and a method of manufacturing the same, which facilitate assembly and testing of a lamp. The lamp socket includes a housing including connection terminals electrically connected to lamp terminals, a cover hinge-engaged with the housing, a fixing part fixing the housing and the cover to each other, and an angle maintenance part maintaining an angle of the cover in an open position, wherein the angle is an acute angle.

Abstract: A backlight assembly includes a lamp which generates light, a lamp socket which receives the lamp, an alignment plate including a socket insertion hole formed therethrough to receive the lamp socket, and a receiving container including a cutout portion formed therethrough to receive the lamp socket. The receiving container is attached to the alignment plate which has the lamp socket inserted through the socket insertion hole, and a portion of the lamp socket is exposed outside the receiving container through the socket insertion hole when the receiving container is attached to the alignment plate.

Abstract: A lamp socket including a socket terminal, a backlight assembly having the lamp socket and a display device having the backlight assembly are provided. The socket terminal includes a base part, an extending part, a stopper part, an electrode insertion part and a wire connection member, The extending part is extended from the base part, is angled with respect to the base part, and includes a space to receive an electrode of a lamp. The stopper part extends from the extending part and isolates the space at an end of the extending part. The electrode insertion part is extended from the stopper part, wherein application of pressure on the electrode insertion part separates sides of the stopper part to provide access to the space. The wire connection member is extended from the base part.

Abstract: A display device includes a liquid crystal display panel, a light source unit and a housing accommodating the light source unit. The light source unit includes a light source part and a light source supporting member supporting the light source part. The housing includes an insertion accommodating part provided in a bottom surface of the housing. The light source supporting member includes a planar main body, a light source holder and an insertion part protruding from the main body toward the housing to be coupled to the insertion accommodating part. The insertion part includes an engagement part and a connecting part. The insertion part is inserted in the insertion accommodating part and the light source supporting member is rotated at a predetermined angle.

Abstract: A printed circuit board assembly and a liquid crystal display (“LCD”) having the same, and more particularly, to a printed circuit board assembly, wherein a board mounted with a heat dissipation plate and a time controller using a spring clip or a hook spring can prevent the board from sagging. An exemplary embodiment includes a heat dissipation plate, a protection plate and a thermal interface material to dissipate heat from a time controller, thereby efficiently dissipating heat from the time controller. Another exemplary embodiment includes a spring clip or a hook spring to increase contact forces among a protection plate, a heat dissipation plate and a board, thereby further improving heat dissipation performance.

Abstract: Disclosed herein is a method of manufacturing a copper-clad laminate for Via-On-Pad application. The pad includes the steps of providing a first copper foil layer and a second copper foil layer, on the first surfaces of which protective layers are formed; placing two sets of a first copper foil layer, an insulating layer and a second copper foil layer above and below an adhesive layer, respectively; removing the protective layers, which have been respectively formed on the second copper foil layers, and parts of the second copper foil layers; forming via holes by removing parts of the insulating layers through the regions from which the parts of the second copper foil layers have been removed, using laser processing; and forming two copper-clad laminates by removing the protective layers, which have been respectively formed on one surface of one first copper foil layer and one surface of the other first copper foil layer, and the adhesive layer.

Abstract: Disclosed herein are a media signal sink (100) having a graphic user interface (GUI) function and a method for displaying devices connected thereto. In a method for operating a media signal sink (100) connected with one or more signal sources (200,202,204,206,208) each having one or more devices, the display method includes checking connection states of the signal sources (200,202,204,206,208) to the signal sink (100), and displaying menu items of the devices of the signal sources (200,202,204,206,208) connected to the signal sink (100) in a GUI screen, based on a result of the connection state check. In the GUI screen, menu items of the same type of devices, among the devices of the signal sources (200,202,204,206,208), are displayed under the condition that they are grouped into one group. Also, in the GUI screen, menu items of devices corresponding to the same type of signal sources are displayed under the condition that they are grouped into one group.

Abstract: A backlight assembly includes a lamp which generates light, a lamp socket which receives the lamp, an alignment plate including a socket insertion hole formed therethrough to receive the lamp socket, and a receiving container including a cutout portion formed therethrough to receive the lamp socket. The receiving container is attached to the alignment plate which has the lamp socket inserted through the socket insertion hole, and a portion of the lamp socket is exposed outside the receiving container through the socket insertion hole when the receiving container is attached to the alignment plate.

Abstract: A lamp socket, a liquid crystal display, and a method of manufacturing the same,, which facilitate assembly and testing of a lamp. The lamp socket includes a housing including connection terminals electrically connected to lamp terminals, a cover hinge-engaged with the housing, a fixing part fixing the housing and the cover to each other, and an angle maintenance part maintaining an angle of the cover in an open position, wherein the angle is an acute angle.

Abstract: A printed circuit board assembly and a liquid crystal display (“LCD”) having the same, and more particularly, to a printed circuit board assembly, wherein a board mounted with a heat dissipation plate and a time controller using a spring clip or a hook spring can prevent the board from sagging. An exemplary embodiment includes a heat dissipation plate, a protection plate and a thermal interface material to dissipate heat from a time controller, thereby efficiently dissipating heat from the time controller. Another exemplary embodiment includes a spring clip or a hook spring to increase contact forces among a protection plate, a heat dissipation plate and a board, thereby further improving heat dissipation performance.

Abstract: Disclosed is a ball grid array (BGA) package substrate, in which a wire bonding pad and a solder ball pad are formed on a via hole, making high freedom in design of a circuit pattern and a high density circuit pattern possible, and a method of fabricating the same.