Patents by Inventor Jairus Legaspi Pisigan

Jairus Legaspi Pisigan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFINGER
    Publication number: 20080303123
    Abstract: An integrated circuit package system includes: providing a lead terminal; forming a dummy lead near the lead terminal; positioning a base integrated circuit adjacent the lead terminal and the dummy lead; connecting a die connector to the base integrated circuit and the dummy lead; mounting a stackable integrated circuit over the base integrated circuit; and connecting another of the die connector to the stackable integrated circuit and the dummy lead.
    Type: Application
    Filed: June 5, 2008
    Publication date: December 11, 2008
    Inventors: Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Jairus Legaspi Pisigan, Jeffrey D. Punzalan
  • INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADED PACKAGE
    Publication number: 20080303122
    Abstract: An integrated circuit package system includes: providing a frame; attaching a leaded package having leads adjacent the frame wherein the leads extend towards a side opposite the frame; and applying a package encapsulant over the leaded package having the leads partially exposed opposite the frame.
    Type: Application
    Filed: June 3, 2008
    Publication date: December 11, 2008
    Inventors: Zigmund Ramirez Camacho, Jairus Legaspi Pisigan, Henry Descalzo Bathan, Lionel Chien Hui Tay