Patents by Inventor James J. Cordingley
James J. Cordingley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7382389Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.Type: GrantFiled: November 7, 2006Date of Patent: June 3, 2008Assignee: GSI Lumonics CorporationInventors: James J. Cordingley, Jonathan S. Ehrmann, David M. Filgas, Shepard D. Johnson, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
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Patent number: 7192846Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.Type: GrantFiled: May 9, 2005Date of Patent: March 20, 2007Assignee: GSI Group CorporationInventors: James J. Cordingley, Roger D. Dowd, Jonathan S. Ehrmann, Joseph J. Griffiths, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
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Patent number: 7148447Abstract: A precision, laser-based method and system for high-speed, sequential processing of material of targets within a field are disclosed that control the irradiation distribution pattern of imaged spots. For each spot, a laser beam is incident on a first anamorphic optical device and a second anamorphic optical device so that the beam is controllably modified into an elliptical irradiance pattern. The modified beam is propagated through a scanning optical system with an objective lens to image a controlled elliptical spot on the target. In one embodiment, the relative orientations of the devices along an optical axis are controlled to modify the beam irradiance pattern to obtain an elliptical shape while the absolute orientation of the devices controls the orientation of the elliptical spot.Type: GrantFiled: January 16, 2006Date of Patent: December 12, 2006Assignee: GSI Group CorporationInventors: Jonathan S. Ehrmann, James J. Cordingley, Donald V. Smart, Donald J. Svetkoff
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Patent number: 7027155Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.Type: GrantFiled: March 27, 2002Date of Patent: April 11, 2006Assignee: GSI Lumonics CorporationInventors: James J. Cordingley, Joseph J. Griffiths, Donald V. Smart
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Patent number: 6989508Abstract: A precision, laser-based method and system for high-speed, sequential processing of material of targets within a field are disclosed that control the irradiation distribution pattern of imaged spots. For each spot, a laser beam is incident on a first anamorphic optical device and a second anamorphic optical device so that the beam is controllably modified into an elliptical irradiance pattern. The modified beam is propagated through a scanning optical system with an objective lens to image a controlled elliptical spot on the target. In one embodiment, the relative orientations of the devices along an optical axis are controlled to modify the beam irradiance pattern to obtain an elliptical shape while the absolute orientation of the devices controls the orientation of the elliptical spot.Type: GrantFiled: July 30, 2004Date of Patent: January 24, 2006Assignee: GSI Group CorporationInventors: Jonathan S. Ehrmann, James J. Cordingley, Donald V. Smart, Donald J. Svetkoff
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Patent number: 6987786Abstract: A laser polarization control apparatus includes a polarization modifying device, such as a liquid crystal variable retarder, and a controller. The polarization modifying device receives a laser beam and modifies the polarization of the laser beam. The controller, which is connected to the polarization modifying device, adjusts an input to the polarization modifying device in order to control modification of the polarization of the laser beam based on alignment of a structure to be processed by the laser beam. For example, the polarization of the laser beam may be rotated to correspond with the alignment of a link in a semiconductor device to be cut by the laser beam. The polarization modifying device is configured for incorporation into a laser processing system that produces the laser beam received by the polarization modifying device and that focuses the laser beam modified by the polarization modifying device onto a workpiece that includes the structure to be processed by the laser beam.Type: GrantFiled: December 13, 2001Date of Patent: January 17, 2006Assignee: GSI Group CorporationInventors: James J. Cordingley, Donald V. Smart, Michael Plotkin, Joohan Lee, William Lauer, Jonathan S. Ehrmann
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Patent number: 6777645Abstract: A precision, laser-based method and system for high-speed, sequential processing of material of targets within a field are disclosed that control the irradiation distribution pattern of imaged spots. For each spot, a laser beam is incident on a first anamorphic optical device and a second anamorphic optical device so that the beam is controllably modified into an elliptical irradiance pattern. The modified beam is propagated through a scanning optical system with an objective lens to image a controlled elliptical spot on the target. In one embodiment, the relative orientations of the devices along an optical axis are controlled to modify the beam irradiance pattern to obtain an elliptical shape while the absolute orientation of the devices controls the orientation of the elliptical spot.Type: GrantFiled: March 27, 2002Date of Patent: August 17, 2004Assignee: GSI Lumonics CorporationInventors: Jonathan S. Ehrmann, James J. Cordingley, Donald V. Smart, Donald J. Svetkoff
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Publication number: 20040134896Abstract: A laser-based method of removing a target link structure of a circuit fabricated on a substrate includes generating a pulsed laser output at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.Type: ApplicationFiled: October 10, 2003Publication date: July 15, 2004Inventors: Bo Gu, Donald V. Smart, James J. Cordingley, Joohan Lee, Donald J. Svetkoff, Shepard D. Johnson, Jonathan S. Ehrmann
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Publication number: 20040134894Abstract: A laser-based system for processing target material within a microscopic region without causing undesirable changes in electrical or physical characteristics of at least one material surrounding the target material, the system includes a seed laser, an optical amplifier, and a beam delivery system. The seed laser for generating a sequence of laser pulses having a first pre-determined wavelength. The optical amplifier for amplifying at least a portion of the sequence of pulses to obtain an amplified sequence of output pulses. The beam delivery system for delivering and focusing at least one pulse of the amplified sequence of pulses onto the target material. The at least one output pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond. The pulse duration being within a thermal processing range.Type: ApplicationFiled: October 10, 2003Publication date: July 15, 2004Inventors: Bo Gu, Donald V. Smart, James J. Cordingley, Joohan Lee, Donald J. Svetkoff, Shepard D. Johnson, Jonathan S. Ehrmann
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Patent number: 6639177Abstract: A method and system for processing at least one microstructure which is part of a multi-material device containing a plurality of microstructures is provided. The at least one microstructure has a designated region for target material removal. The method includes generating a laser beam, modifying the laser beam to obtain a modified laser beam, and sequentially and relatively positioning the modified laser beam into at least one non-round spot having a predetermined non-round energy distribution on the designated region to remove the target material in the designated region. The predetermined non-round energy distribution covers an area of the designated region such that energy is more efficiently coupled into the designated region for the non-round energy distribution than energy coupled into the designated region for a round energy distribution covering the same area.Type: GrantFiled: March 27, 2002Date of Patent: October 28, 2003Assignee: GSI Lumonics CorporationInventors: Jonathan S. Ehrmann, James J. Cordingley, Donald V. Smart, Donald J. Svetkoff
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Publication number: 20020170898Abstract: A precision, laser-based method and system for high-speed, sequential processing of material of targets within a field are disclosed that control the irradiation distribution pattern of imaged spots. For each spot, a laser beam is incident on a first anamorphic optical device and a second anamorphic optical device so that the beam is controllably modified into an elliptical irradiance pattern. The modified beam is propagated through a scanning optical system with an objective lens to image a controlled elliptical spot on the target. In one embodiment, the relative orientations of the devices along an optical axis are controlled to modify the beam irradiance pattern to obtain an elliptical shape while the absolute orientation of the devices controls the orientation of the elliptical spot.Type: ApplicationFiled: March 27, 2002Publication date: November 21, 2002Inventors: Jonathan S. Ehrmann, James J. Cordingley, Donald V. Smart, Donald J. Svetkoff
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Publication number: 20020167581Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.Type: ApplicationFiled: March 27, 2002Publication date: November 14, 2002Inventors: James J. Cordingley, Jonathan S. Ehrmann, David M. Filgas, Shepard D. Johnson, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
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Publication number: 20020166845Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.Type: ApplicationFiled: March 27, 2002Publication date: November 14, 2002Inventors: James J. Cordingley, Joseph J. Griffiths, Donald V. Smart
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Publication number: 20020162973Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.Type: ApplicationFiled: March 27, 2002Publication date: November 7, 2002Inventors: James J. Cordingley, Roger D. Dowd, Jonathan S. Ehrmann, Joseph J. Griffiths, Joohan Lee, Donald V. Smart, Donald J. Svetkoff
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Publication number: 20020158052Abstract: A method and system for processing at least one microstructure which is part of a multi-material device containing a plurality of microstructures is provided. The at least one microstructure has a designated region for target material removal. The method includes generating a laser beam, modifying the laser beam to obtain a modified laser beam, and sequentially and relatively positioning the modified laser beam into at least one non-round spot having a predetermined non-round energy distribution on the designated region to remove the target material in the designated region. The predetermined non-round energy distribution covers an area of the designated region such that energy is more efficiently coupled into the designated region for the non-round energy distribution than energy coupled into the designated region for a round energy distribution covering the same area.Type: ApplicationFiled: March 27, 2002Publication date: October 31, 2002Inventors: Jonathan S. Ehrmann, James J. Cordingley, Donald V. Smart, Donald J. Svetkoff
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Publication number: 20020141473Abstract: A laser polarization control apparatus includes a polarization modifying device, such as a liquid crystal variable retarder, and a controller. The polarization modifying device receives a laser beam and modifies the polarization of the laser beam. The controller, which is connected to the polarization modifying device, adjusts an input to the polarization modifying device in order to control modification of the polarization of the laser beam based on alignment of a structure to be processed by the laser beam. For example, the polarization of the laser beam may be rotated to correspond with the alignment of a link in a semiconductor device to be cut by the laser beam. The polarization modifying device is configured for incorporation into a laser processing system that produces the laser beam received by the polarization modifying device and that focuses the laser beam modified by the polarization modifying device onto a workpiece that includes the structure to be processed by the laser beam.Type: ApplicationFiled: December 13, 2001Publication date: October 3, 2002Applicant: General Scanning, Inc.Inventors: James J. Cordingley, Donald V. Smart, Michael Plotkin, Joohan Lee, William Lauer, Jonathan S. Ehrmann
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Patent number: 6381259Abstract: A laser polarization control apparatus includes a polarization modifying device and a controller. The polarization modifying device receives a laser beam and modifies the polarization of the laser beam. The controller adjusts an input to the polarization modifying device in order to control modification of the polarization of the laser beam based on alignment of a structure to be processed by the laser beam. The polarization modifying device is configured for incorporation into a laser processing system that produces the laser beam received by the polarization modifying device and that focuses the laser beam modified by the polarization modifying device onto a workpiece that includes the structure to be processed by the laser beam. An analyzer tool receives the laser beam modified by the polarization modification device and measures the modification of the polarization of the laser beam by the polarization modification device.Type: GrantFiled: January 29, 2001Date of Patent: April 30, 2002Assignee: General Scanning, Inc.Inventors: James J. Cordingley, Donald V. Smart, Michael Plotkin, William Lauer
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Publication number: 20010010699Abstract: A laser polarization control apparatus includes a polarization modifying device, such as a liquid crystal variable retarder, and a controller. The polarization modifying device receives a laser beam and modifies the polarization of the laser beam. The controller, which is connected to the polarization modifying device, adjusts an input to the polarization modifying device in order to control modification of the polarization of the laser beam based on alignment of a structure to be processed by the laser beam. For example, the polarization of the laser beam may be rotated to correspond with the alignment of a link in a semiconductor device to be cut by the laser beam. The polarization modifying device is configured for incorporation into a laser processing system that produces the laser beam received by the polarization modifying device and that focuses the laser beam modified by the polarization modifying device onto a workpiece that includes the structure to be processed by the laser beam.Type: ApplicationFiled: January 29, 2001Publication date: August 2, 2001Inventors: James J. Cordingley, Donald V. Smart, Michael Plotkin, William Lauer
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Patent number: 6181728Abstract: A laser polarization control apparatus includes a polarization modifying device, such as a liquid crystal variable retarder, and a controller. The polarization modifying device receives a laser beam and modifies the polarization of the laser beam. The controller, which is connected to the polarization modifying device, adjusts an input to the polarization modifying device in order to control modification of the polarization of the laser beam based on alignment of a structure to be processed by the laser beam. For example, the polarization of the laser beam may be rotated to correspond with the alignment of a link in a semiconductor device to be cut by the laser beam. The polarization modifying device is configured for incorporation into a laser processing system that produces the laser beam received by the polarization modifying device and that focuses the laser beam modified by the polarization modifying device onto a workpiece that includes the structure to be processed by the laser beam.Type: GrantFiled: July 2, 1998Date of Patent: January 30, 2001Assignee: General Scanning, Inc.Inventors: James J. Cordingley, Donald V. Smart, Michael Plotkin, William Lauer
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Patent number: 5300756Abstract: A method for severing integrated-circuit conductive links by laser power employs a phase plate (26) to shape the laser beam's intensity profile. The profile thus imparted to the beam approximates the Fourier transform of the intensity profile desired on the workpiece (34). As a consequence, when a focusing lens (32) receives a beam having the profile imparted by the phase plate (26), it focuses that beam into a spot on the workpiece (34) having an intensity profile more desirable than the ordinary Gaussian laser-beam profile.Type: GrantFiled: October 22, 1991Date of Patent: April 5, 1994Assignee: General Scanning, Inc.Inventor: James J. Cordingley