Patents by Inventor James R. Rozen

James R. Rozen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Coaxial transmission line slot filter with absorptive matrix
    Patent number: 10756410
    Abstract: A filter is provided and includes potting material formed into a body defining a through-hole. The body includes first and second opposing faces and a sidewall extending between the first and second opposing faces. The sidewall is formed to define first and second openings at opposite ends of the through-hole, first angles at an interface between the sidewall and the first face and second angles, which complement the first angles, at an interface between the sidewall and the second face.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: August 25, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David W. Abraham, Antonio D. Corcoles Gonzalez, James R. Rozen
  • Modular array of vertically integrated superconducting qubit devices for scalable quantum computing
    Patent number: 10304005
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: May 28, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • Modular array of vertically integrated superconducting qubit devices for scalable quantum computing
    Patent number: 10304004
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: May 28, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • Read out of quantum states of microwave frequency qubits with optical frequency photons
    Patent number: 10295582
    Abstract: Techniques relate to reading a qubit coupled to a microwave resonator. A microwave signal at a microwave resonator frequency is input to the microwave resonator that couples to the qubit. A microwave readout signal from the microwave resonator is output to a microwave to optical converter. The microwave readout signal includes a qubit state of the qubit. The microwave to optical converter is configured to convert the microwave readout signal to an optical signal. In response to the optical signal being output by the microwave to optical converter, it is determined that the qubit is in a predefined qubit state. In response to no optical signal being output by the microwave to optical converter, it is determined that the qubit is not in the predefined qubit state.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: May 21, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Lev S. Bishop, Jay M. Gambetta, Jason S. Orcutt, Hanhee Paik, James R. Rozen
  • Modular array of vertically integrated superconducting qubit devices for scalable quantum computing
    Patent number: 10289960
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: May 14, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • Modular array of vertically integrated superconducting qubit devices for scalable quantum computing
    Patent number: 10169714
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: January 1, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING
    Publication number: 20180232655
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Application
    Filed: April 6, 2018
    Publication date: August 16, 2018
    Inventors: Jerry M. CHOW, Jay M. GAMBETTA, Mary B. ROTHWELL, James R. ROZEN
  • MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING
    Publication number: 20180137429
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Application
    Filed: January 15, 2018
    Publication date: May 17, 2018
    Inventors: Jerry M. CHOW, Jay M. GAMBETTA, Mary B. ROTHWELL, James R. ROZEN
  • MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING
    Publication number: 20180137430
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Application
    Filed: January 15, 2018
    Publication date: May 17, 2018
    Inventors: Jerry M. CHOW, Jay M. GAMBETTA, Mary B. ROTHWELL, James R. ROZEN
  • Modular array of vertically integrated superconducting qubit devices for scalable quantum computing
    Patent number: 9953269
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: April 24, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • Method of assembling microwave connector with filtering properties having outer and inner conductors
    Patent number: 9948050
    Abstract: A microwave connector is provided. The microwave connector includes an outer conductor, an inner conductor disposed within the outer conductor and dielectric materials interposed between the outer conductor and the inner conductor, the dielectric materials including a non-dissipative dielectric material and a dissipative dielectric material.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: April 17, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David W. Abraham, Antonio D. Corcoles Gonzalez, James R. Rozen
  • COAXIAL TRANSMISSION LINE SLOT FILTER WITH ABSORPTIVE MATRIX
    Publication number: 20180069289
    Abstract: A filter is provided and includes potting material formed into a body defining a through-hole. The body includes first and second opposing faces and a sidewall extending between the first and second opposing faces. The sidewall is formed to define first and second openings at opposite ends of the through-hole, first angles at an interface between the sidewall and the first face and second angles, which complement the first angles, at an interface between the sidewall and the second face.
    Type: Application
    Filed: November 13, 2017
    Publication date: March 8, 2018
    Inventors: David W. Abraham, Antonio D. Corcoles Gonzalez, James R. Rozen
  • READ OUT OF QUANTUM STATES OF MICROWAVE FREQUENCY QUBITS WITH OPTICAL FREQUENCY PHOTONS
    Publication number: 20180003753
    Abstract: Techniques relate to reading a qubit coupled to a microwave resonator. A microwave signal at a microwave resonator frequency is input to the microwave resonator that couples to the qubit. A microwave readout signal from the microwave resonator is output to a microwave to optical converter. The microwave readout signal includes a qubit state of the qubit. The microwave to optical converter is configured to convert the microwave readout signal to an optical signal. In response to the optical signal being output by the microwave to optical converter, it is determined that the qubit is in a predefined qubit state. In response to no optical signal being output by the microwave to optical converter, it is determined that the qubit is not in the predefined qubit state.
    Type: Application
    Filed: June 30, 2016
    Publication date: January 4, 2018
    Inventors: Lev S. Bishop, Jay M. Gambetta, Jason S. Orcutt, Hanhee Paik, James R. Rozen
  • Method of forming a coaxial transmission line slot filter with absorptive matrix
    Patent number: 9847568
    Abstract: A filter is provided and includes potting material formed into a body defining a through-hole. The body includes first and second opposing faces and a sidewall extending between the first and second opposing faces. The sidewall is formed to define first and second openings at opposite ends of the through-hole, first angles at an interface between the sidewall and the first face and second angles, which complement the first angles, at an interface between the sidewall and the second face.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: December 19, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David W. Abraham, Antonio D. Corcoles Gonzalez, James R. Rozen
  • MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING
    Publication number: 20170213143
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Application
    Filed: June 7, 2016
    Publication date: July 27, 2017
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING
    Publication number: 20170061317
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Application
    Filed: November 9, 2016
    Publication date: March 2, 2017
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • Removal of spurious microwave modes via flip-chip crossover
    Patent number: 9531055
    Abstract: A coplanar waveguide device includes a coplanar waveguide structure disposed on a substrate, at least one qubit coupled to the coplanar waveguide structure and an add-on chip having a metallized trench, and disposed over the substrate.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: December 27, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David W. Abraham, Jerry M. Chow, Antonio D. Corcoles Gonzalez, George A. Keefe, Mary E. Rothwell, James R. Rozen, Matthias Steffen
  • Modular array of vertically integrated superconducting qubit devices for scalable quantum computing
    Patent number: 9524470
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: December 20, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING
    Publication number: 20160364653
    Abstract: A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
    Type: Application
    Filed: June 12, 2015
    Publication date: December 15, 2016
    Inventors: Jerry M. Chow, Jay M. Gambetta, Mary B. Rothwell, James R. Rozen
  • Method of fabricating a coplanar waveguide device including removal of spurious microwave modes via flip-chip crossover
    Patent number: 9455392
    Abstract: A coplanar waveguide device includes a coplanar waveguide structure disposed on a substrate, at least one qubit coupled to the coplanar waveguide structure and an add-on chip having a metallized trench, and disposed over the substrate.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: September 27, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David W. Abraham, Jerry M. Chow, Antonio D. Corcoles Gonzalez, George A. Keefe, Mary E. Rothwell, James R. Rozen, Matthias Steffen