Abstract: A coplanar waveguide device includes a coplanar waveguide structure disposed on a substrate, at least one qubit coupled to the coplanar waveguide structure and an add-on chip having a metallized trench, and disposed over the substrate.

Abstract: A coplanar waveguide device includes a coplanar waveguide structure disposed on a substrate, at least one qubit coupled to the coplanar waveguide structure and an add-on chip having a metallized trench, and disposed over the substrate.

Abstract: A filter is provided and includes potting material formed into a body defining a through-hole. The body includes first and second opposing faces and a sidewall extending between the first and second opposing faces. The sidewall is formed to define first and second openings at opposite ends of the through-hole, first angles at an interface between the sidewall and the first face and second angles, which complement the first angles, at an interface between the sidewall and the second face.

Abstract: A microwave connector is provided. The microwave connector includes an outer conductor, an inner conductor disposed within the outer conductor and dielectric materials interposed between the outer conductor and the inner conductor, the dielectric materials including a non-dissipative dielectric material and a dissipative dielectric material.

Abstract: A coplanar waveguide device includes a coplanar waveguide structure disposed on a substrate, at least one qubit coupled to the coplanar waveguide structure and an add-on chip having a metallized trench, and disposed over the substrate.

Abstract: A microwave connector is provided. The microwave connector includes an outer conductor, an inner conductor disposed within the outer conductor and dielectric materials interposed between the outer conductor and the inner conductor, the dielectric materials including a non-dissipative dielectric material and a dissipative dielectric material.

Abstract: A filter is provided and includes potting material formed into a body defining a through-hole. The body includes first and second opposing faces and a sidewall extending between the first and second opposing faces. The sidewall is formed to define first and second openings at opposite ends of the through-hole, first angles at an interface between the sidewall and the first face and second angles, which complement the first angles, at an interface between the sidewall and the second face.

Abstract: An apparatus and method for manufacturing a superconducting low-pass filter for quantum computing devices. The apparatus includes a plurality of containers and input and output ports connected to opposite ends of the apparatus. A plurality of coils of superconducting wire are wound using a mandrel. An adhesive is applied to the coils for maintaining a wound state. Each of the coils are positioned in each of the containers and electrically connected to each other with at least one coil being connected to the input port and at least one coil being connected to the output port. The coils are released or expanded from their wound state using an adhesive solvent. The containers are then filled with a conductive polymer and the containers are closed with one or more covers.

Abstract: An improved persistent current switch design and method of operation are disclosed. By way of example, a persistent current switch circuit comprises a heating element and a switch element located proximate to the heating element, the switch element being substantially formed from a material (by way of example only, titanium) which exhibits a superconducting temperature value below a superconducting temperature value exhibited by a material (by way of example only, aluminum) used to provide a connection to the switch element. The switch element is responsive to the heating element such that the heating element is used to control whether or not the switch element is in a superconducting state. The switch element may also have a folded geometry. Such persistent current switches exhibit low power and low inductance.

Abstract: An apparatus and method for manufacturing a superconducting low-pass filter for quantum computing devices. The apparatus includes a plurality of containers and input and output ports connected to opposite ends of the apparatus. A plurality of coils of superconducting wire are wound using a mandrel. An adhesive is applied to the coils for maintaining a wound state. Each of the coils are positioned in each of the containers and electrically connected to each other with at least one coil being connected to the input port and at least one coil being connected to the output port. The coils are released or expanded from their wound state using an adhesive solvent. The containers are then filled with a conductive polymer and the containers are closed with one or more covers.

Abstract: A method (and structure) of coupling a qubit includes locating the qubit near a transmission line approximately at a location corresponding to a node at a predetermined frequency.

Abstract: A low pass filter having a coaxial structure of an inner conductor, an outer conductor and a metal powder composite interposed between the inner and outer conductor. Embodiments include a 50? characteristic impedance. The metal powder can be bronze, copper or other metals, mixed in an epoxy carrier.

Abstract: An improved persistent current switch design and method of operation are disclosed. By way of example, a persistent current switch circuit comprises a heating element and a switch element located proximate to the heating element, the switch element being substantially formed from a material (by way of example only, titanium) which exhibits a superconducting temperature value below a superconducting temperature value exhibited by a material (by way of example only, aluminum) used to provide a connection to the switch element. The switch element is responsive to the heating element such that the heating element is used to control whether or not the switch element is in a superconducting state. The switch element may also have a folded geometry. Such persistent current switches exhibit low power and low inductance.

Abstract: A low pass filter having a coaxial structure of an inner conductor, an outer conductor and a metal powder composite interposed between the inner and outer conductor. Embodiments include a 50? characteristic impedance. The metal powder can be bronze, copper or other metals, mixed in an epoxy carrier.

Abstract: A low pass filter having a coaxial structure of an inner conductor, an outer conductor and a metal powder composite interposed between the inner and outer conductor. Embodiments include a 50? characteristic impedance. The metal powder can be bronze, copper or other metals, mixed in an epoxy carrier.

Abstract: A fixed impedance low pass metal powder filter having a planar buried stripline geometry comprises first and second parallel ground planes spaced from one another and a central stripline spaced equal distance from the first and second parallel ground planes and parallel thereto. The space between the first and second ground planes is filled with a dielectric containing metal powder. The densities of the metal powder within the dielectric are highest near the central stripline and become less near the first and second ground planes. The dielectric is a laminated structure that comprises layers of epoxy impregnated fiberglass, layers having different densities of metal powder.

Abstract: A low pass filter having a coaxial structure of an inner conductor, an outer conductor and a metal powder composite interposed between the inner and outer conductor. Embodiments include a 50? characteristic impedance. The metal powder can be bronze, copper or other metals, mixed in an epoxy carrier.