Patents by Inventor Jane M. Shaw
Jane M. Shaw has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6929900Abstract: A structure and method for forming a tamper respondent electronic circuit enclosure that includes an integrated circuit structure, a mesh structure surrounding the integrated circuit structure, and a sealed enclosure surrounding the mesh structure. The mesh structure includes a layer of flexible dielectric having a first side and a second side, a screen-printed pattern of flexible electrically conductive first circuit lines forming a first resistor network on the first side, and a photo lithographically-formed pattern of flexible electrically conductive second circuit lines forming a second resistor network on the second side.Type: GrantFiled: November 7, 2003Date of Patent: August 16, 2005Assignee: International Business Machines CorporationInventors: Donald S. Farquhar, Claudius Feger, Voya Markovich, Konstantinos I. Papathomas, Mark D. Poliks, Jane M. Shaw, George Szeparowycz, Steve H. Weingart
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Publication number: 20040195001Abstract: A structure and method for forming a tamper respondent electronic circuit enclosure that includes an integrated circuit structure, a mesh structure surrounding the integrated circuit structure, and a sealed enclosure surrounding the mesh structure. The mesh structure includes a layer of flexible dielectric having a first side and a second side, a screen-printed pattern of flexible electrically conductive first circuit lines forming a first resistor network on the first side, and a photo lithographically-formed pattern of flexible electrically conductive second circuit lines forming a second resistor network on the second side.Type: ApplicationFiled: November 7, 2003Publication date: October 7, 2004Inventors: Donald S. Farquhar, Claudius Feger, Voya Markovich, Konstantinos I. Papathomas, Mark D. Poliks, Jane M. Shaw, George Szeparowycz, Steve H. Weingart
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Patent number: 6686539Abstract: A structure and method for forming a tamper respondent electronic circuit enclosure that includes an integrated circuit structure, a mesh structure surrounding the integrated circuit structure, and a sealed enclosure surrounding the mesh structure. The mesh structure includes a layer of flexible dielectric having a first side and a second side, a screen-printed pattern of flexible electrically conductive first circuit lines forming a first resistor network on the first side, and a photo lithographically-formed pattern of flexible electrically conductive second circuit lines forming a second resistor network on the second side.Type: GrantFiled: January 3, 2001Date of Patent: February 3, 2004Assignee: International Business Machines CorporationInventors: Donald S. Farquhar, Claudius Feger, Voya Markovich, Konstantinos I. Papathomas, Mark D. Poliks, Jane M. Shaw, George Szeparowycz, Steve H. Weingart
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Publication number: 20020084090Abstract: A structure and method for forming a tamper respondent electronic circuit enclosure that includes an integrated circuit structure, a mesh structure surrounding the integrated circuit structure, and a sealed enclosure surrounding the mesh structure. The mesh structure includes a layer of flexible dielectric having a first side and a second side, a screen-printed pattern of flexible electrically conductive first circuit lines forming a first resistor network on the first side, and a photo lithographically-formed pattern of flexible electrically conductive second circuit lines forming a second resistor network on the second side.Type: ApplicationFiled: January 3, 2001Publication date: July 4, 2002Inventors: Donald S. Farquhar, Claudius Feger, Voya Markovich, Konstantinos I. Papathomas, Mark D. Poliks, Jane M. Shaw, George Szeparowycz, Steve H. Weingart
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Patent number: 6383415Abstract: Cross-linked electrically conductive polymers, in particular electrically conductive, polyaniline are described. Dopants and substituents having pendant cross-linkable functionality are used which form a cross-linked conducting polymer network. The cross-linking functionality can be hydrogen-bonding as well as chemically polymerizable or cross-linkable. A conjugated path between chains can also be incorporated. The resulting cross-linked conducting polymers have enhanced thermal and environmental stability. The dopant cannot readily be washed out with solvents or diffuse out upon exposure to heat. In addition, the cross-linked polymers have enhanced electrical conductivity.Type: GrantFiled: November 22, 1999Date of Patent: May 7, 2002Assignee: International Business Machines CorporationInventors: Marie Angelopoulos, Jeffrey D. Gelorme, Yun Hsin Liao, Jane M. Shaw
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Patent number: 6193909Abstract: Cross-linked electrically conductive polymers, in particular electrically conductive, polyaniline are described. Dopants and substituents having pendant cross-linkable functionality are used which form a cross-linked conducting polymer network. The cross-linking functionality can be hydrogen-bonding as well as chemically polymerizable or cross-linkable. A conjugated path between chains can also be incorporated. The resulting cross-linked conducting polymers have enhanced thermal and environmental stability. The dopant cannot readily be washed out with solvents or diffuse out upon exposure to heat. In addition, the cross-linked polymers have enhanced electrical conductivity.Type: GrantFiled: February 2, 1996Date of Patent: February 27, 2001Assignee: International Business Machines CorporationInventors: Marie Angelopoulos, Jeffrey D. Gelorme, Yun Hsin Liao, Jane M. Shaw
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Patent number: 6030550Abstract: Cross-linked electrically conductive polymers, in particular electrically conductive, polyaniline are described. Dopants and substituents having pendant cross-linkable functionality are used which form a cross-linked conducting polymer network. The cross-linking functionality can be hydrogen-bonding as well as chemically polymerizable or cross-linkable. A conjugated path between chains can also be incorporated. The resulting cross-linked conducting polymers have enhanced thermal and environmental stability. The dopant cannot readily be washed out with solvents or diffuse out upon exposure to heat. In addition, the cross-linked polymers have enhanced electrical conductivity.Type: GrantFiled: February 2, 1996Date of Patent: February 29, 2000Assignee: International Business Machines CorporationInventors: Marie Angelopoulos, Jeffrey D. Gelorme, Yun Hsin Liao, Jane M. Shaw
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Patent number: 5793836Abstract: An X-ray mask pellicle is capable of protecting the X-ray mask from contaminants and the wafer from contact with the X-ray absorber material of the mask. The X-ray mask pellicle is sufficiently thin to allow X-ray exposure at the required mask to wafer gaps yet is sufficiently durable, replaceable, tough and X-ray resistant to be used in X-ray lithography. A thin (organic or inorganic) X-ray mask pellicle to be placed covering the X-ray mask pattern area is fabricated as a thin film and attached to a support ring. A selected area of the pellicle film, tailored to cover the absorber pattern in the X-ray mask, is etched to decrease its thickness to below 2 .mu.m. If the thin film of the pellicle is not itself conductive, a thin conductive film may be coated on both sides. In an alternative embodiment, the separation between the pellicle and the X-ray mask can be achieved by forming the mask with a stepped profile.Type: GrantFiled: September 6, 1996Date of Patent: August 11, 1998Assignees: International Business Machines Corporation, Lockheed Martin CorporationInventors: Juan R. Maldonado, Raul E. Acosta, Marie Angelopoulos, Fuad E. Doany, Chandrasekhar Narayan, Andrew T. S. Pomerene, Jane M. Shaw, Kurt R. Kimmel
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Patent number: 5721299Abstract: Electrically conductive and abrasion resistant polymeric compositions, methods of fabrication thereof and uses thereof are described. Admixtures of abrasion resistant materials and electrically conductive polymeric materials are formed. Many of these admixtures are light transmitting and can be used as an abrasion resistant light transmitting electrostatic discharge layers. The light transmitting discharge layer is useful as a surface coating for visual displays such as CRT screens to avoid electrostatic accumulation of dust and scratching.Type: GrantFiled: February 9, 1994Date of Patent: February 24, 1998Assignee: International Business Machines CorporationInventors: Marie Angelopoulos, Ali Afzali-Ardakani, Jack A. Dickerson, Thomas B. Pillsbury, Karl J. Puttlitz, Jane M. Shaw, Jeffrey D. Gelorme
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Patent number: 5599611Abstract: A prepreg comprising a reinforcing material impregnated with a curable material. The curable material comprises a blend of a fluorine-containing cyanate and a fluorine-containing arylene ether polymer. The cyanate is a monomer having the structureN.tbd.C--O--R--[R.sup.1 ].sub.n --O--C.tbd.Nand the fluorine containing arylene ether polymer has the structureX--R--[R.sup.1 ].sub.m --Xwherein X is any group capable of reacting with a --C.tbd.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100.The material in the cured state comprises a fluorine-containing polycyanurate network having a plurality of discrete phases of the fluorine-containing thermoplastic polymer dispersed therein.Type: GrantFiled: November 23, 1994Date of Patent: February 4, 1997Assignee: International Business Machines CorporationInventors: Ali Afzali-Ardakani, Jeffrey T. Gotro, Jeffrey C. Hedrick, Konstantinos Papathomas, Niranjan M. Patel, Jane M. Shaw, Alfred Viehbeck
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Patent number: 5599582Abstract: The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.Type: GrantFiled: June 7, 1995Date of Patent: February 4, 1997Assignee: International Business Machines CorporationInventors: Eleftherios Adamopoulos, Jungihl Kim, Kang-Wook Lee, Tae S. Oh, Terrence R. O'Toole, Sampath Purushothaman, John J. Ritsko, Jane M. Shaw, Alfred Viehbeck, George F. Walker
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Patent number: 5591285Abstract: Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns.The composite can be made conductive by irradiating it with an UV excimer laser.Type: GrantFiled: July 24, 1995Date of Patent: January 7, 1997Assignee: International Business Machines Corp.Inventors: Ali Afzali-Ardakani, Juan Ayala-Esquilin, Bodil E. Braren, Shahrokh Daijavad, Elizabeth Foster, James L. Hedrick, Jr., Jeffrey C. Hedrick, Rodney T. Hodgson, Ashit A. Mehta, Steven E. Molis, Jane M. Shaw, Stephen L. Tisdale, Alfred Viehbeck
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Patent number: 5582858Abstract: The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.Type: GrantFiled: June 7, 1995Date of Patent: December 10, 1996Assignee: International Business Machines CorporationInventors: Eleftherios Adamopoulos, Jungihl Kim, Kang-Wook Lee, Tae S. Oh, Terrence R. O'Toole, Sampath Purushothaman, John J. Ritsko, Jane M. Shaw, Alfred Viehbeck, George F. Walker
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Patent number: 5571852Abstract: Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns.The composite can be made conductive by irradiating it with an UV excimer laser.Type: GrantFiled: June 7, 1995Date of Patent: November 5, 1996Assignee: International Business Machines CorporationInventors: Ali Afzali-Ardakani, Juan Ayala-Esquilin, Bodil E. Braren, Shahrokh Daijavad, Elizabeth Foster, James L. Hedrick, Jr., Jeffrey C. Hedrick, Rodney T. Hodgson, Ashit A. Mehta, Steven E. Molis, Jane M. Shaw, Stephen L. Tisdale, Alfred Viehbeck
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Patent number: 5569501Abstract: The present invention relates to an improved method of depositing a diamond-like carbon film onto a substrate by low temperature plasma-enhanced chemical vapor deposition (PECVD) from a hydrocarbon/helium plasma. More specifically, the diamond-like carbon films of the present invention are deposited onto the substrate by employing acetylene which is heavily diluted with helium as the plasma gas. The films formed using the process of the present invention are characterized as being amorphous and having dielectric strengths comparable to those normally observed for diamond films. More importantly, however is that the films produced herein are thermally stable, optically transparent, absorbent in the ultraviolet range and hard thus making them extremely desirable for a wide variety of applications.Type: GrantFiled: June 7, 1995Date of Patent: October 29, 1996Assignee: International Business Machines CorporationInventors: Fredric D. Bailey, Douglas A. Buchanan, Alessandro C. Callegari, Howard M. Clearfield, Fuad E. Doany, Donis G. Flagello, Harold J. Hovel, Douglas C. Latulipe, Jr., Naftali E. Lustig, Andrew T. S. Pomerene, Sampath Purushothaman, Christopher M. Scherpereel, David E. Seeger, Jane M. Shaw
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Patent number: 5569739Abstract: The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide.Type: GrantFiled: February 17, 1994Date of Patent: October 29, 1996Assignee: International Business Machines CorporationInventors: Eleftherios Adamopoulos, Kang-Wook Lee, Terrence R. O'Toole, Sampath Purushothaman, Jane M. Shaw, Alfred Viehbeck, George F. Walker
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Patent number: 5565529Abstract: Structures containing a dielectric material having a polymeric reactive ion etch barrier embedded therein. The preferred dielectric materials are polymers, preferably polyimide materials. The RIE etch barrier is a copolymer having an aromatic component having high thermal stability and having a cross-linking component selected from metallacyclobutane, metallabutene and vinyl groups. The etch barrier is deposited as a solvent free liquid which can fill gaps between the dielectric material and electrical conductors embedded therein. The liquid polymer is cured to a solid insoluble state. The structures with electrical conductors embedded therein are useful for electronic applications.Type: GrantFiled: June 30, 1993Date of Patent: October 15, 1996Assignee: International Business Machines CorporationInventors: Edward D. Babich, Michael Hatzakis, Richard P. McGouey, Sharon L. Nunes, Jurij R. Paraszczak, Jane M. Shaw
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Patent number: 5556899Abstract: Disclosed is a process of effecting a change in the dielectric constant and coefficient of thermal expansion of a polyimide material, by forming a composite based on a dispersion of 2-60 wt. % of fluorinated particulate carbon material and a polyimide or polyimide precursor, and heating the dispersion to about 400.degree. C. at 65.degree.-200.degree. C./second.Type: GrantFiled: November 30, 1994Date of Patent: September 17, 1996Assignee: International Business Machines CorporationInventors: Ali Afzali-Ardakani, Juan Ayala-Esquilin, Bodil E. Braren, Shahrokh Daijavad, Elizabeth Foster, James L. Hedrick, Jr., Jeffrey C. Hedrick, Rodney T. Hodgson, Ashit A. Mehta, Steven E. Molis, Jane M. Shaw, Stephen L. Tisdale, Alfred Viehbeck
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Patent number: 5548034Abstract: A curable material comprising a blend of a fluorine-containing cyanate and a fluorine-containing poly(arylene ether) wherein said cyanate is a monomer having the structureN.ident.C--O--R--.sub.n --O--C.ident.Nsaid fluorine containing poly(arylene ether) has the structureX--R--.sub.m --Xwherein X is any group capable of reacting with a --C.ident.N group;R is an aliphatic or aromatic group which may or may not be fluorosubstituted;R.sup.1 is an aliphatic or aromatic group which may or may not be fluoro substituted or R.sup.1 is selected from the group consisting of ether, carbonyl, sulfone, phosphine oxide and sulfide, and at least one of R or R.sup.1 must be fluoro substituted;n is 0-10; andm is 0-100;said material being heat-curable at a temperatures between 180.degree. and 325.degree. C.Type: GrantFiled: July 31, 1992Date of Patent: August 20, 1996Assignee: International Business Machines CorporationInventors: Ali Afzali-Ardakani, Jeffrey T. Gotro, Jeffrey C. Hedrick, Konstantinos Papathomas, Niranjan M. Patel, Jane M. Shaw, Alfred Viehbeck
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Patent number: 5536921Abstract: A microwave processing system is provided wherein the material to be processed is in the form of a web type quantity configuration with a thickness that is small in relation to the wavelength of a particular microwave frequency. The material is passed through the field associated with a plurality of microwave standing waves of the particular frequency, each adjacent standing wave being offset 1/4 wavelength along the direction of movement of the web. A carrier gas removes volatile solvents from the material surfaces. Control is provided for the interrelationship of temperature, rate of movement, flow of carrier gas, and microwave power.Type: GrantFiled: October 25, 1995Date of Patent: July 16, 1996Assignee: International Business Machines CorporationInventors: Jeffrey C. Hedrick, David A. Lewis, Jane M. Shaw, Alfred Viehbeck, Stanley J. Whitehair