Abstract: Photonically steered impedance surface antennas are disclosed. A disclosed example apparatus includes a semiconductor substrate to be communicatively coupled to a radio frequency (RF) source, an at least partially transparent dielectric layer, the semiconductor substrate at a first side of the at least partially transparent dielectric layer, an at least partially transparent conductive film at a second side of the at least partially transparent dielectric layer that is opposite the first side of the at least partially transparent dielectric layer, and an illumination source to illuminate at least a portion of the semiconductor substrate to generate a photoinduced solid-state plasma pattern that beam steers an RF signal corresponding to the RF source.

Abstract: An apparatus, system, and method for multi-frequency oscillator control are provided. A circuit can include a resonator circuit including an input and an output, the resonator circuit configured to resonate at a fundamental frequency and a different, non-fundamental frequency, a startup circuit electrically coupled to the input, the startup circuit configured to generate a signal at about the non-fundamental frequency and detect when the resonator circuit is resonating at the non-fundamental frequency, and an oscillator driver circuit electrically coupled to the output, the oscillator driver circuit configured to amplify and buffer the output of resonator circuit and drive a load.

Abstract: In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a cover structure housing the first device and the second device. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a radio frequency signal interface wirelessly communicatively coupling the first device and the second device. The radio frequency signal interface includes the first antenna and the second antenna.

Abstract: Clock distribution in an integrated circuit component can comprise the generation of bulk acoustic waves by acoustic transmitters and propagation of the bulk acoustic waves across the substrate where they are received by piezoelectric elements acting as acoustic receivers. Clock distribution can also comprise the generation of surface acoustic waves by acoustic transmitters located on the same substrate surface as the piezoelectric elements. An acoustic transmitter comprises a layer of piezoelectric material that generates an acoustic wave in response to the piezoelectric layer being activated by a clock source signal applied to the acoustic transmitter. The piezoelectric elements convert the acoustic waves into an electrical signal which can be used as a local clock signal for devices and components in the vicinity of the piezoelectric elements or from which such a local clock signal can be derived.

Abstract: Embodiments of a microelectronic assembly comprise a package substrate, a first integrated circuit (IC) die, a second IC die between the first IC die and the package substrate, a dielectric material between the first IC die and the package substrate, and a plurality of vias through the dielectric material, the vias coupling the first IC die and the package substrate. The microelectronic assembly is in a space defined by three mutually orthogonal axes, a first axis, a second axis and a third axis; the package substrate, the first IC die and the second IC die are mutually parallel in first planes defined by the first axis and the third axis; the vias are in one or more second planes defined by the second axis and the third axis; and the vias are inclined at an angle not equal to ninety degrees around the first axis.

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a MEMS die located within a substrate, and below a processor die. In selected examples, the MEMS die includes a resonator. Example methods of forming MEMS resonator devices are also shown.

Abstract: Techniques and mechanisms for regulating a temperature of a resonator structure. In an embodiment, a thermoelectric cooler (TEC) is thermally coupled to a resonator which is proximate thereto. The resonator supports operation with an oscillator circuit, wherein a resonance characteristic of the resonator contributes to oscillations of a master clock signal, or other oscillatory signal, which is provided with the oscillator circuit. The TEC provides Peltier functionality to selectively perform either one of heating or cooling the resonator. In another embodiment, the TEC is configured to conduct heat which is transferred via a path between the TEC and the resonator, wherein the path omits any circuitry which is to perform operations which are synchronized based on the oscillatory signal.

Abstract: Various embodiments provide systems, devices, and methods for an antenna assembly included in an integrated circuit (IC) package. The antenna assembly may be used for near field wireless communication such as package-to-package and/or chip-to-chip communication. The antenna assembly may include a feed plate (e.g., a top feed) that is capacitively coupled to a first via and a second via. The feed plate may further be capacitively coupled to a loading structure. The first via may be conductively coupled to a ground potential. In some embodiments, the antenna assembly may further include a stub structure (e.g., an open stub or a short stub) that is conductively coupled to the second via. An impedance matching network may be coupled between the feed plate and an IC die that communicates using the antenna assembly. Other embodiments may be described and claimed.

Abstract: Methods and apparatus relating to phase heterogeneous interconnects for crosstalk reduction are described. In one embodiment, an interconnect includes a plurality of links. A first set of links from the plurality of links communicates signals and a second set of links from the plurality of links provides a return path. The interconnect also includes one or more links from the first set of links that include one or more structures with a larger diameter than a minimum diameter of the one or more links. The larger diameter modifies an inductance or capacitance of the one or more links to provide a heterogenous phase delay amongst the plurality of links. Other embodiments are also claimed and disclosed.

Abstract: A package substrate may include a circuit and a leaky surface wave launcher. The circuit may perform engineering tests and end-user operations using sideband signals. The leaky surface wave launcher may perform near field wireless communication. The leaky surface wave launcher may include a via and a strip line. The via may be electrically coupled to the circuit. The via may provide the sideband signals to and receive the sideband signals from the circuit. The strip line may be electrically coupled to the via. The strip line may be excited by the sideband signals to wirelessly couple the leaky surface wave launcher with an external device. The strip line and the via may be unbalanced such that the strip line generates a leaky wave that propagates at least a portion of the package substrate and an environment proximate the package substrate.

Abstract: A positioning device and positioning method in which a first wireless signal is transmitted along a first signal path having a first signal path angle that changes relative to time; second wireless signal data representing a response of a wireless station to the first wireless signal is received; a third wireless signal is transmitted along a second signal path; and an assumption that an obstruction is between the wireless communication device and the wireless station is generated if the wireless communication device receives a response from the wireless station to the first wireless signal but does not receive a response from the wireless station to the third wireless signal; wherein the second signal path is a linear path.

Abstract: Techniques and mechanisms for regulating a temperature of a resonator structure. In an embodiment, a thermoelectric cooler (TEC) is thermally coupled to a resonator which is proximate thereto. The resonator supports operation with an oscillator circuit, wherein a resonance characteristic of the resonator contributes to oscillations of a master clock signal, or other oscillatory signal, which is provided with the oscillator circuit. The TEC provides Peltier functionality to selectively perform either one of heating or cooling the resonator. In another embodiment, the TEC is configured to conduct heat which is transferred via a path between the TEC and the resonator, wherein the path omits any circuitry which is to perform operations which are synchronized based on the oscillatory signal.

Abstract: A positioning device and positioning method in which a first wireless signal is transmitted along a first signal path having a first signal path angle that changes relative to time; second wireless signal data representing a response of a wireless station to the first wireless signal is received; a third wireless signal is transmitted along a second signal path; and an assumption that an obstruction is between the wireless communication device and the wireless station is generated if the wireless communication device receives a response from the wireless station to the first wireless signal but does not receive a response from the wireless station to the third wireless signal; wherein the second signal path is a linear path.

Abstract: The apparatus includes an apparatus for harvesting energy. The apparatus includes a textile having an insulating substrate, a direct current (DC) power bus structure disposed in the insulating substrate, and multiple transducers. The DC power bus includes a positive conductor and a ground conductor. The transducers are secured to the insulating substrate and in electrical contact with the positive conductor and the ground conductor. Additionally, the DC bus remains conductively coupled to the transducers remaining in the textile after the textile is cut.

Abstract: The apparatus includes an apparatus for harvesting energy. The apparatus includes a textile having an insulating substrate, a direct current (DC) power bus structure disposed in the insulating substrate, and multiple transducers. The DC power bus includes a positive conductor and a ground conductor. The transducers are secured to the insulating substrate and in electrical contact with the positive conductor and the ground conductor. Additionally, the DC bus remains conductively coupled to the transducers remaining in the textile after the textile is cut.

Abstract: Techniques for decoding encoded data are described herein. An example of a device in accordance with the present techniques includes a receiving signaling module coupled to a plurality of signal lines. The signaling module includes a receiver to receive a plurality of encoded line voltages or currents on the plurality of signal lines of a bus, wherein each one of the plurality of encoded line voltages corresponds to a weighted sum of data. The signaling module includes a comparator to determine the voltage level of each line at a unit interval and convert the voltage level to a digital value. The signaling module includes a lookup table correlating the digital value with a digital bit stream.

Abstract: Techniques for encoding data are described herein. An example of a device in accordance with the present techniques includes a signaling module coupled to a plurality of digital inputs. The signaling module is to encode data received at the plurality of digital inputs to generate encoded data. Based on the encoded data, the signaling module can drive line voltages on a plurality of signal lines of a bus. Each one of the plurality of line voltages corresponds to a weighted sum of the data received at the plurality of digital inputs.

Abstract: Techniques for decoding encoded data are described herein. An example of a device in accordance with the present techniques includes a signaling module with a receiver, quantizer, and arithmetic circuit. The receiver receives a plurality of encoded line voltages or currents on a plurality of signal lines. The quantizer determines signal levels of each of the plurality of signal lines at a unit interval. The arithmetic circuit provides a plurality of digital output bits of the decoder based on the signal levels. Each one of the digital output bits is a mathematical combination of all of the signal levels.

Abstract: Techniques for decoding encoded data are described herein. An example of a device in accordance with the present techniques includes a receiving signaling module coupled to a plurality of signal lines. The signaling module includes a receiver to receive a plurality of encoded line voltages or currents on the plurality of signal lines of a bus, wherein each one of the plurality of encoded line voltages corresponds to a weighted sum of data. The signaling module includes a comparator to determine the voltage level of each line at a unit interval and convert the voltage level to a digital value. The signaling module includes a lookup table correlating the digital value with a digital bit stream.

Abstract: Techniques for encoding data are described herein. An example of a device in accordance with the present techniques includes a signaling module coupled to a plurality of digital inputs. The signaling module is to encode data received at the plurality of digital inputs to generate encoded data. Based on the encoded data, the signaling module can drive line voltages on a plurality of signal lines of a bus. Each one of the plurality of line voltages corresponds to a weighted sum of the data received at the plurality of digital inputs.