Patents by Inventor JASON J. BJORGAARD
JASON J. BJORGAARD has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11963307Abstract: A ball-grid-array component of a ball-grid array assembly is analyzed prior to reflow. A predicted warping pattern of the ball-grid-array component that is likely to occur during reflow is predicted based on the analyzing. A solder ball ball-grid-array defect that could be caused by the predicted warping pattern is predicted. An initial via suction pattern to mitigate the ball-grid-array defect is assigned. A vacuum head is applied to a via in the ball-grid-array assembly. The solder ball is located at the opposite end of the via from the vacuum head. Suction is applied to the via based on the via suction pattern. The suction draws a portion of the solder ball into the via during reflow.Type: GrantFiled: March 30, 2021Date of Patent: April 16, 2024Assignee: International Business Machines CorporationInventors: Matthew Doyle, Thomas W. Liang, Layne A. Berge, John R. Dangler, Jason J. Bjorgaard, Kyle Schoneck, Matthew A. Walther
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Patent number: 11948807Abstract: A set of features for a product is identified. It is determined that preventing an electrical connection at a ball-grid-array location on a ball-grid-array assembly of the product would result in the set of features. The ball-grid-array location is established as a target BGA location based on that determination. Suction is applied to a via at the target BGA location during reflow of the ball-grid-array assembly. With that application of suction, a solder ball at the target BGA location is drawn into the via.Type: GrantFiled: March 30, 2021Date of Patent: April 2, 2024Assignee: International Business Machines CorporationInventors: Matthew Doyle, Thomas W. Liang, Layne A. Berge, John R. Dangler, Jason J. Bjorgaard, Kyle Schoneck, Matthew A. Walther
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Publication number: 20240097292Abstract: A voltage source watchdog comprising a passive device is placed in series between a voltage source and a load. The passive device includes an electromigration (EM) joint of known materials that will create an electromigration void after a specified amount of current passes through the EM joint. After a known amount of current as passed through, a void is created and a voltage will no longer be sensed, thus providing a sure safety mode situation. When the voltage source is a battery, the battery life may be extended by selectively enabling voltage measurement operations for the proposed watchdog.Type: ApplicationFiled: September 16, 2022Publication date: March 21, 2024Inventors: Mark K. Hoffmeyer, Matthew Doyle, Kyle Schoneck, Layne A. Berge, Matthew A. Walther, Thomas W. Liang, John R. Dangler, Jason J. Bjorgaard
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Patent number: 11929390Abstract: A temperature-dependent capacitor comprises a first conductive plate, a second conductive plate located in a parallel-planar orientation to the first conductive plate, and a dielectric material located between the first conductive plate and the second conductive plate, the dielectric material having a temperature-dependent dielectric constant (?) value, wherein the temperature-dependent capacitor has a positive correlation of an operating temperature of the temperature-dependent capacitor to a capacitance value of the temperature-dependent capacitor.Type: GrantFiled: February 12, 2021Date of Patent: March 12, 2024Assignee: International Business Machines CorporationInventors: Kyle Schoneck, Matthew A. Walther, Jason J. Bjorgaard, John R. Dangler, Layne A. Berge, Thomas W. Liang, Matthew Doyle
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Publication number: 20230170641Abstract: An approach for connecting electrical wiring between two chambers of varying temperatures is disclosed. One approach includes a first end of a wiring bundle comprising a first plurality of metal conductors; a second end of the wiring bundle comprising of equal number of metal conductors as the first end of the wiring bundle; the first end of the wiring bundle is separated by an air gap from the second end of the wiring bundle at a first temperature; and an insulator surrounding the wire bundle. Another approach includes the use of one or more SMA (shape-memory alloy) pins connecting the first end of the wiring bundle to the second end of the wiring bundle and that is separated by an air gap and a boundary plate.Type: ApplicationFiled: November 29, 2021Publication date: June 1, 2023Inventors: Kyle Schoneck, Layne A. Berge, Jason J. Bjorgaard, John R. Dangler, Matthew Doyle, Thomas W. Liang, Matthew A. Walther
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Publication number: 20230105433Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB) and are arranged to provide a contiguous channel for a current sense wire. A subset of solder balls is electrically connected to supply current from the PCB through the BGA package to the IC. The current sense wire is attached to the upper surface of the PCB, within the contiguous channel, and surrounds the subset of solder balls. An amplifier is electrically connected to the current sense wire ends to amplify a voltage induced on the current sense wire by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.Type: ApplicationFiled: December 6, 2022Publication date: April 6, 2023Inventors: Layne A. Berge, Matthew Doyle, Kyle Schoneck, Thomas W. Liang, Matthew A. Walther, Jason J. Bjorgaard, John R. Dangler
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Publication number: 20230052436Abstract: A system and method for slowing a vehicle. Road conditions around the vehicle are monitored, and determined if those road conditions are hazardous. An engine control unit is informed of the hazardous road conditions and alters the operation of the engine control unit in response to the hazardous road conditions. When an operator of the vehicle desires to slow the vehicle down, an indication is received indicating the intent to slow the vehicle down. The vehicle is then slowed based upon the altered operation of the engine control unit by applying a vacuum to increase a manifold vacuum of the engine.Type: ApplicationFiled: August 12, 2021Publication date: February 16, 2023Inventors: Matthew Doyle, John R. Dangler, Layne A. Berge, Jason J. Bjorgaard, Matthew A. Walther, Kyle Schoneck, Thomas W. Liang
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Patent number: 11538638Abstract: A grid array capacitor can be used to physically and electrically couple an integrated circuit (IC) package to a printed circuit board (PCB). The grid array capacitor includes an inner conductor and an inner dielectric coaxially surrounding the inner conductor. A secondary conductor can be located to surround, in a coaxial orientation, the inner dielectric. Both the inner conductor and the secondary conductor can be electrically connected to the IC package and to the PCB. In certain applications, the structure of the inner conductor, inner dielectric, and secondary conductor can provide capacitance used to decouple electronic circuits.Type: GrantFiled: July 1, 2020Date of Patent: December 27, 2022Assignee: International Business Machines CorporationInventors: Layne A. Berge, Matthew Doyle, John R. Dangler, Kyle Schoneck, Thomas W. Liang, Matthew A. Walther, Jason J. Bjorgaard
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Patent number: 11519957Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB) and are arranged to provide a contiguous channel for a current sense wire. A subset of solder balls is electrically connected to supply current from the PCB through the BGA package to the IC. The current sense wire is attached to the upper surface of the PCB, within the contiguous channel, and surrounds the subset of solder balls. An amplifier is electrically connected to the current sense wire ends to amplify a voltage induced on the current sense wire by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.Type: GrantFiled: September 26, 2019Date of Patent: December 6, 2022Assignee: International Business Machines CorporationInventors: Layne A. Berge, Matthew Doyle, Kyle Schoneck, Thomas W. Liang, Matthew A. Walther, Jason J. Bjorgaard, John R. Dangler
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Patent number: 11488571Abstract: A system and method to prevent eavesdropping by a device. An anti-eavesdrop component is installed on the device. The anti-eavesdrop component is configured to actively prevent the device from capturing audio from the environment. In response to installing the anti-eavesdrop component, the device recognizes the anti-eavesdrop component as a primary audio input for the device. The anti-eavesdrop component then proceeds to block the device from capturing outside audio by injecting noise or otherwise interfering with the primary audio input.Type: GrantFiled: July 2, 2020Date of Patent: November 1, 2022Assignee: International Business Machines CorporationInventors: Layne A. Berge, Jason J. Bjorgaard, John R. Dangler, Matthew Doyle, Thomas W. Liang, Kyle Schoneck, Matthew A. Walther, Jeffrey N. Judd, Henry Michael Newshutz, Matthew S Kelly
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Publication number: 20220317092Abstract: A system, apparatus, and method for determining ultrasonic vital product data of coaxial cables and side-band communications through a water medium of a water-cooling system and/or apparatus. The system may include a first electronic device. The system may also include a second electronic device. The system may also include one or more cables running between the first electronic device and the second electronic device. The system may also include a water jacket filled with water encasing the one or more cables. The system may also include one or more transducers connected to the water jacket, the one or more transducers configured to send signals through the water to gather information about each cable. The system may also include a computer system connected to the one or more transducers, where the computer system is configured to control the one or more transducers.Type: ApplicationFiled: March 30, 2021Publication date: October 6, 2022Inventors: Layne A. Berge, Matthew Doyle, John R. Dangler, Thomas W. Liang, Jason J. Bjorgaard, Kyle Schoneck, Matthew A. Walther
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Publication number: 20220319867Abstract: A set of features for a product is identified. It is determined that preventing an electrical connection at a ball-grid-array location on a ball-grid-array assembly of the product would result in the set of features. The ball-grid-array location is established as a target BGA location based on that determination. Suction is applied to a via at the target BGA location during reflow of the ball-grid-array assembly. With that application of suction, a solder ball at the target BGA location is drawn into the via.Type: ApplicationFiled: March 30, 2021Publication date: October 6, 2022Inventors: Matthew Doyle, Thomas W. Liang, Layne A. Berge, John R. Dangler, Jason J. Bjorgaard, Kyle Schoneck, Matthew A. Walther
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Publication number: 20220322540Abstract: A ball-grid-array component of a ball-grid array assembly is analyzed prior to reflow. A predicted warping pattern of the ball-grid-array component that is likely to occur during reflow is predicted based on the analyzing. A solder ball ball-grid-array defect that could be caused by the predicted warping pattern is predicted. An initial via suction pattern to mitigate the ball-grid-array defect is assigned. A vacuum head is applied to a via in the ball-grid-array assembly. The solder ball is located at the opposite end of the via from the vacuum head. Suction is applied to the via based on the via suction pattern. The suction draws a portion of the solder ball into the via during reflow.Type: ApplicationFiled: March 30, 2021Publication date: October 6, 2022Inventors: Matthew Doyle, Thomas W. Liang, Layne A. Berge, John R. Dangler, Jason J. Bjorgaard, Kyle Schoneck, Matthew A. Walther
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Publication number: 20220262893Abstract: A temperature-dependent capacitor comprises a first conductive plate, a second conductive plate located in a parallel-planar orientation to the first conductive plate, and a dielectric material located between the first conductive plate and the second conductive plate, the dielectric material having a temperature-dependent dielectric constant (?) value, wherein the temperature-dependent capacitor has a positive correlation of an operating temperature of the temperature-dependent capacitor to a capacitance value of the temperature-dependent capacitor.Type: ApplicationFiled: February 12, 2021Publication date: August 18, 2022Inventors: Kyle Schoneck, Matthew A. Walther, Jason J. Bjorgaard, John R. Dangler, Layne A. Berge, Thomas W. Liang, Matthew Doyle
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Patent number: 11300605Abstract: The present disclosure describes printed circuit board performance evaluation techniques. In some cases, a printed circuit board performance evaluation process may include determining a first set of electrical properties associated with an interface between components of a printed circuit board, where the interface is disposed on an internal or external layer of the printed circuit board. After selective application of a sheet of dielectric material to a portion of a transmission line in the interface, a second set of electrical properties associated with the interface may be determined. The first set of electrical properties may be compared to the second set of electrical properties to evaluate printed circuit board performance. In other cases, the interface may include a trace inductor, and electrical properties of the interface before and after application of a ferrous material may be compared to evaluate printed circuit board performance.Type: GrantFiled: May 22, 2018Date of Patent: April 12, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Layne A. Berge, Matthew S. Doyle, Manuel Orozco, John R. Dangler, Thomas W. Liang, Jason J. Bjorgaard
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Patent number: 11262776Abstract: A system can control, with a positive temperature-voltage correlation, an output of a voltage regulator with a Peltier device. The Peltier device can receive heat from a heat-producing electronic device, and can have a positive terminal and a negative terminal. A voltage regulator circuit can include a driver device electrically coupled to an input voltage and an output terminal electrically coupled to one of the Peltier device terminals. The voltage regulator circuit can also include a differential amplifier electrically coupled to a reference voltage, an input electrically coupled to another Peltier device terminal and an output electrically coupled to the driver device. The differential amplifier can, in response to a voltage produced by the Peltier device, modulate, with a positive temperature-voltage correlation, an output voltage on the output terminal of the driver device.Type: GrantFiled: June 27, 2019Date of Patent: March 1, 2022Assignee: International Business Machines CorporationInventors: Layne A. Berge, John R. Dangler, Jason J. Bjorgaard, Kyle Schoneck, Matthew Doyle, Thomas W. Liang, Matthew A. Walther
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Patent number: 11235625Abstract: A method, system and computer program product are provided for implementing tire tread depth and wear patterns monitoring. A radio frequency identification (RFID) tag is provided with an associated tire to be monitored. A dipole antenna structure is coupled to the RFID tag and routed within a position in the tire tread and routed substantially circumferentially in the associated tire. A resonant frequency of the dipole antenna structure is detected to monitor tire tread wear.Type: GrantFiled: October 29, 2018Date of Patent: February 1, 2022Assignee: International Business Machines CorporationInventors: Matthew S. Doyle, Layne A. Berge, Jason J. Bjorgaard, John R. Dangler, Thomas W. Liang, Manuel Orozco
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Patent number: 11226369Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB). A current sense loop can be fabricated on a wiring plane of the PCB to encircle a current supply via that supplies current to an IC mounted on the BGA package. A MUX/Sequencer can sequentially connect wires of the current sense loop to an amplifier. The amplifier can amplify a voltage induced on the current sense mesh by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.Type: GrantFiled: September 26, 2019Date of Patent: January 18, 2022Assignee: International Business Machines CorporationInventors: Layne A. Berge, Matthew Doyle, Kyle Schoneck, Thomas W. Liang, Matthew A. Walther, Jason J. Bjorgaard, John R. Dangler
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Publication number: 20220005449Abstract: A system and method to prevent eavesdropping by a device. An anti-eavesdrop component is installed on the device. The anti-eavesdrop component is configured to actively prevent the device from capturing audio from the environment. In response to installing the anti-eavesdrop component, the device recognizes the anti-eavesdrop component as a primary audio input for the device. The anti-eavesdrop component then proceeds to block the device from capturing outside audio by injecting noise or otherwise interfering with the primary audio input.Type: ApplicationFiled: July 2, 2020Publication date: January 6, 2022Inventors: Layne A. Berge, Jason J. Bjorgaard, John R. Dangler, Matthew Doyle, Thomas W. Liang, Kyle Schoneck, Matthew A. Walther, Jeffrey N. Judd, Henry Michael Newshutz, Matthew S Kelly
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Publication number: 20220005649Abstract: A grid array capacitor can be used to physically and electrically couple an integrated circuit (IC) package to a printed circuit board (PCB). The grid array capacitor includes an inner conductor and an inner dielectric coaxially surrounding the inner conductor. A secondary conductor can be located to surround, in a coaxial orientation, the inner dielectric. Both the inner conductor and the secondary conductor can be electrically connected to the IC package and to the PCB. In certain applications, the structure of the inner conductor, inner dielectric, and secondary conductor can provide capacitance used to decouple electronic circuits.Type: ApplicationFiled: July 1, 2020Publication date: January 6, 2022Inventors: Layne A. Berge, Matthew Doyle, John R. Dangler, Kyle Schoneck, Thomas W. Liang, Matthew A. Walther, Jason J. Bjorgaard