Abstract: A grid array capacitor can be used to physically and electrically couple an integrated circuit (IC) package to a printed circuit board (PCB). The grid array capacitor includes an inner conductor and an inner dielectric coaxially surrounding the inner conductor. A secondary conductor can be located to surround, in a coaxial orientation, the inner dielectric. Both the inner conductor and the secondary conductor can be electrically connected to the IC package and to the PCB. In certain applications, the structure of the inner conductor, inner dielectric, and secondary conductor can provide capacitance used to decouple electronic circuits.

Abstract: A solder ball assembly can include a first spring element having a first shape and formed from a first elastic electrically conductive material. The solder ball assembly can also include a second spring element having a second shape and formed from a second elastic electrically conductive material. The second spring element is mechanically attached to the first spring element to form a spring assembly. The solder ball can be configured to enclose the spring assembly.

Abstract: Systems, methods, and cards utilized for an authentication protection layer for payment card transactions are provided. Aspects include receiving, by a transaction processing terminal, the card for the potential transaction. Obtaining card holder information for the card and transmitting a radio frequency (RF) signal and receiving RFID data from an RFID tag associated with the card. Comparing, by a processor, the card holder information to the RFID data to determine whether to authorize the potential card transaction and authorizing the potential card transaction based at least on a determination that the RFID data corresponds to the card holder information.

Abstract: A solder ball assembly can include a first spring element having a first shape and formed from a first elastic electrically conductive material. The solder ball assembly can also include a second spring element having a second shape and formed from a second elastic electrically conductive material. The second spring element is mechanically attached to the first spring element to form a spring assembly. The solder ball can be configured to enclose the spring assembly.

Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB). A current sense mesh can be placed between adjacent solder balls and is attached to the upper surface of the PCB. The solder balls are electrically connected to supply current from the PCB through the BGA package to the IC. A MUX/Sequencer can sequentially connect wires of the current sense mesh to an amplifier. The amplifier can amplify a voltage induced on the current sense mesh by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.

Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB). A current sense mesh can be placed between adjacent solder balls and is attached to the upper surface of the PCB. The solder balls are electrically connected to supply current from the PCB through the BGA package to the IC. A MUX/Sequencer can sequentially connect wires of the current sense mesh to an amplifier. The amplifier can amplify a voltage induced on the current sense mesh by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.

Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB). A current sense loop can be fabricated on a wiring plane of the PCB to encircle a current supply via that supplies current to an IC mounted on the BGA package. A MUX/Sequencer can sequentially connect wires of the current sense loop to an amplifier. The amplifier can amplify a voltage induced on the current sense mesh by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.

Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB) and are arranged to provide a contiguous channel for a current sense wire. A subset of solder balls is electrically connected to supply current from the PCB through the BGA package to the IC. The current sense wire is attached to the upper surface of the PCB, within the contiguous channel, and surrounds the subset of solder balls. An amplifier is electrically connected to the current sense wire ends to amplify a voltage induced on the current sense wire by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.

Abstract: A system can control, with a positive temperature-voltage correlation, an output of a voltage regulator with a Peltier device. The Peltier device can receive heat from a heat-producing electronic device, and can have a positive terminal and a negative terminal. A voltage regulator circuit can include a driver device electrically coupled to an input voltage and an output terminal electrically coupled to one of the Peltier device terminals. The voltage regulator circuit can also include a differential amplifier electrically coupled to a reference voltage, an input electrically coupled to another Peltier device terminal and an output electrically coupled to the driver device. The differential amplifier can, in response to a voltage produced by the Peltier device, modulate, with a positive temperature-voltage correlation, an output voltage on the output terminal of the driver device.

Abstract: A system and a method for universally projecting an image on a display device to an outside device. The system includes a housing, a screen capture device, a serializer, and a display interface. Further, the system includes a sound capture device, and a bracket to secure the display device to the system. The method includes receiving an image of a display device, converting the image to a digital signal, serializing the digital signal, and transmitting the serialized digital signal to an outside device.

Abstract: A system and a method for universally projecting an image on a display device to an outside device. The system includes a housing, a screen capture device, a serializer, and a display interface. Further, the system includes a sound capture device, and a bracket to secure the display device to the system. The method includes receiving an image of a display device, converting the image to a digital signal, serializing the digital signal, and transmitting the serialized digital signal to an outside device.

Abstract: Various back-drilled via probing techniques are described. In some cases, a screw may be utilized to establish a conductive pathway through a voided portion of a back-drilled via to a plated portion of the back-drilled via to enable back-drilled via probing. In other cases, a combination of solder paste and a wire may be utilized to establish the conductive pathway to enable back-drilled via probing. In other cases, a compliant pin that includes a metallized particle interconnect material may be utilized to establish the conductive pathway to enable back-drilled via probing. In other cases, a combination of an ultraviolet curable film and a light pipe may be utilized to establish a conductive pathway the conductive pathway to enable back-drilled via probing.

Abstract: A method, system and computer program product are provided for implementing tire tread depth and wear patterns monitoring. A radio frequency identification (RFID) tag is provided with an associated tire to be monitored. A dipole antenna structure is coupled to the RFID tag and routed within a position in the tire tread and routed substantially circumferentially in the associated tire. A resonant frequency of the dipole antenna structure is detected to monitor tire tread wear.

Abstract: Systems, methods, and cards utilized for an authentication protection layer for payment card transactions are provided. Aspects include receiving, by a transaction processing terminal, the card for the potential transaction. Obtaining card holder information for the card and transmitting a radio frequency (RF) signal and receiving RFID data from an RFID tag associated with the card. Comparing, by a processor, the card holder information to the RFID data to determine whether to authorize the potential card transaction and authorizing the potential card transaction based at least on a determination that the RFID data corresponds to the card holder information.

Abstract: The present disclosure describes printed circuit board performance evaluation techniques. In some cases, a printed circuit board performance evaluation process may include determining a first set of electrical properties associated with an interface between components of a printed circuit board, where the interface is disposed on an internal or external layer of the printed circuit board. After selective application of a sheet of dielectric material to a portion of a transmission line in the interface, a second set of electrical properties associated with the interface may be determined. The first set of electrical properties may be compared to the second set of electrical properties to evaluate printed circuit board performance. In other cases, the interface may include a trace inductor, and electrical properties of the interface before and after application of a ferrous material may be compared to evaluate printed circuit board performance.