Patents by Inventor Jeffery F. Summers
Jeffery F. Summers has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190382260Abstract: The invention is directed to an inexpensive method for bonding two wafers. The method uses an adhesive material disposed between two handling sheets and stamped with a plurality of through holes. The through holes are registered with the locations of devices formed on a substrate. The adhesive material is placed between to two substrates, around the devices, and cured.Type: ApplicationFiled: June 6, 2019Publication date: December 19, 2019Applicant: Innovative Micro TechnologyInventor: Jeffery F. SUMMERS
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Patent number: 9950923Abstract: Described herein is a method and structure for fabricating vias in a semiconductor substrate. The semiconductor substrate is first doped to make it mildly conducting, via holes are formed therein, and a conductive material is deposited in the holes. Using the moderate conductivity of the substrate, the conductive material may be plated into the holes.Type: GrantFiled: April 11, 2017Date of Patent: April 24, 2018Assignee: Innovative Micro TechnologyInventors: Christopher S. Gudeman, Jeffery F. Summers
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Patent number: 9493877Abstract: A method for creating small features in an Al/Ag/Ti multilayer stack is disclosed. The method uses a combination of wet and dry etching techniques to anisotropically etch the layers.Type: GrantFiled: May 2, 2016Date of Patent: November 15, 2016Assignee: Innovative Micro TechnologyInventors: John Harley, Jeffery F. Summers, Tao Gilbert
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Patent number: 9388037Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.Type: GrantFiled: January 19, 2014Date of Patent: July 12, 2016Assignee: Innovative Micro TechnologyInventors: Benedikt Zeyen, Jeffery F. Summers
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Patent number: 9315375Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.Type: GrantFiled: December 27, 2013Date of Patent: April 19, 2016Assignee: Innovative Micro TechnologyInventors: Benedikt Zeyen, Jeffery F. Summers
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Patent number: 9156679Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a Second bond, for example a metal alloy, solder, eutectic and polymer bond. The two bonds may be used for the same or a different purpose, and may be selected for the following attributes: hermeticity, electrical conductivity, low RF loss, high adhesive strength, leak resistance, thermal conductivity. The attributes for each bonding technology may be the same, or they may be different.Type: GrantFiled: July 8, 2014Date of Patent: October 13, 2015Assignee: Innovative Micro TechnologyInventors: Benedikt Zeyen, Jeffery F. Summers
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Publication number: 20150183630Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.Type: ApplicationFiled: January 19, 2014Publication date: July 2, 2015Applicant: Innovative Micro TechnologyInventors: Benedikt ZEYEN, Jeffery F. SUMMERS
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Publication number: 20150183200Abstract: A bonding technology is disclosed that can form an anodic, conductive bond between two optically transparent substrates. The anodic bond may be accompanied by a metal alloy, solder, eutectic and polymer bond. The first anodic bond may provide one attribute such as hermeticity, whereas the second bond may provide another attribute, such as electrical conductivity.Type: ApplicationFiled: December 27, 2013Publication date: July 2, 2015Applicant: Innovative Micro TechnologyInventors: Benedikt ZEYEN, Jeffery F. SUMMERS
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Patent number: 8847373Abstract: An approach to obtain localized heat within a sealed vacuum cavity is disclosed. The approach uses an exothermic reaction between two reactants to generate heat in the vicinity of a structure, such as a getter material or a bondline that is heat activated. The exothermic reaction can be initiated by application of laser light, or application of current to a current-carrying conductor in the vicinity of the reactants.Type: GrantFiled: May 7, 2013Date of Patent: September 30, 2014Assignee: Innovative Micro TechnologyInventors: Jeffery F. Summers, Christopher S. Gudeman, Jaquelin K. Spong
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Patent number: 8558364Abstract: An approach to activating a getter within a sealed vacuum cavity is disclosed. The approach uses inductive coupling from an external coil to a magnetically permeable material deposited in the vacuum cavity. The getter material is formed over this magnetically permeable material, and heated specifically thereby, leaving the rest of the device cavity and microdevice relatively cool. Using this inductive coupling technique, the getter material can be activated after encapsulation, and delicate structures and low temperature wafer bonding mechanisms may be used.Type: GrantFiled: September 20, 2011Date of Patent: October 15, 2013Assignee: Innovative Micro TechnologyInventor: Jeffery F. Summers
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Patent number: 8541735Abstract: An optical material is inlaid into a supporting substrate, with the top surface of the optical material flush with the top surface of the substrate, wherein the optical element is used to shape a beam of light travelling substantially parallel to the top surface of the substrate, but with the central axis of the beam below the top surface of the substrate. The optical elements serve to shape the beam of light for delivery to or from a microfabricated structure within the device.Type: GrantFiled: April 7, 2010Date of Patent: September 24, 2013Assignee: Innovative Micro TechnologyInventors: John S. Foster, John C. Harley, Ian R. Johnston, Jeffery F. Summers
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Publication number: 20130199730Abstract: A wafer bonding chamber is disclosed, which maintains two wafers to be bonded together at two substantially different temperatures. A lid wafer may be held at a higher temperature than a device wafer, as the device wafer may have delicate structures formed thereon, which cannot withstand higher temperatures. The lid wafer may have an adhesive bonding material formed thereon, which is melted or cured at the higher temperature. The temperature differential may be maintained by applying at least one of a heating mechanism and a cooling mechanism preferentially to one of the wafers to be bonded in the wafer bonding chamber.Type: ApplicationFiled: February 8, 2012Publication date: August 8, 2013Applicant: Innovative Micro TechnologyInventors: Chris Gudeman, Jeffery F. Summers, Douglas L. Thompson
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Patent number: 8343791Abstract: A method for forming through features in a substrate uses a seed layer deposited over a first substrate, and a second substrate bonded to the seed layer. The features may be formed in the first substrate, by plating a conductive filler material onto the seed layer. The first substrate and the second substrate may then be bonded to a third substrate, and the second substrate is removed, leaving through features and first substrate adhered to the third substrate. The through features may provide at least one of electrical access and motion to a plurality of devices formed on the third substrate, or may impart movement to a moveable feature on the first substrate, wherein the third substrate supports the first substrate after removal of the second substrate.Type: GrantFiled: October 5, 2010Date of Patent: January 1, 2013Assignee: Innovative Micro TechnologyInventors: John S. Foster, John C. Harley, Jeffery F. Summers
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Publication number: 20120132522Abstract: A method for depositing a getter for encapsulation in a device cavity containing a microdevice comprises depositing the getter material while the device wafer and lid wafer are enclosed in a bonding chamber. A plasma sputtering process may be used, wherein by applying a large negative voltage to the lid wafer, a plasma is formed in the low pressure environment within the bonding chamber. The plasma then sputters the getter material from a getter target, and this getter material is directly thereafter sealed within the device cavity of the microdevice, all within the deposition/bonding chamber.Type: ApplicationFiled: January 11, 2008Publication date: May 31, 2012Applicant: Innovative Micro TechnologyInventors: John S. Foster, Jeffery F. Summers
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Publication number: 20120080762Abstract: A method for forming through features in a substrate uses a seed layer deposited over a first substrate, and a second substrate bonded to the seed layer. The features may be formed in the first substrate, by plating a conductive filler material onto the seed layer. The first substrate and the second substrate may then be bonded to a third substrate, and the second substrate is removed, leaving through features and first substrate adhered to the third substrate. The through features may provide at least one of electrical access and motion to a plurality of devices formed on the third substrate, or may impart movement to a moveable feature on the first substrate, wherein the third substrate supports the first substrate after removal of the second substrate.Type: ApplicationFiled: October 5, 2010Publication date: April 5, 2012Applicant: Innovative Micro TechnologyInventors: John S. Foster, John C. Harley, Jeffery F. Summers
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Publication number: 20120068300Abstract: An approach to activating a getter within a sealed vacuum cavity is disclosed. The approach uses inductive coupling from an external coil to a magnetically permeable material deposited in the vacuum cavity. The getter material is formed over this magnetically permeable material, and heated specifically thereby, leaving the rest of the device cavity and microdevice relatively cool. Using this inductive coupling technique, the getter material can be activated after encapsulation, and delicate structures and low temperature wafer bonding mechanisms may be used.Type: ApplicationFiled: September 20, 2011Publication date: March 22, 2012Applicant: Innovative Micro TechnologyInventor: Jeffery F. Summers
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Publication number: 20110250092Abstract: An optical material is inlaid into a supporting substrate, with the top surface of the optical material flush with the top surface of the substrate, wherein the optical element is used to shape a beam of light travelling substantially parallel to the top surface of the substrate, but with the central axis of the beam below the top surface of the substrate. The optical elements serve to shape the beam of light for delivery to or from a microfabricated structure within the device.Type: ApplicationFiled: April 7, 2010Publication date: October 13, 2011Applicant: Innovative Micro TechnologyInventors: John S. Foster, John C. Harley, Ian R. Johnston, Jeffery F. Summers
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Patent number: 7960208Abstract: Systems and methods for forming an encapsulated device include a hermetic seal which seals an insulating environment between two substrates, one of which supports the device. The hermetic seal is formed by an alloy of two metal layers, one deposited on a first substrate and the other deposited on the second substrate, along with a raised feature formed on the first or the second substrate. At least one of the metal layers may be deposited conformally over the raised feature. The raised feature penetrates the molten material of the first or the second metal layers during formation of the alloy, and produces a spectrum of stoichiometries for the formation of the desired alloy, as a function of the distance from the raised feature. At some distance from the raised feature, the proper ratio of the first metal to the second metal exists to form an alloy of the preferred stoichiometry.Type: GrantFiled: July 11, 2009Date of Patent: June 14, 2011Assignee: Innovative Micro TechnologyInventors: Gregory A. Carlson, David M. Erlach, Alok Paranjpye, Jeffery F. Summers
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Patent number: 7872432Abstract: A MEMS thermal switch is disclosed which couples a hot, expanding beam to a cool flexor beam using a slideably engaged tether, and bends the cool, flexor beam by the expansion of the hot beam. A rigidly engaged tether ties the distal ends of the hot, expanding beam and the cool, flexor beam together, whereas the slideably engaged tether allows the hot, expanding beam to elongate with respect to the cool, flexor beam, without loading the slideably engaged tether with a large shear force. As a result, the material of the tether can be made stiffer, and therefore transmit the bending force of the hot, expanding beam more efficiently to the cool, flexor beam.Type: GrantFiled: March 20, 2006Date of Patent: January 18, 2011Assignee: Innovative Micro TechnologyInventors: Alok Paranjpye, Jeffery F. Summers
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Patent number: 7807547Abstract: A material for bonding a lid wafer to a device wafer, which includes an adhesive substance with rigid particles embedded in the adhesive substance. The rigid particles may be particles or spheres of alumina, silica, or diamond, for example. The adhesive substance may be glass frit, epoxy, glue, cement or solder, for example. When the adhesive is applied and melted, and pressure is applied between the lid wafer and the device wafer, the lid wafer approaches the device wafer until a minimum separation is reached, which is defined by the rigid particles.Type: GrantFiled: March 28, 2006Date of Patent: October 5, 2010Assignee: Innovative Micro TechnologyInventor: Jeffery F. Summers