Abstract: Methods, apparatus, and assemblies are provided for a substrate carrier adapter insert including an adapter frame including a support rail adapted to support one or more substrates in a substrate carrier, a frame extension coupled to, or integral with, the adapter frame, and a mapping feature formed on the frame extension and disposed to be detected by a sensor for determining whether an adapter insert is present or absent in a substrate carrier. Numerous additional features are disclosed.

Abstract: Methods, apparatus, and assemblies are provided for an adapter insert including an adapter frame including a support rail adapted to support one or more substrates in a substrate carrier, a frame extension coupled to, or integral with, the adapter frame, and a mapping feature formed on the frame extension and disposed to be detected by a sensor for determining whether an adapter insert is present or absent in a substrate carrier. Numerous additional features are disclosed.

Abstract: Universal component lift apparatus for moving components of electronic device manufacturing systems is described. The universal component lift apparatus includes a track, a truck moveable along the track, and a lift apparatus adapted to couple to the truck, the lift apparatus including a wheeled base, a lift portion, and a boom adapted to couple to the component. Electronic device processing systems and methods of moving components thereof are described, as are numerous other aspects.

Abstract: An electronic device manufacturing system is disclosed. The system includes a processing tool having one or more processing chambers each adapted to perform an electronic device manufacturing process on one or more substrates; a substrate carrier adapted to couple to the system and carry one or more substrates; and a component adapted to create a sealed environment relative to at least a portion of the substrate carrier and to substantially equalize the sealed environment with an environment within the substrate carrier. Methods of the invention are described as are numerous other aspects.

Abstract: An electronic device manufacturing system is disclosed. The system includes a processing tool having one or more processing chambers each adapted to perform an electronic device manufacturing process on one or more substrates; a substrate carrier adapted to couple to the system and carry one or more substrates; and a component adapted to create a sealed environment relative to at least a portion of the substrate carrier and to substantially equalize the sealed environment with an environment within the substrate carrier. Methods of the invention are described as are numerous other aspects.

Abstract: Robots including spaced upper arms are described. The robot includes first and second upper arms rotatable about a shoulder axis wherein the second upper arm is spaced from the first upper arm. The other robot components (first and second forearms, first and second wrist members, and first and second end effectors) are interleaved in the space between the first and second upper arms. Each of the first and second upper arms and first and second forearms may be individually and independently controlled. Methods of operating the robot and electronic device processing systems including the robot are provided, as are numerous other aspects.

Abstract: In some embodiments, apparatus and methods are provided for improved handling of lithography masks including a mask inverter that includes a first contact pad dedicated to inverting masks that have not been cleaned; a second contact pad dedicated to inverting masks that have been cleaned; an actuator coupled to the first and second contact pads and operable to invert the first and second contact pads; and a controller coupled to the actuator and operative to control the actuator. Numerous other aspects are provided.

Abstract: An electronic device manufacturing system may include a mainframe to which one or more process chambers of different size may be coupled. A different number of process chambers may be coupled to each facet (i.e., side wall) of the mainframe. The process chambers coupled to one facet may be of a different size than process chambers coupled to other facets. For example, one process chamber of a first size may be coupled to a first facet, two process chambers each of a second size different than the first size may be coupled to a second facet, and three process chambers each of a third size different than the first and second sizes may be coupled to a third facet. Other configurations are possible. The mainframe may have a square or rectangular shape. Methods of assembling an electronic device manufacturing system are also provided, as are other aspects.

Abstract: An electronic device manufacturing system may include a mainframe to which one or more process chambers of different size may be coupled. A different number of process chambers may be coupled to each facet (i.e., side wall) of the mainframe. The process chambers coupled to one facet may be of a different size than process chambers coupled to other facets. For example, one process chamber of a first size may be coupled to a first facet, two process chambers each of a second size different than the first size may be coupled to a second facet, and three process chambers each of a third size different than the first and second sizes may be coupled to a third facet. Other configurations are possible. The mainframe may have a square or rectangular shape. Methods of assembling an electronic device manufacturing system are also provided, as are other aspects.

Abstract: Process chamber gas flow control apparatus may include, or be included in, a process chamber configured to process a substrate therein. The gas flow control apparatus may include a valve configured to seal an exhaust port in the process chamber. The valve may be moveable in the X, Y, and Z directions relative to the exhaust port to adjust a gas flow pattern (including, e.g., flow rate and/or flow uniformity) within the process chamber. Methods of adjusting a flow of a process gas within a process chamber are also provided, as are other aspects.

Abstract: Robot apparatus, substrate transport systems, and methods are described. The robot apparatus and systems are adapted to efficiently put or pick substrates at a destination by rotating a boom linkage to a position adjacent to the destination and then actuating robot assemblies to put or pick the substrates at the destination. Numerous other aspects are provided.

Abstract: Process chamber gas flow control apparatus having a tiltable valve are disclosed. The gas flow apparatus includes a process chamber adapted to contain a substrate, an exit from the process chamber including a valve seat, and a tiltable valve configured and adapted to tilt relative to the valve seat to control flow non-uniformities within the process chamber. Systems and methods including the tiltable valve apparatus are disclosed, as are numerous other aspects.

Abstract: An electronic device processing system is disclosed. The system includes a transfer chamber including facets and a plurality of single-entry process chambers coupled to the facets, wherein at least some process chambers are non-focalized process chambers, at least one load lock chamber, and a robot apparatus operable to transport substrates between the process chambers and the load lock chamber(s). Robot apparatus includes an upper arm, a forearm, and a wrist member adapted for independent rotation relative to the forearm about a wrist axis, and an end effector adapted to carry a substrate. Various degrees of yaw may be imparted to the wrist member in order to service the non-focalized process chambers. Systems and methods are also provided as are other aspects.

Abstract: Embodiments include multi-arm robots for substrate transport systems that include a boom, first and second forearms rotationally coupled to the boom, the second forearm being shorter than the first forearm, a first wrist member rotationally coupled to the first forearm, and a second wrist member rotationally coupled to the second forearm. Each of the boom, first and second forearms, and the first and second wrist members are configured to be independently rotated to carry out substrate motion profiles. Electronic device processing systems and methods of transporting substrates are described, as are numerous other aspects.

Abstract: Embodiments disclose a vibration-controlled robot apparatus. The apparatus includes a robot having an end effector operable to transport a substrate, a sensor coupled to the robot, the sensor operable to sense vibration as the robot transports the substrate, and operating the robot to reduce vibration of the end effector supporting the substrate. In some embodiments, a filter is provided in the motor drive circuit to filter one or more frequencies causing unwanted vibration of the end effector. Vibration control systems and methods of operating the same are provided, as are other aspects.

Abstract: A wafer handling system may include upper and lower linked robot arms that may move a wafer along a nonlinear trajectory between chambers of a semiconductor processing system. These features may result in a smaller footprint in which the semiconductor processing system may operate, smaller transfer chambers, smaller openings in process chambers, and smaller slit valves, while maintaining high wafer throughput. In some embodiments, simultaneous fast wafer swaps between two separate chambers, such as load locks and ALD (atomic layer deposition) carousels, may be provided. Methods of wafer handling are also provided, as are other aspects.

Abstract: Substrate transport systems, apparatus, and methods are described. In one aspect, the systems are disclosed having vertically stacked transfer chamber bodies. In one embodiment, a common robot apparatus services process chambers or load lock chambers coupled to upper and lower transfer chamber bodies. In another embodiment, separate robot apparatus service the process chambers and/or load lock chambers coupled to upper and lower transfer chamber bodies, and an elevator apparatus transfers the substrates between the various elevations. Degassing apparatus are described, as are numerous other aspects.

Abstract: A load lock door assembly with side actuation is disclosed. Load lock door assembly includes a load lock door and a door support assembly coupled thereto. Door support assembly includes one or more pivot members pivotable relative to one or more sides of the load lock body, a door support bracket coupled to the load lock door, one or more separator side actuators coupled between the door support bracket being actuatable to separate the load lock door from a sealing surface, and one or more pivot side actuator operable to pivot the load lock door above or below the load lock entry. Load lock apparatus with side actuation, systems including one or more load lock door assemblies with side actuation, and methods of operating load lock door assemblies are provided, as are numerous other aspects.

Abstract: In some embodiments, a linked processing tool system is provided that includes (1) a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; (2) a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; (3) a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; and (4) a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system. Numerous other aspects are provided.

Abstract: Electronic device processing systems and robot apparatus are described. The systems and apparatus are adapted to efficiently pick or place substrates into twin chambers by having independently rotatable first and second booms, and independently rotatable first and second upper arms, wherein each upper arm has a forearm, a wrist member, and an end effector adapted to carry a substrate coupled thereto. The boom members and upper arms are driven through co-axial drive shafts in some embodiments. Co-axial and non-coaxial drive motors are disclosed. Methods of operating the robot apparatus and processing systems are provided, as are numerous other aspects.