Abstract: A class of micromachine linear actuators whose function is based on gas driven pistons in which capillary forces are used to seal the gas behind the piston. The capillary forces also increase the amount of force transmitted from the gas pressure to the piston. In a major subclass of such devices, the gas bubble is produced by thermal vaporization of a working fluid. Because of their dependence on capillary forces for sealing, such devices are only practical on the sub-mm size scale, but in that regime they produce very large force times distance (total work) values.

Abstract: A microengine uses two synchronized linear actuators as a power source and converts oscillatory motion from the actuators into rotational motion via direct linkage connection to an output gear or wheel. The microengine provides output in the form of a continuously rotating output gear that is capable of delivering drive torque to a micromechanism. The microengine can be operated at varying speeds and its motion can be reversed. Linear actuators are synchronized in order to provide linear oscillatory motion to the linkage means in the X and Y directions according to a desired position, rotational direction and speed of said mechanical output means. The output gear has gear teeth on its outer perimeter for directly contacting a micromechanism requiring mechanical power. The gear is retained by a retaining means which allows said gear to rotate freely. The microengine is microfabricated of polysilicon on one wafer using surface micromachining batch fabrication.

Abstract: A micro-miniature resonator-oscillator is disclosed. Due to the miniaturization of the resonator-oscillator, oscillation frequencies of one MHz and higher are utilized. A thickness-mode quartz resonator housed in a micro-machined silicon package and operated as a "telemetered sensor beacon" that is, a digital, self-powered, remote, parameter measuring-transmitter in the FM-band. The resonator design uses trapped energy principles and temperature dependence methodology through crystal orientation control, with operation in the 20-100 MHz range. High volume batch-processing manufacturing is utilized, with package and resonator assembly at the wafer level. Unique design features include squeeze-film damping for robust vibration and shock performance, capacitive coupling through micro-machined diaphragms allowing resonator excitation at the package exterior, circuit integration and extremely small (0.1 in. square) dimensioning.