Patents by Inventor Jeng-Da Wu

Jeng-Da Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip package with thermometer
    Publication number: 20040032025
    Abstract: A flip chip package with a thermometer comprises a chip, a substrate, and a thermal couple. The chip has an active surface and a plurality of bumps disposed on the active surface. The substrate defines a region for disposing the chip, and comprises a plurality of bump pads disposed on the region, corresponding to the bumps, and electrically connected to the bumps. Each of the thermal couples comprises a thermal contact which is disposed between the substrate and one of the bumps of the chip.
    Type: Application
    Filed: August 13, 2003
    Publication date: February 19, 2004
    Inventors: Jeng Da Wu, Ching Hsu Yang