Abstract: An optical encoder system includes a module that has a light emitting element and a light detecting element, wherein the light detecting element is operable to detect light at a wavelength emitted by the light emitting element. The optical encoder system also includes a code wheel that has facets on its surface. Each facet has a surface that provides diffuse reflectance, with adjacent facets being inclined by different amounts. The code wheel can be disposed with respect to the module so that at least some light emitted by the light emitting element is reflected by the facets back toward the module, wherein an amount of reflected light detected by the light detecting element in the module depends at least in part on the rotational position of the code wheel.

Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.

Abstract: An optical encoder system includes a module that has a light emitting element and a light detecting element, wherein the light detecting element is operable to detect light at a wavelength emitted by the light emitting element. The optical encoder system also includes a code wheel that has facets on its surface. Each facet has a surface that provides diffuse reflectance, with adjacent facets being inclined by different amounts. The code wheel can be disposed with respect to the module so that at least some light emitted by the light emitting element is reflected by the facets back toward the module, wherein an amount of reflected light detected by the light detecting element in the module depends at least in part on the rotational position of the code wheel.

Abstract: Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.

Abstract: Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.

Abstract: Compact optoelectronic modules are described and can be used in various electronic or other appliances, such as television units. For example, a light emitting device, a first sensor or sensor module such as an infra-red sensor or an infra-red receiver module, and a second sensor or sensor module such as an ambient light sensor or ambient light sensor module, can be integrated into a single compact optoelectronic module. Multiple such optoelectronic modules can be fabricated in a wafer-level process.

Abstract: Opto-electronic modules include conductive wiring and connections that can facilitate integrating the modules into an external device. Some opto-electronic modules include an opto-electronic stack that includes at least one lens and an opto-electronic element. Conductive paths can extend from the bottom to the top of the module. The conductive paths can include conductive pads on the surface of the opto-electronic element, as well as wiring at least partially embedded in a substrate and walls of a housing for the opto-electronic stack. Conductive connections can be disposed between a top surface of the substrate and the bottom surface of the walls such that the conductive connections electrically connect the second wiring to the first wiring and to the conductive pads on the surface of the opto-electronic element. The modules can be fabricated, for example, in wafer-level processes so that multiple opto-electronic modules can be manufactured at the same time.