Abstract: Disclosed is a holster configurable and reconfigurable to hold different objects. The holster includes a first flexible sheet with first and second surfaces and an aperture therein. One surface of the sheet is substantially covered with one fastener component of a hook-and-loop fastener material and the other surface is substantially covered with the other fastener component of a hook-and-loop fastener material. A retention member is attachable over at least a portion of the aperture and has a friction surface that, through the aperture, contacts a surface of the object being held in the holster. The holster may include an attachment panel for repositionably attaching the holster to a surface of a separate article.

Abstract: An adjustable solenoid assembly with an adjustable threaded pole having an interference fit section to be used with a complementary threaded receiver (e.g., the bore of the top plate) with an interference fit section. The adjustable threaded sections are used to pull or push the interference fit sections together and allow for precise locating of the interference fit sections and adjustment. The threaded pole may be used to set and maintain a precision working air gap between the pole piece and the plunger of the electromagnetic solenoid assembly. The interference fit holds the pole piece into location while still allowing the solenoid to be adjustable without a loss in flux density.

Abstract: Pasta filata cheese, such as mozzarella and provolone, is molded and chilled by delivering the warm, plastic cheese through a cheese inlet port into a plurality of molds at an inlet station. A fluid, such as chilled water, is circulated around the molds to cool the pasta filata cheese therein. After cooling to some degree, force is applied to the upper surface of the cheese in each mold to prevent a depression from forming in that surface. Thereafter upon cooling for a desired amount, the pasta filata cheese is ejected from the plurality of molds at an outlet station.

Abstract: Expandable luggage devices are provided. Included within expandable luggage devices is an expandable backpack that is convertible between at least two positions. An uppermost cover portion of the backpack converts to a side or back portion when the backpack is expanded, and a secondary cover portion is withdrawn from an internal area of the device to enclose or cover the backpack in the second position.

Abstract: Provided are microfluidic devices and methods for fabricating and bonding such devices. Also provided are kits for analyzing analyte-containing samples and for lysing cells.

Abstract: In one embodiment, a fuel processor for use in a fuel cell system, may have a bottom plate, having a regenerator having a first inlet to receive an air flow, a burner flow chamber within the regenerator, the burner flow chamber having a second inlet to receive the air flow from the regenerator, and a reformer flow chamber positioned between the regenerator and the burner flow chamber, the reformer flow chamber having a third inlet to receive the air flow from the burner chamber, wherein the burner flow chamber and the reformer flow chamber is formed of a monolithic structure having an elongated, rounded baffle in the center of the monolithic structure. The fuel processor may also have a top plate coupled to the bottom plate to enclose the fuel processor, the top plate having a top surface and a bottom surface.

Abstract: A method for manufacturing a fuel processor may comprise coupling a plurality of micro-tubes in parallel to form a flow field tube array, each of the plurality of micro-tubes designed to receive a fluid flow, depositing a catalyst layer inside each of the plurality of micro-tubes, and attaching at least one burner to a first end of the flow field tube array.

Abstract: In one embodiment, a fuel processor for use in a fuel cell system, may have a bottom plate, having a regenerator having a first inlet to receive an air flow, a burner flow chamber within the regenerator, the burner flow chamber having a second inlet to receive the air flow from the regenerator, and a reformer flow chamber positioned between the regenerator and the burner flow chamber, the reformer flow chamber having a third inlet to receive the air flow from the burner chamber, wherein the burner flow chamber and the reformer flow chamber is formed of a monolithic structure having an elongated, rounded baffle in the center of the monolithic structure. The fuel processor may also have a top plate coupled to the bottom plate to enclose the fuel processor, the top plate having a top surface and a bottom surface.

Abstract: Lidded chip packages are provided in which an optoelectronic device chip has microelectronic circuits exposed at a surface of the chip with a lid mounted to overlie the optoelectronic device and the microelectronic circuits. An opaque film may be attached to the lid to overlie the microelectronic circuits while exposing the optoelectronic device. Lidded chip packages are also provided in which the lid overlies an active or passive device mounted to the chip. Wiring traces may be embedded within an adhesive between the lid and the chip.

Abstract: A backpack with a retractable seat is disclosed having a pouch with a sleeve secured thereto. A seat is selectively positionable within the sleeve and has extension straps secured to a lower portion thereof and retraction straps secured to an upper portion thereof. The lower portion of the seat is wider than the upper portion. The seat is deployed by gripping the extension straps and withdrawing the seat. The seat is then bent to conform to the lower back and hips of a user such that the lower portion is directly beneath the user. The seat is retracted by pulling on the retraction straps. In an alternative embodiment, the seat comprises multiple panels folded over one another when retracted into the sleeve.

Abstract: A dielectric structure is formed by a molding process, so that a first surface of a dielectric structure is shaped by contact with the mold. The opposite second surface of the dielectric structure is applied onto the front surface of a wafer element. The dielectric layer may include protruding bumps and terminals may be formed on the bumps. The bumps may be of a precise height. The terminals lie at a precisely controlled height above the front surface of the wafer element. The terminals may include projecting posts which extend above a surrounding solder mask layer to facilitate engagement with a test fixture. The posts are immersed within solder joints when the structure is bonded to a circuit panel.

Abstract: A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The package includes a plurality of support elements disposed between the microelectronic element and the substrate and supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements. The assembly includes a circuitized substrate having conductive pads confronting the conductive posts of the microelectronic package, whereby the conductive posts are electrically interconnected with the conductive pads.

Abstract: A deltoid arm protection system for a ballistic vest including an asymmetrical anatomically shaped deltoid cover having fasteners for attachment to a ballistic vest. The deltoid cover is connected to the vest and prevents any gaps forming between the deltoid cover and the vest during arm movement of the wearer. The deltoid cover includes a weapon gripping pad and attachment loops on an outer surface of the deltoid cover.

Abstract: A tool is provided for applying a flowable composition onto a receiving surface. The tool includes a polyceramic coating on a surface thereof and may take the form of a stencil or mold. Also provided are an apparatus and a method that uses the tool. In use, the tool is placed such that its polyceramic-coated surface is in contact with the flowable composition, which, in turn, simultaneously contacts the receiving surface.

Abstract: A coated semiconductor member is provided having a carbon-containing halogenated polymeric coating bonded to a surface thereof. The semiconductor member may take any of a number of forms, such as the form of a chip or a wafer containing one or more microelectronic devices. The coating may be bonded to the surface in a manner and quantity effective to provide the member an increased strength. In addition or in the alternative, the coating may improve the electrical performance of the member. Optionally, the coating has a microstructure associated with vapor phase in situ addition polymerization. Also provided is a method for coating a semiconductor member.

Abstract: Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads.

Abstract: Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads.

Abstract: A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.

Abstract: A microelectronic fold package is formed from an in-process unit including an internal unit such as a chip and a tape defining a bottom run extending beneath the internal unit, a top run extending above the internal unit and a fold connecting said top and bottom runs. The in-process unit is engaged between a pair of elements having flat surfaces so that these elements form the top and bottom runs to a substantially flat condition at least in regions between the internal unit and the fold and so that the engagement elements form the fold to a height equal to the height of the internal unit.

Abstract: A backpack having a storage compartment (134) and a shoulder strap assembly (129a) attached at a first end to the storage compartment at a first location (140) and coupled at a second end to the storage compartment at a second location spaced from the first location. The backpack further includes a buckle (116) attached to the shoulder strap assembly and a lift strap (118) having a first end (120) attached to the upper portion (136) of the storage compartment and spanning above the shoulder strap assembly from its location of attachment to the storage compartment to engagement with the buckle. The buckle is operable to selectively adjust the length of the lift strap to vary the proportion of the weight of the backpack supported by the shoulder strap assembly when engaged by the shoulders of a user wearing the backpack.