Patents by Inventor Ji-hyuk Lim

Ji-hyuk Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140139835
    Abstract: A measurement device of a degree of cure, and more particularly, a measurement device of a degree of cure capable of using while being portable in a production line. The measurement device of the degree of cure includes: a light source; a light transmission and reflection mirror passing through a light irradiated from the light source and reflecting scattered light reflected and returned from a sample; a light splitting mirror transmitting and reflecting the scattered light so as to detect intensity of the scattered light reflected by the light transmission and reflection mirror; a detector detecting the intensity of the scattered light transmitted and reflected by the light splitting mirror; and a data obtaining unit collecting data of the intensity of the scattered light detected by the detector.
    Type: Application
    Filed: October 22, 2013
    Publication date: May 22, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ji Hoon KIM, Suk Jin Ham, Ji Hyuk Lim
  • Patent number: 8682657
    Abstract: An apparatus and a method for improving communication sound quality in a mobile terminal in order to remove a neighboring noise that occurs together with a user's voice signal in a mobile terminal by discriminating signals occurring at different distances using two microphones and removing a noise. The mobile terminal preferably includes a first microphone, a second microphone, and a voice processor. The first microphone receives a voice signal occurring at a closer distance from the mobile terminal and a voice signal occurring at a longer distance from the mobile terminal. The second microphone receives only a voice signal occurring at the long distance. The voice processor discriminates between the signal occurring at the long distance and the signal occurring at the close distance by receiving voice signals received via the first microphone and the second microphone at different phases.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: March 25, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji-Hyuk Lim, Jang-Young Ryu, Dong-Seon Lee
  • Patent number: 8552617
    Abstract: Provided is an energy harvesting device using pyroelectric materials. The energy harvesting device includes a first heat source; a second heat source having a temperature higher than a temperature of the first heat source; and a cantilever which is interposed between the first heat source and the second heat source, the cantilever including a first film formed of a pyroelectric material and a second film, where the first film is disposed on the second film and a thermal expansion coefficient of the second film is different from that of the pyroelectric material of the first film. Electric energy is generated by periodically changing a temperature within the first film.
    Type: Grant
    Filed: July 13, 2010
    Date of Patent: October 8, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Ji-hyuk Lim
  • Publication number: 20130050901
    Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic main body including a dielectric layer; and first and second internal electrodes provided on upper and lower surfaces of the dielectric layer and formed of a thin film including graphene. The multilayer ceramic electronic component includes internal electrodes formed of a thin film including graphene, thereby having increased capacitance and improved thermal stability and withstand voltage characteristics.
    Type: Application
    Filed: August 9, 2012
    Publication date: February 28, 2013
    Inventors: Kwang Jik LEE, Suk Jin HAM, Ji Hyuk LIM
  • Publication number: 20130048943
    Abstract: There are provided an organic light emitting diode and a fabrication method thereof. The organic light emitting diode includes: an anode formed on a substrate; a thin film layer formed on the anode and including graphene; a light emitting polymer layer formed on the thin film layer; and a cathode formed on the light emitting polymer layer. Heat generated from the device can be effectively dissipated, stability of the device can be enhanced, and a life span of the device can be extended.
    Type: Application
    Filed: August 13, 2012
    Publication date: February 28, 2013
    Inventors: Kwang Jik Lee, Suk Jin Ham, Ji Hyuk Lim
  • Publication number: 20130038982
    Abstract: Disclosed herein are a multilayer ceramic condenser and a method for manufacturing the same. The multilayer ceramic condenser includes inner metal electrode layers formed within a magnetic layer, and conductive layers each formed between the inner metal electrode layers, and a method for manufacturing the same. According to the present invention, a contact between the inner metal electrode layers in the multilayer ceramic condenser can be prevented, thereby reducing the manufacturing loss due to occurrence of short circuits and improving thermal stability, by forming an ultrathin conducting layer with a thickness of about 10 nm or less between the inner metal electrode layers. Therefore, the multilayer ceramic condenser can be ensured to have excellent reliability to meet the demands of markets requesting a high-capacity multilayer ceramic condenser (MLCC) having high performance, small size, and light weight.
    Type: Application
    Filed: March 6, 2012
    Publication date: February 14, 2013
    Inventors: Kwang Jik Lee, Suk Jin Ham, Ji Hyuk Lim
  • Publication number: 20120286248
    Abstract: There are provided an organic light emitting diode and a method of manufacturing the same. The organic light emitting diode includes: an anode formed on a substrate; a protective layer having at least one inorganic material layer stacked therein, the at least one inorganic material layer containing at least one of a nano-clay and a graphite oxide; a light emitting polymer layer formed on the protective layer; and a cathode formed on the light emitting polymer layer. In the case of the organic light emitting diode, the injection concentration of holes may be controlled, such that the stability of an element may be improved and the lifespan thereof may be increased.
    Type: Application
    Filed: November 3, 2011
    Publication date: November 15, 2012
    Inventors: Kwang Jik LEE, Suk Jin Ham, Ji Hyuk Lim
  • Publication number: 20120276372
    Abstract: There are provided a multilayer thin film for a ceramic electronic component and a method of manufacturing the same. The multilayer thin film includes a substrate; and a ceramic layer and a metal layer alternately formed on at least one of upper and lower surfaces of the substrate, wherein at least one of the ceramic layer and the metal layer has a height corresponding to a thickness of at least one of a plurality of particles arranged on a plane. With the multilayer thin film for a ceramic electronic component, the number of layers increases and a distance between electrodes decreases, whereby capacitance may increase.
    Type: Application
    Filed: November 10, 2011
    Publication date: November 1, 2012
    Inventors: Kwang Jik LEE, Suk Jin Ham, Ji Hyuk Lim
  • Publication number: 20120268861
    Abstract: There are provided a ceramic sheet product for a ceramic electronic component, a multilayer ceramic electronic component using the same, and a method of manufacturing the multilayer ceramic electronic component. The ceramic sheet product for a ceramic electronic component includes a ceramic layer; a metal layer formed on the ceramic layer; and metal nanostructures contacting the metal layer and protruding from the metal layer to an inner portion of the ceramic layer. With the multilayer ceramic electronic component using the ceramic sheet product for a ceramic electronic component, an interval between electrodes is reduced to thereby allow for the increase of capacitance, whereby a multilayer ceramic electronic component having high capacitance may be provided.
    Type: Application
    Filed: November 4, 2011
    Publication date: October 25, 2012
    Inventors: Kwang Jik LEE, Suk Jin Ham, Ji Hyuk Lim
  • Patent number: 8274198
    Abstract: An ultrasonic motor includes a fixed member including a surface, a movable member positioned to face the surface of the fixed member, and an actuator to cause at least a portion of the movable member to contact the surface of the fixed member and cause the movable member to move relative to the fixed member.
    Type: Grant
    Filed: October 7, 2009
    Date of Patent: September 25, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sunghyuk Park, Jin-woo Cho, Ji-hyuk Lim
  • Patent number: 8237330
    Abstract: A vibrating element of an ultrasonic motor includes a vibrating member, and a piezoelectric body to produce a traveling wave thus to vibrate the vibrating member when electric power is applied to the piezoelectric body. The piezoelectric body includes a first piezoelectric layer attached to the vibrating member and in which positive poles and negative poles are alternately polarized, a second piezoelectric layer attached to the first piezoelectric layer and in which positive poles and negative poles are alternately polarized, a plurality of electrodes formed on opposite surfaces of the first and second piezoelectric layers, and an electrode connecting part formed on outer circumferential surfaces of the first and second piezoelectric layers to selectively connect the plurality of electrodes to one other.
    Type: Grant
    Filed: February 10, 2009
    Date of Patent: August 7, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jin-woo Cho, Ji-hyuk Lim, Sung-hyuk Park
  • Publication number: 20120024583
    Abstract: A multilayer laminate package and a method of manufacturing the same are provided. The multilayer laminate package includes a cavity layer, a non-cavity layer, an electronic component, and a metalized blind via. The cavity layer includes a first adhesive layer and two first circuit layers, which are stacked with the first adhesive layer between, and an opening. The non-cavity layer includes a second adhesive layer and a second circuit layer. The non-cavity layer is bonded to the cavity layer with the second adhesive layer so as to close one side of the opening. The electronic component is mounted in the opening and is electrically connected to the non-cavity layer exposed through the opening. The metalized blind via electrically connects the non-cavity layer to one of the circuit layers of the cavity layer.
    Type: Application
    Filed: March 3, 2011
    Publication date: February 2, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Baik-Woo LEE, Ji-Hyuk LIM, Seong-Woon BOOH
  • Publication number: 20110282659
    Abstract: An apparatus and a method for improving communication sound quality in a mobile terminal in order to remove a neighboring noise that occurs together with a user's voice signal in a mobile terminal by discriminating signals occurring at different distances using two microphones and removing a noise. The mobile terminal preferably includes a first microphone, a second microphone, and a voice processor. The first microphone receives a voice signal occurring at a closer distance from the mobile terminal and a voice signal occurring at a longer distance from the mobile terminal. The second microphone receives only a voice signal occurring at the long distance. The voice processor discriminates between the signal occurring at the long distance and the signal occurring at the close distance by receiving voice signals received via the first microphone and the second microphone at different phases.
    Type: Application
    Filed: May 13, 2011
    Publication date: November 17, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji-Hyuk LIM, Jang-Young RYU, Dong-Seon LEE
  • Patent number: 8049396
    Abstract: A piezoelectric ultrasonic motor and a method of manufacturing the piezoelectric ultrasonic motor. The piezoelectric ultrasonic motor includes: a piezoelectric body that generates a traveling wave according to an applied voltage signal; a vibrator that is attached to the piezoelectric body and vibrates; and a rotator that contacts the vibrator and is rotated by friction with the vibrating vibrator, wherein the rotator includes a plate spring member having a contact portion that contacts the vibrator, a support member that is coupled to the plate spring member and supports the plate spring member, and a buffer space defined by the plate spring member and the support member.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: November 1, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-hyuk Park, Jin-woo Cho, Ji-hyuk Lim
  • Patent number: 8045318
    Abstract: A tunable capacitor using an electrowetting phenomenon includes a first electrode; a second electrode which is spaced apart from the first electrode and faces the first electrode; a fluidic channel which is disposed between the first electrode and the second electrode; a first insulating layer which is disposed between the first electrode and the fluidic channel; and a conductive fluid which is disposed in the fluidic channel and moves along the fluidic channel when a direct current (DC) potential difference occurs between the first and second electrodes. Accordingly, it is possible to fabricate the tunable capacitor with the simplified fabrication process, good reliability and durability, and no restriction on the tuning range.
    Type: Grant
    Filed: January 6, 2010
    Date of Patent: October 25, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-tae Choi, Ji-hyuk Lim, Woon-bae Kim, Eun-seok Park, Jeong-yub Lee
  • Publication number: 20110169372
    Abstract: Provided is an energy harvesting device using pyroelectric materials. The energy harvesting device includes a first heat source; a second heat source having a temperature higher than a temperature of the first heat source; and a cantilever which is interposed between the first heat source and the second heat source, the cantilever including a first film formed of a pyroelectric material and a second film, where the first film is disposed on the second film and a thermal expansion coefficient of the second film is different from that of the pyroelectric material of the first film. Electric energy is generated by periodically changing a temperature within the first film.
    Type: Application
    Filed: July 13, 2010
    Publication date: July 14, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Ji-hyuk LIM
  • Patent number: 7906841
    Abstract: A wafer level encapsulation chip and an encapsulation chip manufacturing method. The encapsulation chip includes a device substrate, a circuit module mounted on the device substrate, a bonding layer deposited on a predetermined area of the device substrate, a protection cap forming a cavity over the circuit module and bonded to the device substrate by the bonding layer and encapsulation portions formed on predetermined areas of the bonding layer and the protection cap. Thus, the present invention can minimize damages to a chip upon chip handling and prevent moisture from being introduced into the inside of the chip.
    Type: Grant
    Filed: June 7, 2006
    Date of Patent: March 15, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Byung-gil Jeong, In-sang Song, Woon-bae Kim, Min-seog Choi, Suk-jin Ham, Ji-hyuk Lim
  • Publication number: 20100194242
    Abstract: A piezoelectric ultrasonic motor and a method of manufacturing the piezoelectric ultrasonic motor. The piezoelectric ultrasonic motor includes: a piezoelectric body that generates a traveling wave according to an applied voltage signal; a vibrator that is attached to the piezoelectric body and vibrates; and a rotator that contacts the vibrator and is rotated by friction with the vibrating vibrator, wherein the rotator includes a plate spring member having a contact portion that contacts the vibrator, a support member that is coupled to the plate spring member and supports the plate spring member, and a buffer space defined by the plate spring member and the support member.
    Type: Application
    Filed: August 4, 2009
    Publication date: August 5, 2010
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sunghyuk PARK, Jin-woo CHO, Ji-hyuk LIM
  • Patent number: 7755151
    Abstract: A wafer level package for a surface acoustic wave device and a fabrication method thereof include a SAW device formed with a SAW element on an upper surface of a device wafer; a cap wafer joined on an upper part of the SAW element; a cavity part housing the SAW element between the cap wafer and the SAW device; a cap pad formed on an upper surface of the cap wafer; and a metal line formed to penetrate through the cap wafer to electrically connect the cap pad and the SAW element, the device wafer and the cap wafer being made of the same materials.
    Type: Grant
    Filed: May 2, 2006
    Date of Patent: July 13, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji-hyuk Lim, Jun-sik Hwang, Woon-bae Kim, Suk-jin Ham, Jong-oh Kwon, Moon-chul Lee, Chang-youl Moon
  • Patent number: 7741774
    Abstract: A method of fabricating a backlight module in which at least one luminescence element is positioned, including: positioning a luminescence element in at least one cavity formed on a carrier; forming a lower electrode on a substrate; transferring the luminescence element positioned on the carrier to the substrate, connecting the luminescence element to a pattern of the lower electrode formed on the substrate, and removing the carrier; forming an insulating layer on a surface of the substrate to which the luminescence element is transferred, and exposing a top region of the luminescence element; and forming an upper electrode on the exposed top region of the luminescence element. Accordingly, the backlight module including very small luminescence elements being of a micro unit in size is easily fabricated.
    Type: Grant
    Filed: November 29, 2006
    Date of Patent: June 22, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-tae Choi, Ki-hwan Kwon, Su-ho Shin, Ji-hyuk Lim, Chang-youl Moon, Kyu-ho Shin