Patents by Inventor Jian Lin

Jian Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11937371
    Abstract: A radio frequency (RF) system and a communication device are provided. The RF system includes a flexible circuit board, a first antenna module and a RF module. The flexible circuit board has a first surface and a second surface, and the first surface and the second surface are located at different sides of the flexible circuit board. The first antenna module is disposed on the first surface of the flexible circuit board. The first antenna module includes a first carrier, a first antenna element disposed on or in the first carrier, and a first conductive member between the first carrier and the flexible circuit board. The RF module is disposed on the second surface of the flexible circuit board and electrically connected to the first antenna module.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: March 19, 2024
    Assignee: MEDIATEK INC.
    Inventors: Wun-Jian Lin, Chung-Hsin Chiang, Yeh-Chun Kao, Shih-Huang Yeh
  • Publication number: 20240088561
    Abstract: An antenna structure is provided. The antenna structure includes a first metal layer and a second metal layer disposed over the first metal layer. The second metal layer forms a first antenna resonating element operating at a first band and has a first opening. The antenna structure also includes a third metal layer disposed over the second metal layer. The third metal layer forms a second antenna resonating element operating at a second band, which is different from the first band. The antenna structure further includes a first transmission line extending from the first metal layer to the second metal layer and a second transmission line extending from the first metal layer through the first opening to the third metal layer.
    Type: Application
    Filed: August 29, 2023
    Publication date: March 14, 2024
    Inventors: Yen-Ju LIN, Chung-Hsin CHIANG, Wun-Jian LIN, Shih-Huang YEH
  • Publication number: 20240086045
    Abstract: The present disclosure provides an information processing method and apparatus, a terminal, and a storage medium. The information processing method comprises: receiving first task information at an instant messaging client, and displaying the first task information in a first category interface of a task interface of the instant messaging client; and in response to a preset operation of the first task information, displaying second task information in a second category interface of the task interface of the instant messaging client, wherein executors of the first task information and the second task information are different. The present disclosure classifies tasks more accurately and facilitates the tracking and management of the tasks.
    Type: Application
    Filed: January 12, 2022
    Publication date: March 14, 2024
    Inventors: Yiyuan LIN, Yuanye WU, Jian SUN, Yifei XUE
  • Patent number: 11927844
    Abstract: Provided is a display substrate. The display substrate includes: a base substrate including a display region and a non-display region surrounding the display region; a gate drive circuit disposed in the non-display region; a plurality of first signal lines disposed in the peripheral region and connected to the gate drive circuit; and a plurality of second signal lines disposed in the non-display region and connected to the gate drive circuit; wherein each of the first signal line and the second signal line is configured to supply a signal to the gate drive circuit, and a frequency of the signal supplied by the first signal line is lower than a frequency of the signal supplied by the second signal line.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: March 12, 2024
    Assignees: Beijing BOE Optoelectronics Technology Co., Ltd., BOE Technology Groups Co., Ltd.
    Inventors: Zepeng Sun, Yong Zhang, Xianglei Qin, Jian Wang, Yanchen Li, Jian Lin, Limin Zhang, Zhichao Yang, Liangzhen Tang, Zhilong Duan, Yashuai An, Lingfang Nie, Honggui Jin, Li Tian
  • Publication number: 20240079767
    Abstract: An antenna module is provided. The antenna module includes a dielectric substrate, a radio frequency integrated circuit (RFIC) and a first number of first antennas. The radio frequency integrated circuit (RFIC) is disposed on the dielectric substrate, wherein the RFIC comprises a single first antenna port group and second antenna port groups to receive or transmit signals. The first number of first antennas is arranged in a first row on the dielectric substrate, wherein at least two of the first antennas are connected to the first antenna port group of the RFIC.
    Type: Application
    Filed: August 24, 2023
    Publication date: March 7, 2024
    Inventors: Yen-Ju LIN, Wun-Jian LIN, Shih-Huang YEH, Nai-Chen LIU
  • Patent number: 11919948
    Abstract: The invention provides isoform-selective anti-TGF? antibodies and methods of using the same. In particular, isoform-selective anti-TGF?2, anti-TGF?3, and anti-TGF?2/3 monoclonal antibodies are provided, e.g., for the treatment of fibrosis and other TGF?-related disorders.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: March 5, 2024
    Assignee: GENENTECH, INC.
    Inventors: Wei-Ching Liang, Joseph R. Arron, Daryle Depianto, Wendy Green Halpern, WeiYu Lin, Patrick J. Lupardus, Thirumalai Rajan Ramalingam, Dhaya Seshasayee, Tianhe Sun, Tulika Tyagi, Jia Wu, Yan Wu, Jian Ping Yin
  • Publication number: 20240071885
    Abstract: A semiconductor device has a first hybrid substrate with a first thickness, and a second hybrid substrate with a second thickness different from the first thickness of the first hybrid substrate. An encapsulant is deposited around the first hybrid substrate and second hybrid substrate. A portion of the first hybrid substrate and a portion of the second hybrid substrate and a portion of the encapsulant can be removed after encapsulation to achieve uniform thickness for the first hybrid substate and second hybrid substrate. The first hybrid substrate has an embedded substrate, a first interconnect structure formed over a first surface of the embedded substrate, and a second interconnect structure formed over a second surface of the embedded substrate opposite the first surface of the embedded substrate. A plurality of conductive pillars is formed over the first interconnect structure. A plurality of conductive vias is formed through the embedded substrate.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Applicant: STATS ChipPAC Pte. Ltd.
    Inventors: Yaojian Lin, Linda Pei Ee Chua, Jian Zuo, Hin Hwa Goh
  • Publication number: 20240069131
    Abstract: The present disclosure relates to MRI device communications. The communications comprise: acquiring a received signal from a transmitting end, the received signal comprising multiple data symbols and multiple training symbol sets, each training symbol set comprising a first preset number of training symbols, with two adjacent training symbol sets of the multiple training symbol sets being spaced apart by a second preset number of the data symbols; extracting the first preset number of symbols from the received signal at intervals of the second preset number of symbols, to obtain a third preset number of symbols as a candidate training sequence; determining whether the candidate training sequence comprises the multiple training symbol sets; and in response to a determination that the candidate training sequence comprises the multiple training symbol sets, determining at least one of synchronization information and channel estimation information of the received signal.
    Type: Application
    Filed: August 31, 2023
    Publication date: February 29, 2024
    Applicant: Siemens Healthcare GmbH
    Inventors: Jia Lin He, JianMin Wang, Jian Hong Liu, Li Chen Zhu
  • Publication number: 20240072426
    Abstract: An antenna and an electronic device including the antenna are provided. The antenna includes a pair of radiators, a pair of feeding elements, first and second feeding ports. The radiators are located beside a geometric origin and separated from each other. The geometric origin is located between the radiators. The feeding elements are located below the pair of radiators and are configured to feed signals to the radiators. The pair of feeding elements includes a first feeding element and a second feeding element that are separated from each other. The first feeding element has a first geometric configuration. The second feeding element has a second geometric configuration that is asymmetric to the first geometric configuration. The first feeding port is electrically connected to the first feeding element. The second feeding port is separated from the first feeding port and electrically connected to the second feeding element.
    Type: Application
    Filed: August 22, 2023
    Publication date: February 29, 2024
    Inventors: Nai-Chen LIU, Chung-Hsin CHIANG, Wun-Jian LIN, Shih-Huang YEH
  • Patent number: 11912623
    Abstract: A fluidized solidified soil based on gold tailings includes the following raw materials in parts by mass: 75 parts to 80 parts of gold tailings, 5.2 parts to 13 parts of a dispersant solution, and 9 parts to 16 parts of a solidifying material. A preparation method includes the following steps: mixing the gold tailings with the dispersant solution, and then stirring to obtain a suspension slurry of the gold tailings; and adding the solidifying material, and stirring to obtain the fluidized solidified soil. In the present disclosure, the gold tailings are used as a main material, combined with a special dispersant solution and a special solidifying material, and a fluidized solidified soil is prepared with fluidity suitable for pumping and a certain strength after hardening. The fluidized solidified soil prevents the pollution caused by gold tailings landfilling, and can be used as a filling material for various construction projects.
    Type: Grant
    Filed: May 12, 2023
    Date of Patent: February 27, 2024
    Assignees: WUHAN INSTITUTE OF TECHNOLOGY, The College of Post and Telecommunication of WIT
    Inventors: Zunqun Xiao, Caiyun Xu, Fuqi Wang, Jian Lin, Hui Wang, Zhentao Lv, Yanbin Chang, Haitao Liu, Yinlei Shi, Keqi Luo, Minghui Deng, Puyu Li, Yuepeng Zheng
  • Patent number: 11905221
    Abstract: A dispersant for premixed fluidized solidified soil includes the following raw materials in parts by weight: 5 parts to 15 parts of an anti-adhesion water reducer, 0.5 parts to 0.8 parts of a stabilizer, and 85 parts to 95 parts of water. The anti-adhesion water reducer is compounded by an inorganic dispersant and an aminosulfonic acid-based superplasticizer (ASP), and the inorganic dispersant is at least one selected from the group consisting of sodium silicate, sodium hexametaphosphate, and sodium pyrophosphate. In the present disclosure, on the premise of improving fluidity of mucky cohesive soil slurry, a strength of the fluidized solidified soil at each stage is adjusted through a water-reducing effect of the anti-adhesion water reducer. Moreover, rapid dispersion of the mucky cohesive soil slurry is realized, thus providing key technical support for preparation of the premixed fluidized solidified soil from undisturbed soil in non-dry conditions.
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: February 20, 2024
    Assignees: WUHAN INSTITUTE OF TECHNOLOGY, THE COLLEGE OF POST AND TELECOMMUNICATION OF WIT
    Inventors: Zunqun Xiao, Caiyun Xu, Hui Wang, Fuqi Wang, Zhentao Lv, Yanbin Chang, Haitao Liu, Yinlei Shi, Keqi Luo, Jian Lin, Minghui Deng, Puyu Li, Yuepeng Zheng
  • Publication number: 20240047589
    Abstract: An interconnected electrode structure, a method of manufacturing same, and a use of same are provided. The interconnected electrode structure includes an insulating base material, a through hole, a first conductive body, and a second conductive body. The insulating base material includes a first surface and a second surface which face away from each other. The through hole penetrates through the insulating base material in a thickness direction. The first conductive body is formed by conductive slurry that enters the through hole from an opening of the through hole on the first surface. The second conductive body is formed by a second conductive material that enters the through hole from an opening of the through hole on the second surface, and the second conductive body is electrically combined with the first conductive body to form a conductive channel in the insulating base material.
    Type: Application
    Filed: December 27, 2021
    Publication date: February 8, 2024
    Applicant: SUZHOU INSTITUTE OF NANO-TECH AND NANO-BIONICS (SINANO) , CHINESE ACADEMY OF SCIENCES
    Inventors: Jian LIN, Hao ZHANG, Jing WANG, Zhenguo WANG, Qun LUO, Chao GONG, Changqi MA
  • Publication number: 20240039165
    Abstract: An antenna is provided. The antenna includes a first radiator and a second radiator. The first radiator includes a first section and a second section. The first section includes a first grounding edge and a first bending edge. The second section is connected to the first bending edge. The first grounding edge is grounded. The first section is not parallel to the second section. A first slot is formed on the first section. The second radiator includes a third section and a fourth section. The third section includes a second grounding edge and a second bending edge. The fourth section is connected to the second bending edge. The second grounding edge is grounded. The third section is not parallel to the fourth section. The first section is parallel to the third section.
    Type: Application
    Filed: June 29, 2023
    Publication date: February 1, 2024
    Inventors: Hsuan-Jui CHANG, Nai-Chen LIU, Shih-Huang YEH, Chung-Hsin CHIANG, Wun-Jian LIN
  • Publication number: 20240018058
    Abstract: A dispersant for premixed fluidized solidified soil includes the following raw materials in parts by weight: 5 parts to 15 parts of an anti-adhesion water reducer, 0.5 parts to 0.8 parts of a stabilizer, and 85 parts to 95 parts of water. The anti-adhesion water reducer is compounded by an inorganic dispersant and an aminosulfonic acid-based superplasticizer (ASP), and the inorganic dispersant is at least one selected from the group consisting of sodium silicate, sodium hexametaphosphate, and sodium pyrophosphate. In the present disclosure, on the premise of improving fluidity of mucky cohesive soil slurry, a strength of the fluidized solidified soil at each stage is adjusted through a water-reducing effect of the anti-adhesion water reducer. Moreover, rapid dispersion of the mucky cohesive soil slurry is realized, thus providing key technical support for preparation of the premixed fluidized solidified soil from undisturbed soil in non-dry conditions.
    Type: Application
    Filed: May 11, 2023
    Publication date: January 18, 2024
    Applicants: WUHAN INSTITUTE OF TECHNOLOGY, THE COLLEGE OF POST AND TELECOMMUNICATION OF WIT
    Inventors: Zunqun XIAO, Caiyun XU, Hui WANG, Fuqi WANG, Zhentao LV, Yanbin CHANG, Haitao LIU, Yinlei SHI, Keqi LUO, Jian LIN, Minghui DENG, Puyu LI, Yuepeng ZHENG
  • Publication number: 20230416262
    Abstract: The present invention provides compounds, pharmaceutically acceptable compositions thereof, and methods of using the same.
    Type: Application
    Filed: August 6, 2021
    Publication date: December 28, 2023
    Inventors: Andrew Thomas Maynard, Erik Lee Meredith, Jeffrey Owen Saunders, Jian Lin, Jorge Garcia Fortanet
  • Patent number: 11850703
    Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
    Type: Grant
    Filed: February 9, 2023
    Date of Patent: December 26, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Douglas R. McAllister, Jian Lin, Stacy Meyer, Sidney P. Huey, Jeonghoon Oh, Trung T. Doan, Jeffrey P. Schmidt, Martin S. Wohlert, Kerry F. Hughes, James C. Wang, Danny Cam Toan Lu, Romain Beau De Lamenie, Venkata R. Balagani, Aden Martin Allen, Michael Jon Fong
  • Publication number: 20230382795
    Abstract: A fluidized solidified soil based on gold tailings includes the following raw materials in parts by mass: 75 parts to 80 parts of gold tailings, 5.2 parts to 13 parts of a dispersant solution, and 9 parts to 16 parts of a solidifying material. A preparation method includes the following steps: mixing the gold tailings with the dispersant solution, and then stirring to obtain a suspension slurry of the gold tailings; and adding the solidifying material, and stirring to obtain the fluidized solidified soil. In the present disclosure, the gold tailings are used as a main material, combined with a special dispersant solution and a special solidifying material, and a fluidized solidified soil is prepared with fluidity suitable for pumping and a certain strength after hardening. The fluidized solidified soil prevents the pollution caused by gold tailings landfilling, and can be used as a filling material for various construction projects.
    Type: Application
    Filed: May 12, 2023
    Publication date: November 30, 2023
    Applicants: WUHAN INSTITUTE OF TECHNOLOGY, The College of Post and Telecommunication of WIT
    Inventors: Zunqun XIAO, Caiyun XU, Fuqi WANG, Jian LIN, Hui WANG, Zhentao LV, Yanbin CHANG, Haitao LIU, Yinlei SHI, Keqi LUO, Minghui DENG, Puyu LI, Yuepeng ZHENG
  • Publication number: 20230363911
    Abstract: An implantable device is configured to be positioned within a native heart valve to allow the native heart valve to form a more effective seal. The implantable device includes a cover. The cover can be attached to one or more sleeves, can have a portion that has a lower coefficient of friction, and/or can have separate pieces that cover different portions of the implantable device.
    Type: Application
    Filed: July 14, 2023
    Publication date: November 16, 2023
    Inventors: Florian Georg Deuschl, Chris J. Okos, Waina Michelle Chu, Jian Lin Phan, Lauren R. Freschauf, Wen Yan Chen
  • Publication number: 20230346753
    Abstract: The present invention relates to compounds and compositions for the inhibition of NAMPT, their synthesis, applications and antidotes.
    Type: Application
    Filed: December 2, 2022
    Publication date: November 2, 2023
    Inventors: Kenneth W. Bair, Timm R. Baumeister, Alexandre J. Buckmelter, Karl H. Clodfelter, Peter Dragovich, Francis Gosselin, Bingsong Han, Jian Lin, Dominic J. Reynolds, Bruce Roth, Chase C. Smith, Zhongguo Wang, Po-Wai Yuen, Xiaozhang Zheng
  • Patent number: D1018135
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: March 19, 2024
    Inventor: Jian Lin