Abstract: A connector includes first contacts, second contacts, a middle plate, a first electromagnetic compatibility (EMC) pad, a second EMC pad, an insulating body, and a spacer. The middle plate is clamped between the first contacts and the second contacts. The first EMC pad is located above the first contacts. The second EMC pad is located below the second contacts. The first EMC pad and the second EMC pad are connected to the middle plate respectively. The insulating body is partially embedded with the first contacts, the second contacts, the middle plate, the first EMC pad, and the second EMC pad. The spacer is formed between the first contacts and the second contacts, and is partially embedded with the first contacts and the second contacts. A manufacturing method where the connector is assembled as a semi-finished product in advance is further provided to reduce the production cost.

Abstract: A connector includes an insulated member, a plurality of first conductive terminals, a plurality of second conductive terminals, a shielding shell, and a metal housing. The first conductive terminals are disposed on an upper surface of the insulated member and extending rearward. The second conductive terminals are disposed on a lower surface of the insulated member, extending rearward, and located below the first conductive terminals. The shielding shell is fitted over the insulated member, and the shielding shell has a plug end and a mounting end. The metal housing has a plurality of grounding structures, the metal housing is fitted over the mounting end of the shielding shell, and the grounding structures are completely located below the second conductive terminals.

Abstract: A conjugation of a cytotoxic drug to a cell-binding molecule with a bis-linker (dual-linker) as shown in Formula (I). Bis-linkage methods of making a conjugate of a cytotoxic drug/molecule to a cell-binding agent in a specific manner are also described, as well as application of the conjugates for the treatment of a cancer, or an autoimmune disease, or an infectious disease. wherein “” is an optional bond; X, Y, Z1, and Z2 are a functional group; m1 and n are a integer; L1 and L2 are a linker.

Abstract: A user identifier is obtained and an attribute identifier and an attribute value of at least one personal attribute corresponding to the user identifier is obtained. A target attribute correspondence to each personal attribute of the at least one personal attribute is generated based on the attribute identifier and the attribute value of the personal attribute. A determination is performed as to whether a target attribute storage field corresponding to the user identifier exists in stored first correspondences between one or more user identifiers and one or more attribute storage fields. When the target attribute storage field exists in the stored first correspondences, the target attribute correspondences are stored in the target attribute storage field.

Abstract: A conjugation of a cytotoxic drug to a cell-binding molecule with a bis-linker (dual-linker) as shown in Formula (I). Bis-linkage methods of making a conjugate of a cytotoxic drug/molecule to a cell-binding agent in a specific manner are also described, as well as application of the conjugates for the treatment of a cancer, or an autoimmune disease, or an infectious disease. wherein “” is an optional bond; X, Y, Z1, and Z2 are a functional group; m1 and n are a integer; L1 and L2 are a linker.

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a system for processing a substrate includes a process chamber comprising a first processing volume and a second processing volume; a first heating device configured to heat a substrate to a first temperature; a carrier configured to support the substrate while the substrate is being heated using the first heating device to the first temperature and transfer the substrate to and from each of the first processing volume and the second processing volume; a second heating device configured to maintain the substrate at or near the first temperature; and a chuck configured to receive the substrate from the carrier, and comprising an outer zone and an inner zone having independent variable pressure control to apply a chucking force at the outer zone that is different from a chucking force provided at the inner zone.

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a system for processing a substrate includes a process chamber comprising a first processing volume and a second processing volume; a first heating device configured to heat a substrate to a first temperature; a carrier configured to support the substrate while the substrate is being heated using the first heating device to the first temperature and transfer the substrate to and from each of the first processing volume and the second processing volume; a second heating device configured to maintain the substrate at or near the first temperature; and a chuck configured to receive the substrate from the carrier, and comprising an outer zone and an inner zone having independent variable pressure control to apply a chucking force at the outer zone that is different from a chucking force provided at the inner zone.

Abstract: An electrical connector includes a first conductive terminal, a second conductive terminal, an insulated body integrally molded on the first conductive terminal and the second conductive terminal, and a metallic shell on the insulated body. The insulated body includes a first tongue portion and a second tongue portion aligned side by side. The first conductive terminal is provided with a first contact portion. The second conductive terminal is provided with a second contact portion. The metallic shell includes a first cylinder portion provided with a first space and a second cylinder portion provided with a second space. The first cylinder portion surrounding the first tongue portion and the second cylinder portion surrounding the second tongue portion share a dividing portion for separating the first space from the second space, so that the two electrical connection ports of the electrical connector are independent and avoid mutual influence between the two electrical connection ports.

Abstract: Embodiments of methods and apparatus for reducing warpage of a substrate are provided herein. In some embodiments, a method for reducing warpage of a substrate includes heating the substrate with an epoxy layer to at least a glass transition temperature of the epoxy layer while allowing the substrate to expand; subsequently constraining the substrate with a clamping force exerted towards the substrate from a top direction by applying a high pressure gas to the substrate and from a bottom direction by applying a vacuum pressure to the substrate; and rapidly cooling the substrate while the substrate is constrained.

Abstract: Methods and apparatus for reducing warpage of a substrate. In some embodiments, a method of reducing substrate warpage comprises heating the substrate with an epoxy layer to at least a glass transition temperature of the epoxy layer while allowing the substrate to expand; maintaining the at least the glass transition temperature of the substrate until the substrate is constrained; constraining the substrate with a total clamping force of approximately 5000N to approximately 7000N exerted towards the substrate from a top direction and a bottom direction; applying at least one electrostatic field to the substrate with a first electrostatic chuck positioned above the substrate and a second electrostatic chuck positioned below the substrate; and rapidly cooling the substrate using a first liquid convection heat sink positioned above the substrate and a second liquid convection heat sink positioned below the substrate.

Abstract: An antenna array and a communications device are provided. The antenna array includes a feeding waveguide and a waveguide cover. A waveguide port is disposed on the feeding waveguide, and an array of radiation slots are arranged along the length of the waveguide cover. The slots are configured to transmit signals fed from the waveguide port, and are classified into a first subarray and a second subarray. At a center frequency of the antenna array, the difference between a beam angle of the first subarray and a required beam angle, and a difference between a beam angle of the second subarray and the required beam angle, is each less than a specified threshold. With a frequency change of the antenna array, the beam angle of the first subarray and the beam angle of the second subarray change in opposing directions. Therefore, when the first and second subarray beams are combined, the combined beam angle has reduced frequency dependence.

Abstract: A single-layer shock-absorbing sports helmet formed by steam, including a hard shell and an EPP layer. The hard shell is fitted and bonded with the EPP layer by glue, and the hard layer covers an outer surface of the EPP layer. The EPP layer is made of an EPP material which is waterproof and heat resisting and insulating, such that the wearing comfort of the helmet is effectively improved. The hard shell and the EPP layer are bonded by glue, so less materials are used, thus the weight and cost will be reduced without affecting the use of the helmet. In addition, the helmet also has excellent impact resistance.

Abstract: A connector includes first contacts, second contacts, a middle plate, a first electromagnetic compatibility (EMC) pad, a second EMC pad, an insulating body, and a spacer. The middle plate is clamped between the first contacts and the second contacts. The first EMC pad is located above the first contacts. The second EMC pad is located below the second contacts. The first EMC pad and the second EMC pad are connected to the middle plate respectively. The insulating body is partially embedded with the first contacts, the second contacts, the middle plate, the first EMC pad, and the second EMC pad. The spacer is formed between the first contacts and the second contacts, and is partially embedded with the first contacts and the second contacts. A manufacturing method where the connector is assembled as a semi-finished product in advance is further provided to reduce the production cost.

Abstract: A connector includes an insulated member, a plurality of first conductive terminals, a plurality of second conductive terminals, a shielding shell, and a metal housing. The first conductive terminals are disposed on an upper surface of the insulated member and extending rearward. The second conductive terminals are disposed on a lower surface of the insulated member, extending rearward, and located below the first conductive terminals. The shielding shell is fitted over the insulated member, and the shielding shell has a plug end and a mounting end. The metal housing has a plurality of grounding structures, the metal housing is fitted over the mounting end of the shielding shell, and the grounding structures are completely located below the second conductive terminals.

Abstract: The filter is provided, which includes a filter body and resonant cavities disposed on the filter body, and further includes an input port and an output port that are disposed on the filter body. At least one of the input port or the output port is connected to a set of additional resonant cavities, and each set of additional resonant cavities includes: a first additional resonant cavity in signal coupling to the input port or the output port, and a second additional resonant cavity in signal coupling to the first additional resonant cavity. In the filter, the two additional resonant cavities and another resonant cavity connected to the input port or the output port are in a form of a straight line, thereby implementing a flexible layout of cavities of the filter. In addition, a coupling structure is simple, costs are low, reliability and batch consistency is good.

Abstract: An on-chip multiple-stage electrical overstress (EOS) protection device is disclosed. The protection device includes a surge protector having a first clamping voltage and a first electrostatic discharge (ESD) protector having a second clamping voltage lower than the first clamping voltage. The surge protector is electrically connected to the first ESD protector in parallel. The surge protector and the first ESD protector are electrically connected between a receiving terminal and a voltage terminal, and the receiving terminal is electrically connected to an internal circuit. When an electrical overstress (EOS) signal including an electrostatic discharge (ESD) signal and a surge signal appears at the receiving terminal, the first ESD protector and the surge protector are triggered on in turn to clamp a voltage received by the internal circuit.

Abstract: Methods for bonding and de-bonding a thin substrate film to a carrier plate are provided herein. In some embodiments, a method of processing a semiconductor substrate includes applying a polymer layer that is non-adhesive to a carrier plate formed of a dielectric material. A second layer is then applied to the polymer layer. One or more redistribution layers are then formed on the second layer. The second layer is then separated from the carrier plate via at least one of magnetic induction heating, infrared exposure, or electrostatic repulsion.

Abstract: A device to sense degree of twist in a screwdriver and the magnitude of force applied includes a contacting portion, a deformation portion, a sensing portion, and a processor. The contacting portion receives a grip and twist pressure through the deformation portion which is tiltedly fixed to the contacting portion. The deformation portion carries the sensing portion and elastically deforms under the force and/or the torsion. The sensing portion detects a deformation of the deformation portion and generates a corresponding electrical signal. The processor receives the signal and determines the values of the twist caused and the force applied.

Abstract: A method and system for improving a data storage system is provided. The method includes extracting original data storage attributes from metadata comprised by data for storage within a hardware storage system. Additional data storage attributes associated with current storage requirements of the data are retrieved and merged with the original data storage attributes resulting in a group of combined data storage attributes. An attribute matrix categorizing attribute types each attribute is generated. A digital tag defining the attribute matrix is generated and attached to the metadata. Data storage tier definitions and associated tier attributes are received and associated with the digital tag. Resulting specified tiers of the hardware storage system a defined for storage of specified portions of the data and each portion of data is stored within an associated tier.

Abstract: Methods and apparatus for removing particles from a substrate surface after a chemical mechanical polish. In some embodiments, the apparatus may include a manifold configured to receive and atomize a fluid and at least one spray nozzle mounted to the manifold and configured to spray the atomized fluid in a divergent spray pattern such that the substrate surface is cleansed when impinged by spray from the at least one spray nozzle, wherein the at least one spray nozzle sprays the atomized fluid at a pressure of approximately 30 psi to approximately 2500 psi.