Abstract: An electrical connector includes a contact module essentially composed of a plurality of contacts integrally formed within an insulator via an insert-molding process. The insulator includes a base, tongue extending forwardly from the base, and a mounting port extending rearwardly from the base. The contact includes a front contacting section exposed upon the tongue, a rear soldering tail exposed outside of the base and a middle retaining section therebetween. A groove is formed between the base and the mounting port to expose middle sections of the contacts. An insulative housing is over molded upon the contact module for not only forming an exterior structure of the connector but also filling the groove for enhancing sealing between the contacts and the insulator.

Abstract: A method for quantifying fidelity of a haptic signal may include receiving a response signal indicative of a vibrational response of a vibrational transducer to a haptic playback waveform driven to the vibrational transducer, perceptually filtering the response signal to obtain human haptic-perceptible components of the response signal, and quantifying fidelity of the haptic playback waveform based on at least one quantitative characteristic of the human haptic-perceptible components of the response signal.

Abstract: The present invention provides a medical electrode comprising a conductive metal base comprising a plate element and a boss formed on the plate element and a conductive support cylinder separate from the conductive metal base. The conductive support cylinder is rotatably mounted to the conductive metal base while remaining in electrical communication with said conductive metal base. The present invention also provides a limb clamp for an ECG device. According to the present invention, it is possible to prevent bending of the cable connecting with the medical electrode, thereby avoiding cable failure.

Abstract: A method for compensating for a change in back electric motive force in a transducer in a device, wherein the transducer is driven by an output signal output by an amplifier, and a back volume of the transducer is formed by an enclosure within the device. The method comprises: receiving an input signal; determining, based on a characteristic of the transducer that the transducer has moved from an equilibrium position within the device; and based on the determination, adjusting a gain applied to the input signal by the amplifier to generate the output signal.

Abstract: An integrated haptic system may include a digital signal processor and an amplifier communicatively coupled to the digital signal processor and integrated with the digital signal processor into the integrated haptic system. The digital signal processor may be configured to receive a force sensor signal indicative of a force applied to a force sensor and generate a haptic playback signal responsive to the force. The amplifier may be configured to amplify the haptic playback signal and drive a vibrational actuator communicatively coupled to the amplifier with the haptic playback signal as amplified by the amplifier.

Abstract: An integrated haptic system may include a digital signal processor and an amplifier communicatively coupled to the digital signal processor and integrated with the digital signal processor into the integrated haptic system. The digital signal processor may be configured to receive a force sensor signal indicative of a force applied to a force sensor and generate a haptic playback signal responsive to the force. The amplifier may be configured to amplify the haptic playback signal and drive a vibrational actuator communicatively coupled to the amplifier with the haptic playback signal as amplified by the amplifier.

Abstract: Embodiments of compositions of a wet etchant and additive thereto for selectively etching silicon nitride to silicon oxide are disclosed. In an example, a composition of an additive to a phosphoric acid etchant includes an inhibitor and a dispersant. The inhibitor is absorbable on a surface of silicon oxide and capable of inhibiting etching of the surface of silicon oxide by the phosphoric acid etchant. The dispersant is capable of reacting with a by-product of a reaction between the phosphoric acid etchant and at least one of silicon oxide and silicon nitride and reducing a viscosity of the phosphoric acid etchant.

Abstract: An image depth decoder includes an NIR image buffer, a reference image ring buffer and a pattern matching engine. The NIR image buffer stores an NIR image inputted by a stream. The reference image ring buffer stores a reference image inputted by a stream. The pattern matching engine is coupled to the NIR image buffer and the reference image ring buffer, and performs a depth computation according to the NIR image and the reference image to output at least one depth value.

Abstract: An electrical connector includes: an insulative housing having a front tongue with two opposite surfaces; and a first and second rows of contacts with contacting portions exposed to the two opposite surfaces of the tongue; wherein the first row of contacts include a row of contacts from a first contact carrier of a first thickness and a row of contacts from a second contact carrier of a second thickness less than the first thickness; and the row of contacts from the first contact carrier and the row of contacts from the second contact carrier are molded to form the first row of contacts. A method of making a contact module of the electrical connector is characterized by molding the row of contacts from the first thicker contact carrier and the row of contacts from the second thinner contact carrier to form the first row of contacts.

Abstract: An electrical connector includes: a housing having a base, a front tongue, and a rear mount; an upper and lower rows of contacts arranged in the housing and exposed respectively to two opposite surfaces of the tongue; an insulative shell mounted to the base and including a pair of mounting lugs, each mounting lug having a hole; and a metallic shell shielding the rear mount, wherein the metallic shell has a pair of securing arms fastened to the pair of mounting lugs.

Abstract: An electrical connector includes: an insulative housing having a base and a tongue, the base having a front face for abutting a front end face of a mating connector; and plural contacts arranged in an upper and lower rows and exposed respectively to an upper and lower surfaces of the tongue, wherein the insulative housing is devoid of a step between the base and the tongue, and a length measured from a front end face of the tongue to the front face of the base is about 2.85 mm A complementary electrical connector is devoid of a grounding piece in front of plural contacts thereof, and a length measured from a front end face of a shell thereof to mating points of the contacts is about 1.

Abstract: The present invention discloses a method for controlling spectral properties of optical quantum states using quantum interference in cascaded waveguide structure comprises the following steps: adopting a multi-stage cascaded waveguide structure sequentially consisting of a segment of nonlinear medium, a segment of dispersive medium, . . . and a segment of nonlinear medium, or adopting a two-stage cascaded waveguide structure sequentially consisting of a segment of nonlinear medium, a segment of dispersion-controllable dispersive medium and a segment of nonlinear medium; pumping the multi-stage cascaded waveguide structure or two-stage cascaded waveguide structure by using pulsed laser to generate optical quantum states through the cascaded parametric process in the cascaded waveguide structure. The spectral property of the optical quantum state can be flexibly adjusted by changing the number of stages, the length and dispersion property of the dispersive media.

Abstract: A semiconductor package structure includes a first package, a second package over the first package, a plurality of connectors between the first package and the second package and a plurality of baffle structures between the first package and the second package. The second package includes a bonding region and a periphery region surrounding the bonding region. The connectors are disposed in the bonding region to provide electrical connections between the first package and the second package. The baffle structures are disposed in the periphery region and are separated from each other.

Abstract: A method for compensating for a change in back electric motive force in a transducer in a device, wherein the transducer is driven by an output signal output by an amplifier, and a back volume of the transducer is formed by an enclosure within the device. The method comprises: receiving an input signal; determining, based on a characteristic of the transducer that the transducer has moved from an equilibrium position within the device; and based on the determination, adjusting a gain applied to the input signal by the amplifier to generate the output signal.

Abstract: A method for compressing multiple original convolution parameters into a convolution operation chip includes steps of: determining a range of the original convolution parameters; setting an effective bit number for the range; setting a representative value, wherein the representative value is within the range; calculating differential values between the original convolution parameters and the representative value; quantifying the differential values to a minimum effective bit to obtain a plurality of compressed convolution parameters; and transmitting the effective bit number, the representative value and the compressed convolution parameters to the convolution operation chip.

Abstract: Embodiments described herein relate to methods and apparatus for driving a haptic transducer with a driving signal. The method comprises estimating, based on a current through the haptic transducer and a terminal voltage across the haptic transducer, a back electromotive force, EMF, voltage representative of a velocity of a mass in the haptic transducer; comparing a phase of a voltage signal derived from the terminal voltage with a phase of the estimated back EMF voltage; and based on the comparison, adjusting a frequency or a phase of an output signal, wherein the driving signal is derived from the output signal, such that a frequency of the driving signal converges to a resonant frequency of the haptic transducer.

Abstract: A method for compressing multiple original convolution parameters into a convolution operation chip includes steps of: determining a range of the original convolution parameters; setting an effective bit number for the range; setting a representative value, wherein the representative value is within the range; calculating differential values between the original convolution parameters and the representative value; quantifying the differential values to a minimum effective bit to obtain a plurality of compressed convolution parameters; and transmitting the effective bit number, the representative value and the compressed convolution parameters to the convolution operation chip.

Abstract: A convolution operation device includes a convolution operation module, a memory, a scale control module and a scaling unit. The convolution operation module outputs a plurality of convolution operation results containing fractional parts. The memory is coupled to the convolution operation module for receiving and storing the convolution operation results containing the fractional parts, and outputs a plurality of convolution operation input values containing fractional parts. The scale control module is coupled to the convolution operation module and generates a scaling signal according to a total scale of the convolution operation results containing the fractional parts.

Abstract: A method for quantifying fidelity of a haptic signal may include receiving a response signal indicative of a vibrational response of a vibrational transducer to a haptic playback waveform driven to the vibrational transducer, perceptually filtering the response signal to obtain human haptic-perceptible components of the response signal, and quantifying fidelity of the haptic playback waveform based on at least one quantitative characteristic of the human haptic-perceptible components of the response signal.

Abstract: A method for processing audio data for output to a transducer may include receiving an audio signal, filtering the audio signal with a fixed filter having fixed filter coefficients to generate a filtered audio signal, and outputting the filtered audio signal to the transducer. The fixed filter coefficients of the fixed filter may be tuned by using a psychoacoustic model of the transducer to determine audibility masking thresholds for a plurality of frequency sub-bands, allocating compensation coefficients to the plurality of frequency sub-bands, and fitting the fixed filter coefficients with the compensation coefficients allocated to the plurality of sub-bands.