Abstract: Materials for use in 3D printing comprising a color shift pigment that change colors when viewed at different angles. More specifically, the materials comprise a color shift pigment being a silicon oxide core with metal oxide shell disposed thereon and a polymeric component.

Abstract: A heating pump includes a pump body and a driving motor. The pump body includes a pump housing with a water inlet and a water outlet, a heating member fixed in an interior of the pump housing, and an impeller connected with the driving motor. The heating member includes fittings and a heating coiled pipe connected between the fittings and bent into an arc. The impeller is disposed at an upper part of the pump housing, one end of the driving motor is disposed adjacent the impeller, and the heating coiled pipe circles around a radial side portion of part of the driving motor. The heating pump has a rational design and high heat exchange efficiency. The safety auxiliary motor has a low requirement for power. The axial size of the water pump is significantly reduced.

Abstract: A flexible transparent material is provided. The flexible transparent material includes a thermoplastic and a plurality of micelles dispersed in the thermoplastic. Each micelle includes a plurality of cross-linked rubber particles and a swelling liquid. The weight ratio of the thermoplastic to the total weight of the cross-linked rubber particles is from 1:5 to 4:5. The weight ratio of the swelling liquid to the total weight of the cross-linked rubber particles is from 1:5 to 2:1.

Abstract: A selective laser sintering composition and a selective laser sintering 3D printing method employing the same are provided. The selective laser sintering composition includes a nanoscale inorganic powder and a thermoplastic vulcanizate powder. The temperature difference (?T) between the onset temperature for melting the thermoplastic vulcanizate powder and the onset temperature at which the thermoplastic crystallizes vulcanizate powder is greater than or equal to 10° C. The thermoplastic vulcanizate powder includes a thermoplastic and a crosslinked polymer. The temperature difference (?T) between the onset temperature for melting the thermoplastic and the onset temperature at which the thermoplastic crystallizes is greater than or equal to 10° C. , and the weight ratio of the thermoplastic to the crosslinked polymer is from 1:1 to 1:4.

Abstract: Embodiments of the present specification provide a target recognition method, apparatus, and system. The method comprises: obtaining an image recognition result and a radio frequency recognition result of target objects in a target region, and then determining the distribution of the target objects in the target region according to the radio frequency recognition result and the image recognition result. Since the radio frequency recognition result and the image recognition result are fused, the target objects in the target region can be accurately recognized, so as to improve the recognition accuracy.

Abstract: Disclosed are a method and apparatus for filtering images and an electronic device. The method includes: obtaining a first image, where the first image is an image frame in a video stream obtained by collecting images of a target area; obtaining a first detection result of a target object in the first image by detecting the first image; determining a state of a target object with to-be-determined state according to the first detection result of the target object in the first image and a second detection result of the target object with to-be-determined state; and determining a quality level of an image in a bounding box of the target object with to-be-determined state according to the state of the target object with to-be-determined state, where the bounding box of the target object with to-be-determined state is determined according to the first detection result of the target object with to-be-determined state.

Abstract: Embodiments of the present disclosure provide methods and apparatuses for obtaining sample images, and electronic devices. The method includes: acquiring images of stacked bodies, where the stacked bodies in different images have different item information, and the item information comprises: an attribute and a stacking mode of a stacked body; and taking an acquired image as a sample image when the acquired image meets an image quality condition.

Abstract: A pet water dispenser includes a water storage tank (1), a drinking tray (2), and a water pump (5), where an upper end of the water storage tank (1) is provided with an opening, the water storage tank (1) is further provided with a first supporting structure (101); the drinking tray (2) covers an opening of the water storage tank (1) and is supported by the first supporting structure (101), and the drinking tray (2) is provided with a water inlet (3) and a water outlet (4); the water pump (5) is arranged in the water storage tank (1), a water outlet joint of the water pump (5) is communicated with the water inlet (3) through a pipeline, so as to pump water in the water storage tank (1) to the drinking tray (2) through the water pump (5).

Abstract: A biodegradable polyester is provided. The biodegradable polyester is a transesterification or esterification reaction product of a reactant (a) and a reactant (b). The reactant (a) is a modified linear saccharide oligomer. The reactant (b) is a polyester, or the reactant (b) includes a dicarboxylic acid and a diol. The modified saccharide oligomer is a reaction product of a saccharide oligomer and a modifier.

Abstract: Implementations of a molded image sensor chip scale package may include an image sensor having a first side and a second side. A first cavity wall and a second cavity wall may be coupled to the first side of the image sensor and extend therefrom. The first cavity wall and the second cavity wall may form a cavity over the image sensor. A transparent layer may be coupled to the first cavity wall and the second cavity wall. A redistribution layer (RDL) may be coupled to the second side of the image sensor. At least one interconnect may be directly coupled to the RDL. A mold material may encapsulate a portion of the RDL, a portion of the image sensor, and a side of each cavity wall, and a portion of the transparent layer.

Abstract: Implementations of semiconductor packages may include: a semiconductor device included within a cavity within a glass block. The package may also include a substrate coupled with a first side of the semiconductor device and two or more edges of the glass block. A fill material may be included between the substrate and the second conductor device and an opaque material may be between a side surface of the semiconductor device and an inner surface of the cavity. The opaque material may be configured to block light from contacting the side surface of the semiconductor device.

Abstract: A method of manufacturing a semiconductor substrate structure for use in a semiconductor substrate stack system is presented. The method includes a semiconductor substrate which includes a front-face, a backside, a bulk layer, an interconnect layer that includes a plurality of inter-metal dielectric layers sandwiched between conductive layers, a contact layer that is between the bulk layer and the interconnect layer, and a TSV structure commencing between the bulk layer and the contact layer and terminating at the backside of the substrate. The TSV structure is electrically coupled to the interconnect layer and the TSV structure is electrically coupled to a bonding pad on the backside.

Abstract: According to an aspect, a sensor packaging structure includes a sensor die having a first surface and a second surface opposite the first surface, where the sensor die defines a sensor edge disposed between the first surface and the second surface. The sensor packaging structure includes a bonding material having a first surface and a second surface opposite the second surface, where the bonding material defines a bonding material edge disposed between the first surface of the bonding material and the second surface of the bonding material. The sensor packaging structure includes a transparent material, where the bonding material couples the sensor die to the transparent material. The sealing material is disposed on an interface between the sensor die and the bonding material, and at least one of a portion of the sensor edge or a portion of the bonding material edge.

Abstract: Implementations of a molded image sensor chip scale package may include an image sensor having a first side and a second side. A first cavity wall and a second cavity wall may be coupled to the first side of the image sensor and extend therefrom. The first cavity wall and the second cavity wall may form a cavity over the image sensor. A transparent layer may be coupled to the first cavity wall and the second cavity wall. A redistribution layer (RDL) may be coupled to the second side of the image sensor. At least one interconnect may be directly coupled to the RDL. A mold material may encapsulate a portion of the RDL, a portion of the image sensor, and a side of each cavity wall, and a portion of the transparent layer.

Abstract: Implementations of semiconductor packages may include: a semiconductor device included within a cavity within a glass block. The package may also include a substrate coupled with a first side of the semiconductor device and two or more edges of the glass block. A fill material may be included between the substrate and the second conductor device and an opaque material may be between a side surface of the semiconductor device and an inner surface of the cavity. The opaque material may be configured to block light from contacting the side surface of the semiconductor device.

Abstract: A fan device includes a driving device, a fan wheel, and a locking fastener. The driving device includes a shaft. The fan wheel defines a shaft hole to receive the shaft. The locking fastener has a thermal expansion coefficient same as a thermal expansion coefficient of the shaft.

Abstract: According to an aspect, a sensor packaging structure includes a sensor die having a first surface and a second surface opposite the first surface, where the sensor die defines a sensor edge disposed between the first surface and the second surface. The sensor packaging structure includes a bonding material having a first surface and a second surface opposite the second surface, where the bonding material defines a bonding material edge disposed between the first surface of the bonding material and the second surface of the bonding material. The sensor packaging structure includes a transparent material, where the bonding material couples the sensor die to the transparent material. The sealing material is disposed on an interface between the sensor die and the bonding material, and at least one of a portion of the sensor edge or a portion of the bonding material edge.

Abstract: The present disclosure relates to compounds of formula I which inhibit NaV1.7, and include pharmaceutically acceptable salts, compositions comprising such compounds, and methods using and making such compounds and compositions.

Abstract: The disclosure relates to compounds of formula I which are useful as kinase modulators including RIPK 1 modulation. The disclosure also provides methods of making and using the compounds for example in treatments related to necrosis or inflammation as well as other indications.