Patents by Inventor Jin Wu

Jin Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Acyl sulfonamide NaV1.7 inhibitors
    Patent number: 10836758
    Abstract: The present disclosure relates to compounds of formula I which inhibit NaV1.7, and include pharmaceutically acceptable salts, compositions comprising such compounds, and methods using and making such compounds and compositions.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: November 17, 2020
    Assignee: BRISTOL-MYERS SQUIBB COMPANY
    Inventors: Yong-Jin Wu, Jason M. Guernon
  • AMINOPYRROLOTRIAZINES AS KINASE INHIBITORS
    Publication number: 20200347071
    Abstract: The disclosure relates to compounds of formula I which are useful as kinase modulators including RIPK 1 modulation. The disclosure also provides methods of making and using the compounds for example in treatments related to necrosis or inflammation as well as other indications.
    Type: Application
    Filed: January 24, 2019
    Publication date: November 5, 2020
    Inventors: Scott Hunter Watterson, Murugaiah Andappan Murugaiah Subbaiah, Carolyn Diane Dzierba, Hua Gong, Jason M. Guernon, Junqing Guo, Amy C. Hart, Guanglin Luo, John E. Macor, William J. Pitts, Jianliang Shi, Brian Lee Venables, Carolyn A. Weigelt, Yong-Jin Wu, Zhizhen Barbara Zheng, Sing-Yuen Sit, Jie Chen
  • Wireless remote control orbiter based on 5G frequency band
    Patent number: 10814244
    Abstract: The present application describes a wireless remote orbiter based on a 5G frequency band. The orbiter may have a main rail which is fixedly mounted on bearing beam of stage and a rack which is mounted with translational drive means and lifting drive means. The main rail comprises a vertical rail and a horizontal rail which is formed integrally below the vertical rail, load-bearing wheels are fixedly mounted on the rack against the upper of the horizontal rail, translational friction wheel groups are connected to the translational drive means against the vertical rail, the lifting drive means are connected to a dual rope hoisting mechanism. A sliding contact line is laid with the rail on the main rail. A collector supplied power from sliding contact line conductor is mounted on the rack.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: October 27, 2020
    Assignee: ZHEJIANG DAFENG INDUSTRY CO., LTD.
    Inventors: Jin Wu, Xiaoyin Liu, Xiaojun Wang, Qifei An, Jianming Xu, Yinghai Song, Shuyong Zhang, Yanku Wang
  • Branched polymer, method for preparing the same and method for preparing a foam
    Patent number: 10815336
    Abstract: A branched polymer, a preparation method thereof and a method for preparing a foam are provided. The branched polymer is a transesterification product of a composition, and the composition includes 100 parts by weight of polyethylene terephthalate and 0.5-2.0 parts by weight of polyol. The branched polymer has an inherent viscosity of from 1.2 dL/g to 1.6 dL/g, a number average molecular weight of from 75,000 g/mol to 90,000 g/mol, a polydispersity index from 3.0 to 6.0, a melt index from 0.8 g/10 min to 7.5 g/10 min, a shear viscosity from 800 Pa·s to 1900 Pa·s, and a melt strength from 30 cN to 80 cN.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: October 27, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jin-An Wu, Wen-Chung Liang, Chin-Lang Wu, Shihn-Juh Liou
  • CONTROLLABLE GAP HEIGHT FOR AN IMAGE SENSOR PACKAGE
    Publication number: 20200321375
    Abstract: According to an aspect, an image sensor package includes a transparent member, a substrate, and an interposer disposed between and coupled to the transparent member and the substrate, where the interposer defines a first cavity area and a second cavity area. The image sensor package includes an image sensor die disposed within the first cavity area of the interposer, where the image sensor die has a sensor array configured to receive light through the transparent member and the second cavity area. The image sensor package includes a bonding material that couples the image sensor die to the interposer within the first cavity area.
    Type: Application
    Filed: July 9, 2019
    Publication date: October 8, 2020
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Weng-Jin WU
  • Scalable, distributed containerization across homogenous and heterogeneous data stores
    Patent number: 10789272
    Abstract: Provided are techniques for using containers to store objects. One data store from a set of data stores is assigned as a primary data store, wherein the remaining data stores comprise secondary data stores. A container for a group is created on the primary data store. A unique identifier for the container is generated on the primary data store. Metadata for the container is stored on the primary data store. Zero or more objects are stored in the container on the primary data store. For each of the secondary data stores that have objects belonging to the group, a container is created in that secondary data store having the unique identifier, wherein the container spans the primary data store and the secondary data stores, and wherein the objects in the container do not span the primary data store and the secondary data stores.
    Type: Grant
    Filed: June 6, 2011
    Date of Patent: September 29, 2020
    Assignee: International Business Machines Corporation
    Inventors: Aidon P. Jennery, Brett E. Morris, Sriram R. Rao, Jin Wu
  • Method, device and system for recording information, storage medium and processing unit
    Patent number: 10789982
    Abstract: The disclosure provides a method, device and system for recording information, a storage medium and a processing unit. The method for recording information includes that: non-Audio/Video (AV) information forming a preset association relationship with a first target file is acquired, wherein the first target file includes AV information; and the AV information and the non-AV information are synchronously recorded according to an information synchronization condition.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: September 29, 2020
    Assignee: LIUZHOU GUITONG TECHNOLOGY CO., LTD.
    Inventors: Jin Wu, Zhenghai Kang, Haitao Li
  • EMBEDDED IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
    Publication number: 20200295065
    Abstract: An embedded image sensor package including a transparent cover having a first side and an opposing second side. A first layer couples over the second side of the transparent cover and has an opening. An electrically conductive layer couples in or over the first layer and electrically couples with one or more electrical contacts exposed on an outer surface of the package. An image sensor chip having a first side with an image sensor and an opposing second side electrically couples with the electrically conductive layer at the first side of the image sensor chip. The image sensor chip couples over the first layer so the first side of the image sensor chip faces the second side of the transparent cover through the opening. The image sensor chip, first layer, and transparent cover at least partially define a cavity hermetically sealed using an underfill material. The package includes no wirebonds.
    Type: Application
    Filed: May 28, 2020
    Publication date: September 17, 2020
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Weng-Jin WU
  • Brush assembly, motor and liquid pump
    Patent number: 10777957
    Abstract: A brush assembly includes a brush holder, a brush, an elastic element, and a conductive terminal. The brush slidably is accommodated in the brush holder. The elastic element is resisted between the brush and the brush holder. And the conductive terminal is formed by bending from the brush holder.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: September 15, 2020
    Assignee: Johnson Electric International AG
    Inventors: Min Li, Jin Jin Wu, Kok Ang Chong
  • Thermoplastic vulcanizate and manufacturing method thereof
    Patent number: 10738180
    Abstract: A thermoplastic vulcanizate is provided, including 10-50 parts by weight of a nylon plastic and 50-90 parts by weight of a cross-linked acrylic rubber polymer. The cross-linked acrylic rubber polymer is dispersed in the Nylon plastic. The cross-linked acrylic rubber polymer is formed by a modified acrylic rubber polymer having a hydrolysable silane group through crosslinking in the presence of water. In the modified acrylic rubber polymer having a hydrolysable silane group, a linkage group represented by formula (I) or formula (II) is between a backbone and the hydrolysable silane group: wherein R1 is H or —OH; R2 is H, —Z?—Si(OR?)3 or C1-C10 hydrocarbon group; R3 is H or C1-C10 hydrocarbon group; Z? is a divalent bridging group; R? is individually C1-C10 hydrocarbon group. A manufacturing method of the thermoplastic vulcanizate is also provided.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: August 11, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jin-an Wu, Bing-Jyun Zeng, Po-I Wang, Fu-Ming Chien, Fan-Jie Lin, Sheng-Lung Chang
  • Method and system for synchronously reproducing multimedia multi-information
    Patent number: 10721517
    Abstract: Disclosed is a method and system for synchronously reproducing multi-media multi-information. The method is a method of combining a plurality of relevant files or a plurality of information streams that have an associated information relationship using a “multi-information modulation unit”, and then synchronously reproducing the relevant files or the information streams using a dedicated player capable of synchronously reproducing and playing back the multi-information.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: July 21, 2020
    Assignee: LIUZHOU GUITONG TECHNOLOGY CO., LTD.
    Inventors: Jin Wu, Zhenghai Kang, Haitao Li, Changzhu Yang, Juanmei Qin, Liangbo Tan, Anhuo Xiao, Baokun Wu
  • Embedded image sensor semiconductor packages and related methods
    Patent number: 10707250
    Abstract: An embedded image sensor package including a transparent cover having a first side and an opposing second side. A first layer couples over the second side of the transparent cover and has an opening. An electrically conductive layer couples in or over the first layer and electrically couples with one or more electrical contacts exposed on an outer surface of the package. An image sensor chip having a first side with an image sensor and an opposing second side electrically couples with the electrically conductive layer at the first side of the image sensor chip. The image sensor chip couples over the first layer so the first side of the image sensor chip faces the second side of the transparent cover through the opening. The image sensor chip, first layer, and transparent cover at least partially define a cavity hermetically sealed using an underfill material. The package includes no wirebonds.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: July 7, 2020
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Weng-Jin Wu
  • Surface layer for electronic device
    Patent number: 10703921
    Abstract: An electronic device includes a substrate and one or more electronic components positioned on the substrate. A surface layer is positioned on the electronic components, the surface layer comprising a polymer binder and a substituted or unsubstituted hexahydrotriazine compound.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: July 7, 2020
    Assignee: XEROX CORPORATION
    Inventor: Jin Wu
  • CIRCUIT APPLIED TO MULTIPLE SCAN MODES FOR TESTING
    Publication number: 20200182933
    Abstract: A circuit applied to multiple scan modes is disclosed, wherein the circuit can increase fault coverage during chip testing without using scan chain wrappers. The circuit includes a first circuit block and a second circuit block. The first circuit block corresponds to a first scan mode of the multiple scan modes, and the first circuit block includes at least one first scan chain for receiving a test signal from an external automatic test equipment. The second circuit block corresponds to a second scan mode of the multiple scan modes, and the second circuit block includes at least one second scan chain for receiving another test signal from the external automatic test equipment. The second scan chain includes at least one specific flip-flop positioned in the first circuit block, and the specific flip-flop is configured to drive the second circuit block.
    Type: Application
    Filed: December 1, 2019
    Publication date: June 11, 2020
    Inventors: Tzung-Jin Wu, Jeong-Fa Sheu, Po-Lin Chen, Yin-Ping Chern, Ying-Yen Chen
  • THERMOPLASTIC VULCANIZATE AND MANUFACTURING METHOD THEREOF
    Publication number: 20200181371
    Abstract: A thermoplastic vulcanizate is provided, including 10-50 parts by weight of a nylon plastic and 50-90 parts by weight of a cross-linked acrylic rubber polymer. The cross-linked acrylic rubber polymer is dispersed in the Nylon plastic. The cross-linked acrylic rubber polymer is formed by a modified acrylic rubber polymer having a hydrolysable silane group through crosslinking in the presence of water. In the modified acrylic rubber polymer having a hydrolysable silane group, a linkage group represented by formula (I) or formula (II) is between a backbone and the hydrolysable silane group: wherein R1 is H or —OH; R2 is H, —Z?—Si(OR?)3 or C1-C10 hydrocarbon group; R3 is H or C1-C10 hydrocarbon group; Z? is a divalent bridging group; R? is individually C1-C10 hydrocarbon group. A manufacturing method of the thermoplastic vulcanizate is also provided.
    Type: Application
    Filed: December 28, 2018
    Publication date: June 11, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jin-an WU, Bing-Jyun ZENG, Po-I WANG, Fu-Ming CHIEN, Fan-Jie LIN, Sheng-Lung CHANG
  • Image Sensor Flip Chip Package
    Publication number: 20200152681
    Abstract: Implementations of semiconductor packages may include: a semiconductor device included within a cavity within a glass block. The package may also include a substrate coupled with a first side of the semiconductor device and two or more edges of the glass block. A fill material may be included between the substrate and the second conductor device and an opaque material may be between a side surface of the semiconductor device and an inner surface of the cavity. The opaque material may be configured to block light from contacting the side surface of the semiconductor device.
    Type: Application
    Filed: November 8, 2018
    Publication date: May 14, 2020
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Weng-Jin WU
  • Tethered metal dioxide for imaging members
    Patent number: 10649353
    Abstract: Described herein is a photoreceptor and a method of making metal oxide particles having hygroscopic polymers attached to a surface of the metal oxide particles. The photoreceptor includes a conductive substrate and an undercoat layer disposed on the conductive substrate. The undercoat layer includes metal oxide particles having hygroscopic polymers attached to a surface of the metal oxide particles. The undercoat layer includes a binder resin. A photosensitive layer is disposed on the undercoat layer.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: May 12, 2020
    Assignee: Xerox Corporation
    Inventor: Jin Wu
  • System, Structure, and Method of Manufacturing a Semiconductor Substrate Stack
    Publication number: 20200126953
    Abstract: A method of manufacturing a semiconductor substrate structure for use in a semiconductor substrate stack system is presented. The method includes a semiconductor substrate which includes a front-face, a backside, a bulk layer, an interconnect layer that includes a plurality of inter-metal dielectric layers sandwiched between conductive layers, a contact layer that is between the bulk layer and the interconnect layer, and a TSV structure commencing between the bulk layer and the contact layer and terminating at the backside of the substrate. The TSV structure is electrically coupled to the interconnect layer and the TSV structure is electrically coupled to a bonding pad on the backside.
    Type: Application
    Filed: December 19, 2019
    Publication date: April 23, 2020
    Inventors: Hung-Pin Chang, Weng-Jin Wu, Wen-Chih Chiou, Chen-Hua Yu
  • Camera focusing method, apparatus, and device for terminal
    Patent number: 10630884
    Abstract: A camera focusing method, apparatus, and device for a terminal, and relate to the field of electronic device technologies to improve focusing precision of a terminal in a camera focusing process. The method includes obtaining a first confidence and a second confidence, determining a target ranging manner and a target object distance when the first confidence and the second confidence meet a preset condition, and determining a target position in a lens position interval to help a first camera and a second camera complete focusing.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: April 21, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Cheng Du, Wei Luo, Xin Guo, Huaiyang Rong, Jin Wu
  • Display screen or portion thereof with graphical user interface for a radiation treatment
    Patent number: D900838
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: November 3, 2020
    Assignee: Zap Surgical Systems, Inc.
    Inventors: Radhika Mohan Bodduluri, Bernadette Seijo, John R. Adler, Jr., Ben Chen, Hongwu Wang, Jin-Wu Wang, Dezhi Liu, Cheng-Chieh Tsai, Yun-Yi Ting, Yan-Ling Liu, Ya-Shan Lin