Abstract: Provided herein is a method and system for the security of the file input and output of application programs. At a security process running step, an application program and an security process are executed independent of a main process of the application program. The security process is connected to a filter driver to control the filter driver. At an event generation step, the filter driver checks an event being processed by the application program, stops the processing of the event, and transfers event information regarding the event to the security process. At a control policy checking step, the security process compares the event information with a corresponding security control policy, and transfers the determination of the comparison to the filter driver. At an execution step, the filter driver continues the following processing of the corresponding event in conformity with the determination of the security process.

Abstract: In accordance with an embodiment of the invention, a superjunction semiconductor device includes an active region and a termination region surrounding the active region. A central vertical axis of a boundary column of a second conductivity type material defines the boundary between the active region and the termination region. The active and termination regions include columns of first and second conductivity type material alternately arranged along a horizontal direction in a semiconductor region having top and bottom surfaces. At least one of the columns of the first conductivity type material in the termination region has a different width than a width of the columns of the first conductivity type material in the active region.

Abstract: In accordance with an embodiment of the invention, a superjunction semiconductor device includes an active region and a termination region surrounding the active region. A central vertical axis of a boundary column of a second conductivity type material defines the boundary between the active region and the termination region. The active and termination regions include columns of first and second conductivity type material alternately arranged along a horizontal direction in a semiconductor region having top and bottom surfaces. At least one of the columns of the first conductivity type material in the termination region has a different width than a width of the columns of the first conductivity type material in the active region.

Abstract: A memory card is structured to support a variety of applications by dividing a storage region into a plurality of sub storage regions, each sub storage region being assigned a particular data format associated with each of a plurality of application programs stored in a controller of the memory card. The data stored in each of the sub storage regions co-exists compatibly in the memory card. This allows for a multiplicity of applications, which can be made available through the use of a single memory card.

Abstract: In accordance with an embodiment of the invention, a superjunction semiconductor device includes an active region and a termination region surrounding the active region. A central vertical axis of a boundary column of a second conductivity type material defines the boundary between the active region and the termination region. The active and termination regions include columns of first and second conductivity type material alternately arranged along a horizontal direction in a semiconductor region having top and bottom surfaces. At least one of the columns of the first conductivity type material in the termination region has a different width than a width of the columns of the first conductivity type material in the active region.

Abstract: A lubricating device of a reciprocating compressor includes a pumping unit for pumping lubrication oil contained in a lower portion of a case and a front frame having a supply hole which supplies the lubrication oil pumped from the pumping unit to a sliding part within the case and a discharge hole which discharges the lubrication oil upon completion of a lubrication operation. A lubrication oil storage is arranged at a front of the discharge hole for storing the lubrication oil discharged to the discharge hole for a predetermined time and then discharging the lubrication oil. A lubrication oil guide is provided for guiding the lubrication oil discharged from the discharge hole to a lower portion of the case in order to prevent the lubrication oil discharged through the discharge hole from flowing to an air hole formed at a front frame.

Abstract: A superjunction semiconductor device includes an edge p pillar, an active region, and a termination region. The edge p pillar has a rectangular ring shape with rounded corners surrounding the active region. The active region includes an active n region and active p pillars having vertical stripe shapes disposed at regular intervals in the active n region. The top and bottom ends of the active p pillars are separated from the edge p pillar. The termination region includes termination n pillars and termination p pillars alternately arranged around the edge p pillar. Surplus p charges that are not used to balance the quantity of p charges and the quantity of n charges among p charges included in the upper and lower parts of the edge p pillar are eliminated or n charges are supplemented to balance the quantity of p charges and the quantity of n charges.

Abstract: In accordance with an embodiment of the invention, a superjunction semiconductor device includes an active region and a termination region surrounding the active region. A central vertical axis of a boundary column of a second conductivity type material defines the boundary between the active region and the termination region. The active and termination regions include columns of first and second conductivity type material alternately arranged along a horizontal direction in a semiconductor region having top and bottom surfaces. At least one of the columns of the first conductivity type material in the termination region has a different width than a width of the columns of the first conductivity type material in the active region.

Abstract: A lubricating device of a reciprocating compressor includes a pumping unit for pumping lubrication oil contained in a lower portion of a case and a front frame having a supply hole which supplies the lubrication oil pumped from the pumping unit to a sliding part within the case and a discharge hole which discharges the lubrication oil upon completion of a lubrication operation. A lubrication oil storage is arranged at a front of the discharge hole for storing the lubrication oil discharged to the discharge hole for a predetermined time and then discharging the lubrication oil. A lubrication oil guide is provided for guiding the lubrication oil discharged from the discharge hole to a lower portion of the case in order to prevent the lubrication oil discharged through the discharge hole from flowing to an air hole formed at a front frame.

Abstract: In a cooling system for an integrated circuit chip, by including an evaporator contacted-combined with an integrated circuit chip installed onto a board and absorbing heat generated at the integrated circuit chip; a compressor connected to the evaporator by a first connection pipe; a condenser connected to the compressor by a second connection pipe; an expansion means connected to the condenser by a third connection pipe and simultaneously connected to the evaporator by a fourth connection pipe; and a mounting board installed onto the board by a board combining means and mounted with the compressor, the condenser and the expansion means, it is possible to perform the operation of the integrated circuit chip smoothly, and accordingly a reliability of a product can be improved. In addition, although an integrated circuit chip is getting even more integrated, cooling of the integrated circuit chip can be efficiently performed.

Abstract: In a cooling system for an integrated circuit chip, by including an evaporator contacted-combined with an integrated circuit chip installed onto a board and absorbing heat generated at the integrated circuit chip; a compressor connected to the evaporator by a first connection pipe; a condenser connected to the compressor by a second connection pipe; an expansion means connected to the condenser by a third connection pipe and simultaneously connected to the evaporator by a fourth connection pipe; and a mounting board installed onto the board by a board combining means and mounted with the compressor, the condenser and the expansion means, it is possible to perform the operation of the integrated circuit chip smoothly, and accordingly a reliability of a product can be improved. In addition, although an integrated circuit chip is getting even more integrated, cooling of the integrated circuit chip can be efficiently performed.