Abstract: The invention provides a deposition equipment with a shielding mechanism, which includes a reaction chamber, a carrier, a cover ring and a shielding mechanism. The shielding mechanism includes a first bearing arm, a second bearing arm, a first shielding plate and a second shielding plate. The first and second shielding plates are respectively placed on the first and second bearing arms. There are corresponding alignment units between the lower surface of the first and second shielding plates and the upper surface the carrier, so that the first and second shielding plates can be aligned with the carrier. There is also a corresponding alignment unit between the upper surface of the first and second shielding plates and the lower surface the cover ring, so that the cover ring can be aligned with the first and second shielding plates to define a cleaning space in the reaction chamber.

Abstract: The present invention is a wafer carrier with adjustable aligning devices, which is suitable for a deposition machine. The wafer carrier comprises a tray and a plurality of adjustable aligning devices. The adjustable alignment devices are located around the tray, and include a base and an alignment pin. The adjustable alignment devices are configured to align a clamp ring of the deposition machine. The alignment pin is connected to the tray through the base, wherein the alignment pins and the bases are able to move relative to the tray to adjust the position of the alignment pins. Further, an alignment fixture can be placed on the wafer carrier to position the adjustable alignment devices around the tray, and adjust the alignment pins to preset positions, which is beneficial to improve the accuracy of alignment of the clamp ring.

Abstract: A method includes dispensing sacrificial region over a carrier, and forming a metal post over the carrier. The metal post overlaps at least a portion of the sacrificial region. The method further includes encapsulating the metal post and the sacrificial region in an encapsulating material, demounting the metal post, the sacrificial region, and the encapsulating material from the carrier, and removing at least a portion of the sacrificial region to form a recess extending from a surface level of the encapsulating material into the encapsulating material.

Abstract: The present disclosure provides a thin-film-deposition equipment with shielding device, which includes a reaction chamber, a carrier and a shielding device. The shielding device includes a first-shield member, a second-shield member and a driver. The first-shield member has a first-inner-edge surface disposed with a protrusion. The second-shield member has a second-inner-edge surface disposed with a cavity. The driver interconnects and drives the first-shield member and the second-shield member to sway in opposite directions. During a cleaning process, the driver swings the shield members toward each other into a shielding state for covering the carrier, such that to prevent polluting the carrier during the process of cleaning the thin-film-deposition equipment.

Abstract: An atomic-layer-deposition equipment, includes a reaction chamber, a carrier, a coverage mechanism and a dispensing unit. The carrier and the dispensing unit are disposed within a containing space of the reaction chamber. The coverage mechanism includes a connecting shaft and a cover plate, wherein the cover plate is disposed within the containing space and faces the carrier, the connecting shaft is connected to the cover plate and extends through the reaction chamber. The carrier is configured to carry a substrate assembly and move the substrate assembly with respect to the coverage mechanism, so as to allow the cover plate contacting a top surface of the substrate assembly. When the cover plate contacts the top surface of the substrate assembly, the dispensing unit surrounds the substrate assembly and dispenses a precursor to a lateral surface of the substrate assembly, so as to form a protective layer thereon.

Abstract: The invention provides a vibrating deposition device, which includes a vacuum chamber, a fixed rod and a powder tank. The vacuum chamber includes an inner side surface, and a plurality of bulges and notches are arranged on the inner side surface. The fixed rod and the powder tank are arranged in an accommodating space of the vacuum chamber, wherein the powder tank is used for accommodating powders and contacts the inner side surface of the vacuum chamber through a protruding unit. When the vacuum chamber rotates, the protruding unit will be displaced between the bulge and the notch, and the powder tank will be displaced up and down relative to the vacuum chamber to vibrate powders in the powder tank, so that a uniform film will be formed on the surface of powders.

Abstract: A bonding machine with movable suction modules includes a first cavity, a second cavity, a pressing unit, a carrier, and a plurality of movable suction modules. The first cavity is configured to be connected to the second cavity to form a closed space therebetween. The pressing unit is arranged in the first cavity, and the carrier is arranged in the second cavity. The pressing unit faces the carrier and is configured to bond a substrate placed on the carrier. The movable suction modules are arranged in a plurality of setting grooves on a bearing surface of the carrier for absorbing and flattening the substrate placed on the bearing surface. The movable suction modules is displaceable along the bearing surface and continuously absorb and flatten a substrate in a process of aligning the substrate, to help improve accuracy of substrate alignment.

Abstract: A recognition method includes the following steps. A text is analyzed by a language recognition network to generate an entity feature, a relation feature and an overall feature. An input image is analyzed by an object detection network to generate candidate regions. Node features, aggregated edge features and compound features are generated by an enhanced cross-modal graph attention network according to the entity feature, the relation feature, the candidate regions and the overall feature. The entity feature and the relation feature are matched to the node features and the aggregated edge features to generate the first scores. The overall feature is matched to the compound features to generate second scores. Final scores corresponding to the candidate regions are generated according to the first scores and the second scores.

Abstract: A package structure includes a first semiconductor package and a second semiconductor package over the first semiconductor package. The first semiconductor package includes a dielectric structure, a semiconductor device on the dielectric structure, under bump metallization (UBM) structures in the dielectric structure. The USB structures each include a first region and a second region surrounded by the first region. The first region has more metal layers than the second region. The bumps are respectively on the second regions of the UBM structures.

Abstract: An alignment mechanism of a bonding machine includes a support pedestal, three first alignment members, and three second alignment members. The support pedestal includes a supporting surface having a placement area for supporting a first substrate, and the first and second alignment members are arranged around the placement area. The first alignment members each include a protruding part and a base. The protruding part is used in supporting a second substrate, and protrudes from the base and directed to the placement area. The base is used to position the first substrate. The second alignment members position the second substrate to align the first and second substrates and facilitate the bonding of the first and second substrates.

Abstract: The invention is generally related to an insert for being embedded in a silicone hydrogel contact lens. The insert is made of a crosslinked materials which are rigid in dry state at room temperature (from about 22° C. to about 26° C.), have a high oxygen permeability and a high refractive index in fully hydrated state, and can become softer at a temperature great than 32° C. Such materials are useful for making inserts in embedded contact lenses for correcting corneal astigmatism, presbyopia, and color blindness lenses and for imparting photochromic characteristics to the lenses. The invention is also related to a method for making embedded silicone hydrogel contact lenses comprising an insert of the invention therein and to embedded silicone hydrogel contact lenses comprising an insert of the invention therein.

Abstract: The disclosure is a bonding machine for warped substrates, which includes a first chamber, a second chamber, a pressing unit, a carrier and a plurality of flattening devices. The first chamber is configured to connect with the second chamber to define an enclosed space therebetween. The pressing unit is connected to the first chamber, and the carrier is connected to the second chamber. The pressing unit faces the carrier and is configured to bond the substrates placed on the carrier. The flattening devices are arranged on the carrier, and include a plurality of flattening units and a plurality of telescopic rotary motors. The flattening units are located around the substrate. The telescopic rotation motor is connected to and drives the flattening unit to rotate, move up and down to flatten the substrate placed on the carrier to improve the accuracy of aligning the substrate.

Abstract: A semiconductor device has a conductive via laterally separated from the semiconductor, an encapsulant between the semiconductor device and the conductive via, and a mark. The mark is formed from characters that are either cross-free characters or else have a overlap count of less than two. In another embodiment the mark is formed using a wobble scan methodology. By forming marks as described, defects from the marking process may be reduced or eliminated.

Abstract: Some embodiments of the present disclosure provide a semiconductor device. The semiconductor device includes: a bottom package; wherein an area of a contact surface between the conductor and the through via substantially equals a cross-sectional area of the through via, and the bottom package includes: a molding compound; a through via penetrating through the molding compound; a die molded in the molding compound; and a conductor on the through via. An associated method of manufacturing the semiconductor device is also disclosed.

Abstract: Some embodiment structures and methods are described. A structure includes an integrated circuit die at least laterally encapsulated by an encapsulant, and a redistribution structure on the integrated circuit die and encapsulant. The redistribution structure is electrically coupled to the integrated circuit die. The redistribution structure includes a first dielectric layer on at least the encapsulant, a metallization pattern on the first dielectric layer, a metal oxide layered structure on the metallization pattern, and a second dielectric layer on the first dielectric layer and the metallization pattern. The metal oxide layered structure includes a metal oxide layer having a ratio of metal atoms to oxygen atoms that is substantially 1:1, and a thickness of the metal oxide layered structure is at least 50 ?. The second dielectric layer is a photo-sensitive material. The metal oxide layered structure is disposed between the metallization pattern and the second dielectric layer.

Abstract: A device includes an interposer, which includes a substrate having a top surface. An interconnect structure is formed over the top surface of the substrate, wherein the interconnect structure includes at least one dielectric layer, and metal features in the at least one dielectric layer. A plurality of through-substrate vias (TSVs) is in the substrate and electrically coupled to the interconnect structure. A first die is over and bonded onto the interposer. A second die is bonded onto the interposer, wherein the second die is under the interconnect structure.

Abstract: A chip package structure is provided. The chip package structure includes a chip structure. The chip package structure includes a first ground bump below the chip structure. The chip package structure includes a conductive shielding film disposed over the chip structure and extending onto the first ground bump. The conductive shielding film has a curved bottom surface.

Abstract: Disclosed herein is an electrochemical biosensor comprising at least one working electrode on an electrically insulative substrate. At least one working electrode incorporates an electrocatalytic film, comprising a molecularly imprinted polymer (MIP) layer. In at least one embodiment, MIP layer comprises a plurality of shape-selective cavities and a plurality of non-biological electrocatalytic centers.

Abstract: A die includes a semiconductor substrate, a through-via penetrating through the semiconductor substrate, a seal ring overlying and connected to the through-via, and an electrical connector underlying the semiconductor substrate and electrically coupled to the seal ring through the through-via.

Abstract: Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers. An apparatus includes a stage configured to receive one of a device wafer or a carrier wafer having a device wafer mounted thereto thereon, a laser tool located above the stage and oriented to direct a laser beam downwardly toward the stage, and a vertically movable blade rotatable about a horizontal axis along a radius from a vertical axis at a center of the device wafer and positionable proximate to and radially inward of an outer periphery of the device wafer.