Abstract: A thin-film-deposition machine includes a chamber, a carrier, an extraction ring and a dispensing unit. The chamber includes a containing space and an extraction channel disposed around the containing space. The extraction channel is partitioned into a first, a second and a third channel areas. The carrier is disposed within the containing space. The first channel area is connected to the third channel area via the second channel area. The third channel area is formed with a height greater than that of the first channel area. The extraction ring includes a plurality of extraction holes and a ring channel. The extraction holes are disposed around the carrier for extracting gas from the containing space to the extraction channel, sequentially via the extraction holes, the ring channel. Thereby an even and steady flow field can be formed above the carrier and the thickness uniformity of film deposition can be improved.

Abstract: Disclosed is a method for preparing iron phosphate and by-product fertilizer using ammonium phosphate. The granulation device for by-product fertilizer production comprises a housing having accommodation space which is divided from top to bottom into a granulation chamber, a material-screening chamber and a temporary material-storing chamber; a blowing component provided between the granulation chamber and the material-screening chamber; and a vibrating screen which is able to vertically reciprocated provided between the material-screening chamber and the temporary material-storing chamber which is connected to a discharge pipe, wherein the upper end of the housing is provided with a detachable cover having multiple spraying devices for spraying the molten material into the housing and connected to an exhaust pipe.

Abstract: A method for forming an underfill structure and semiconductor packages including the underfill structure are disclosed. In an embodiment, the semiconductor package may include a package including an integrated circuit die; an interposer bonded to the integrated circuit die by a plurality of die connectors; and an encapsulant surrounding the integrated circuit die. The semiconductor package may further include a package substrate bonded to the interposer by a plurality of conductive connectors; a first underfill between the package and the package substrate, the first underfill having a first coefficient of thermal expansion (CTE); and a second underfill surrounding the first underfill, the second underfill having a second CTE less than the first CTE.

Abstract: Described herein is a method for producing a contact lens comprising a central photochromic zone that has a diameter of about 13 mm or less and is concentric with the central axis of the contact lens. The method comprises: applying, in the center of the molding surface of a male mold half, a drop (having a volume of about 5 ?L or less) of a first polymerizable fluid composition containing at least one photochromic compound and a relatively-high molecular weight polysiloxane vinylic crosslinker for increasing the viscosity and adhesion on the molding surface of the male mold half; dosing a second polymerizable fluid composition in a female mold hald; closing the female mold hald with the male mold half with the drop thereon to form a molding assembly; and curing the second polymerizable fluid composition and the drop of the first polymerizable fluid composition in the molding assembly.

Abstract: Techniques are described by which a network management system (NMS) is configured to provide identification of root cause failure through the detection of network scope failures. For example, the NMS comprises one or more processors; and a memory comprising instructions that when executed by the one or more processors cause the one or more processors to: generate a hierarchical attribution graph comprising attributes representing different network scopes at different hierarchical levels; receive network event data, wherein the network event data is indicative of operational behavior of the network, including one or more of successful events or one or more failure events associated with one or more client devices; and apply a machine learning model to the network event data and to a particular network scope in the hierarchical attribution graph to detect whether the particular network scope has failure.

Abstract: A bonding machine with horizontal correction function includes a first chamber, a second chamber, a pressing unit, a carrier, a plurality of level adjustment units, and a plurality of distance measuring units. The first chamber is configured to be connected to the second chamber to define an enclosed space therebetween. The pressing unit is disposed within the first chamber, and the carrier is disposed within the second chamber. The pressing unit faces the carrier and is configured to press the substrates placed on the carrier. The leveling units are disposed on the first chamber, and the distance measuring units are disposed on the second chamber. Each distance measuring unit is configured to project a detecting beam onto the pressing unit, to measure the level of the pressing unit so as to adjust the level of the pressing unit through the level adjustment unit.

Abstract: A method for producing embedded hydrogel contact lenses comprises at least the following steps: obtaining an insert made of a crosslinked polymeric material comprising repeating units of a free-radical photoinitiator; placing the insert in a female lens mold half; dosing an amount of a lens-forming composition to immerse the insert in the female lens mold half; closing tightly a male lens mold half onto the top of the female lens mold half halves to form a molding assembly; actinically curing both the lens-forming composition in the molding assembly to form an embedded hydrogel lens precursor which comprises a bulk hydrogel material formed the lens-forming composition and the insert that is embedded therein and covalently linked to the bulk hydrogel material.

Abstract: A method for a self-adaptive service function chain mapping based on a deep reinforcement learning, comprising: establishing an SFC mapping model, dividing an SFC mapping process into a three-layer structure, and representing the structure with abstract parameters; building an SFCR mapping learning neural network, and mapping the abstract parameters to a state, an action and a reward value in the SFCR mapping learning neural network; establishing an empirical playback pool and updating network parameters; summarizing request rates and utilization rates of different VNFs, a number of currently deployed VNFs and a number of unactivated VNFs based on data in the empirical playback pool; and designing a VNF redeployment strategy, and redeploying the VNFs according to the summarized data. The method has good self-adaptability, and can improve the effective service cost rate and the request mapping rate for processing service requests from users in different time periods.

Abstract: A method for preparing a multifunctional hydrogel by yeast fermentation is provided. According to the present disclosure, graphene oxide is reduced by polydopamine to obtain a reduced graphene oxide solution first, and then a certain concentration of a gelatin-PCA-glucose mixed solution and an activated yeast liquid are prepared. The three solutions are uniformly mixed and stirred by a one pot reaction method, poured into a mold, and subjected to fermentation in a 30° C. water bath for a certain period of time, so as to obtain a Gel-PrGO-PCA-yeast multifunctional hydrogel material. The method is simple, convenient, rapid, and efficient. The obtained hydrogel has good air permeability, superior mechanical properties, electrical conductivity, and biocompatibility, and can be applied to different skin locations to achieve electrocardiograph and electromyographic detection.

Abstract: A method for a deposition apparatus is disclosed. The deposition apparatus includes a chamber, a substrate carrier, a blocker and a cover ring. The cover ring is disposed on the blocker. The substrate carrier carries a wafer and moves with respect to the blocker. A position where the substrate carrier contacts the cover ring start is defined as a contact position, and a first position below the contact position and a second position above the contact position are also defined. When the reaching the first position, a movement speed of the substrate carrier is decreased, and the substrate carrier carries the cover ring to move away from the blocker. When reaching the second position, the movement speed of the substrate carrier away from the blocker is increased. Collision between the wafer and the deposition apparatus is eliminated to prevent undesired particles from occurring and the wafer from being damaged.

Abstract: A method includes forming an under bump metallization (UBM) layer over a dielectric layer, forming a redistribution structure over the UBM layer, disposing a semiconductor device over the redistribution structure, removing a portion of the dielectric layer to form an opening to expose the UBM layer, and forming a conductive bump in the opening such that the conductive bump is coupled to the UBM layer.

Abstract: A method for intelligent traffic scheduling based on deep reinforcement learning, comprising: collecting flows in a data center network topology in real time, and dividing the flows into elephant flow or mice flow according to different types of flow features; establishing traffic scheduling models with energy saving and performance of the elephant flow and the mice flow as targets for joint optimization; establishing a DDPG intelligent routing traffic scheduling framework based on CNN improvement, and performing environment interaction; jointly inputting the three state messages as a state set into the CNN for training; setting an action as a comprehensive weight of energy saving and performance of each path under the condition of uniform transmission of flows in time and space, and selecting transmission paths for the elephant flow or the mice flow according to the weight; and designing reward value functions for the elephant flow and the mice flow.

Abstract: A parallelism-adjustable bonding machine includes a first chamber, a second chamber, a press-bonding unit, a carrier and plural parallelism-adjusting units. The first chamber is configured to connect to the second chamber, so as to define a closed space therebetween. The press-bonding unit is disposed within the first chamber, and the carrier is disposed within the second chamber. The press-bonding unit is disposed to face the carrier configured to press and bond substrates placed on the carrier. Each of the parallelism-adjusting units is disposed on the first chamber, and includes an adjustment shaft extending through the first chamber and connected to the press-bonding unit. The adjustment shaft includes an adjustment member located outside the first chamber and the closed space. A user is able to adjust a parallelism between the press-bonding unit and the carrier in an efficient and precise manner, from the adjustment member.

Abstract: The invention provides a method for making silicone hydrogel contact lenses in a relatively efficient and consistent manner from a lens formulation (i.e., a polymerizable composition) including a thermal initiator having a 10-hour half-life temperature (T10h?) under a controlled thermal curing scheme. A method of the invention comprises a step of curing the lens formulation in an oven according to a thermal curing profile that comprises or consists essentially of increasing the oven's temperature from room temperature or a temperature that is at least about 5° C. lower than T10h? to a temperature that is at least 30° C. higher than T10h? at a selected rate (e.g., from about 1° C./minute to about 10° C./minute). Under such a controlled thermal curing scheme, the lens diameter of the fully-hydrated silicone hydrogel contact lenses obtained according to a method of the invention does not vary significantly with the positions of the molds in the oven.

Abstract: A method for producing embedded hydrogel contact lenses comprises at least the following steps: obtaining an insert made of a crosslinked polymeric material comprising iniferter moieties covalently attached thereto; placing the insert in a female lens mold half; dosing an amount of a lens-forming composition to immerse the insert in the female lens mold half; closing tightly a male lens mold half onto the top of the female lens mold half halves to form a molding assembly; curing the lens-forming composition in the molding assembly to form an embedded hydrogel lens precursor which comprises a bulk hydrogel material formed the lens-forming composition and the insert that is embedded therein and covalently linked to the bulk hydrogel material.

Abstract: Methods for forming a semiconductor device structure are provided. The method includes forming a conductive feature in a first wafer, and forming a first bonding layer over the conductive feature. The method includes forming a second bonding layer over a second wafer, and bonding the first wafer and the second wafer by bonding the first bonding layer and the second bonding layer. The method also includes forming a second transistor in a front-side of the second wafer, and after forming the second transistor in the front-side of the second wafer, forming a first TSV through the second wafer, wherein the first TSV stops at the conductive feature.

Abstract: The present disclosure provides a laser lift-off method for separating substrate and semiconductor-epitaxial structure, which includes: providing at least one semiconductor device, wherein the semiconductor device includes a substrate and at least one semiconductor-epitaxial structure disposed in a stack-up manner; irradiating a laser onto an edge area of the semiconductor device to separate portions of the substrate and the semiconductor-epitaxial structure in the edge area; and pressing against the edge area of the semiconductor device vis a pressing device, then irradiating the laser onto an inner area of the semiconductor device to separate portions of the substrate and the semiconductor-epitaxial structure in the inner area wherein gas is generated during separating the portions of the substrate and the semiconductor-epitaxial structure in the inner area and evacuated from the edge area, to prevent damage of the semiconductor-epitaxial structure during the separating process.

Abstract: The present disclosure provides a quantum dot particle with passivation layer, which mainly includes a one quantum dot (QD) particle, a first-passivation layer and a second-passivation layer, wherein the first-passivation layer is disposed on a surface of the QD particle, and the second-passivation layer is disposed on a surface of the first-passivation layer. A precursor chosen for forming the first-passivation layer does not cause damage to the QD particle. A precursor of the second-passivation layer includes a composition of trimethylaluminum (TMA) and water, or TMA and ozone, wherein a density of the second-passivation layer is greater than that of the first-passivation layer. The precursor of the second-passivation layer is kept out by the first-passivation layer, such that to prevent the precursor of the second-passivation layer from contacting the QD particle and causing deterioration thereto, and hence to improve a life cycle of the QD particle.

Abstract: An integrated fan out package on package architecture is utilized along with a reference via in order to provide a reference voltage that extends through the InFO-POP architecture. If desired, the reference via may be exposed and then connected to a shield coating that can be used to shield the InFO-POP architecture. The reference via may be exposed by exposing either a top surface or a sidewall of the reference via using one or more singulation processes.