Abstract: A microphone array system, comprises N microphones, including a first microphone . . . a Nth microphone, wherein N is a natural number greater than 2. Each of the N microphones is provided with: an acoustic transducer for picking up a sound signal and converting the sound signal into an electric signal; a voice activation detector, connected to a corresponding acoustic transducer, and configured to perform a voice activation detection on the electric signal and form an activation signal; a buffer memory, connected to the acoustic transducer, and configured to store a 1/N electric signal of a predetermined segment; a sound wire interface, connected to a corresponding acoustic transducer, the buffer memory, and the voice activation detector, wherein the sound wire interface is connected to an external master chip via a sound wire bus for outputting the activation signal to the external master chip.

Abstract: The invention relates to the technical field of microphones, in particular to an online trimmed MEMS microphone. The online trimmed MEMS microphone comprises an acoustic transducer for receiving an external ultrasonic signal and converting the ultrasonic signal into an electric signal; an ASIC (Application Specific Integrated Circuit) chip, coupled to the acoustic transducer, wherein the ASIC chip comprises: an amplifier unit for performing amplification on the electric signal and outputting an amplified signal; a decoding unit, connected to the amplifier unit, and configured to decode the amplified signal to obtain a decoded signal sequence; a matching unit, connected to the decoding unit, and configured to match the decoded signal sequence with a predetermined identification code to obtain a matched signal; a control unit, connected to the matching unit, and configured to generate one or more circuit adjusting parameters under the action of the matched signal.

Abstract: The invention relates to a variable-directivity MEMS microphone. The microphone comprises an acoustic cavity. The following components are provided inside the acoustic cavity: a first acoustic transducer for detecting an acoustic signal and converting the acoustic signal into a first acoustic conversion signal; a first pre-amplifier, connected to the first acoustic transducer, and configured for outputting a first electric signal; a second acoustic transducer for detecting an acoustic signal and converting the acoustic signal into a second acoustic conversion signal; a second pre-amplifier, connected to the second acoustic transducer, and configured for outputting a second electric signal; and a signal processing chip, connected to the first pre-amplifier and the second pre-amplifier, and configured for generating a directional output signal by performing an arithmetic operation on the first electric signal and the second electric signal under the action of a switching control signal.

Abstract: The invention relates to the technical field of microphones, in particular to an online trimmed MEMS microphone. The online trimmed MEMS microphone comprises an acoustic transducer for receiving an external ultrasonic signal and converting the ultrasonic signal into an electric signal; an ASIC (Application Specific Integrated Circuit) chip, coupled to the acoustic transducer, wherein the ASIC chip comprises: an amplifier unit for performing amplification on the electric signal and outputting an amplified signal; a decoding unit, connected to the amplifier unit, and configured to decode the amplified signal to obtain a decoded signal sequence; a matching unit, connected to the decoding unit, and configured to match the decoded signal sequence with a predetermined identification code to obtain a matched signal; a control unit, connected to the matching unit, and configured to generate one or more circuit adjusting parameters under the action of the matched signal.

Abstract: A microphone array system, comprises N microphones, including a first microphone . . . a Nth microphone, wherein N is a natural number greater than 2. Each of the N microphones is provided with: an acoustic transducer for picking up a sound signal and converting the sound signal into an electric signal; a voice activation detector, connected to a corresponding acoustic transducer, and configured to perform a voice activation detection on the electric signal and form an activation signal; a buffer memory, connected to the acoustic transducer, and configured to store a 1/N electric signal of a predetermined segment; a sound wire interface, connected to a corresponding acoustic transducer, the buffer memory, and the voice activation detector, wherein the sound wire interface is connected to an external master chip via a sound wire bus for outputting the activation signal to the external master chip.

Abstract: The invention relates to a variable-directivity MEMS microphone. The microphone comprises an acoustic cavity. The following components are provided inside the acoustic cavity: a first acoustic transducer for detecting an acoustic signal and converting the acoustic signal into a first acoustic conversion signal; a first pre-amplifer, connected to the first acoustic transducer, and configured for outputting a first electric signal; a second acoustic transducer for detecting an acoustic signal and converting the acoustic signal into a second acoustic conversion signal; a second pre-amplifer, connected to the second acoustic transducer, and configured for outputting a second electric signal; and a signal processing chip, connected to the first pre-amplifer and the second pre-amplifer, and configured for generating a directional output signal by performing an arithmetic operation on the first electric signal and the second electric signal under the action of a switching control signal.

Abstract: A water-proof microphone is provided in embodiments of the present invention, comprising: a substrate on which microphone components are mounted; a packaging housing arranged on top of the substrate; a plurality of water-proof sound apertures being formed on the packaging housing; wherein the packaging housing is connected to the substrate in a leak-tight manner. In the present invention, a plurality of water-proof sound apertures are formed on the packaging housing of the microphone, and the water-proof sound apertures prevent water drops from entering the interior of the microphone while allowing sound signals enter the microphone. Water tension may prevent the water drops from entering the microphone through the sound apertures. In this way, the microphone is resistant to water and its acoustic performance is not affected. In addition, since there is no need for the provision of the water-proof membranes, a simpler structure is obtained, and costs are reduced.

Abstract: A MEMS microphone with a hybrid packaging structure is provided. The microphone comprises: a first circuit board; a second circuit board, spaced apart from the first circuit board and parallel to the first circuit board; a packaging cover, covering the second circuit board, and forming an acoustic cavity with the second circuit board; wherein the first circuit board and the second circuit board form an accommodating space in which a pressure sensor is disposed. In the present invention, the chip and electronics of the MEMS microphone are installed on two different circuit boards, respectively, so that an interior space of the microphone is fully utilized, a good heat dissipation is achieved, a better sound transmission effect is achieved, and the microphone can be widely used.

Abstract: A microphone with a combined packaging structure includes: a substrate, a first cover being provided on top of the substrate, the substrate, together with the first cover, forms a first accommodating cavity, an acoustic sensor being provided inside the first accommodating cavity, and an acoustic through-hole being formed in the first accommodating cavity. A second cover is provided on a back face of the substrate, the second cover, together with the substrate, forms a second accommodating cavity, and a proximity sensor is arranged inside the second accommodating cavity. By adopting the above-mentioned technical solutions, the present invention has the beneficial effects that two accommodating cavities are respectively provided on the top and bottom of the substrate in the microphone according to the present invention, for receiving components of a MEMS microphone and the components of a proximity sensor respectively.

Abstract: A MEMS microphone with a hybrid packaging structure is provided. The microphone comprises: a first circuit board; a second circuit board, spaced apart from the first circuit board and parallel to the first circuit board; a packaging cover, covering the second circuit board, and forming an acoustic cavity with the second circuit board; wherein the first circuit board and the second circuit board form an accommodating space in which a pressure sensor is disposed. In the present invention, the chip and electronics of the MEMS microphone are installed on two different circuit boards, respectively, so that an interior space of the microphone is fully utilized, a good heat dissipation is achieved, a better sound transmission effect is achieved, and the microphone can be widely used.

Abstract: An MEMS microphone comprises a substrate; a cover covering the substrate and forming an acoustic cavity with the substrate, wherein the substrate of the acoustic cavity is provided with: an acoustic transducer disposed in a first region of the substrate; an integrated circuit chip comprising a first bonding pad and a second bonding pad, wherein the first bonding pad is connected to the acoustic transducer via lead wires, the second bonding pad communicates with a groove formed at a bottom of the integrated circuit chip; a metal connection layer is formed on a surface of the groove and a portion where the metal connection layer extends to a bottom surface of the integrated circuit chip serves as a metal connection area. The integrated circuit chip is connected to a second region of the substrate through the metal connection area.

Abstract: The invention discloses a microphone encapsulation structure having a plurality of transducers, comprising: a housing; a circuit base plate, wherein the circuit base plate and the housing form an acoustic cavity, and a first acoustic through-hole is provided on the circuit base plate; a PCB (Printed Circuit Board) substrate disposed at a top of the circuit base plate, wherein the PCB substrate is provided with a plurality of second acoustic through-holes and the PCB substrate is provided with: a plurality of acoustic transducers each disposed directly above one of the plurality of second acoustic through-holes; and a plurality of ASIC (Application Specific Integrated Circuit) chips each connected to one of the plurality of acoustic transducers via gold wire.

Abstract: An MEMS microphone comprises a substrate; a cover covering the substrate and forming an acoustic cavity with the substrate, wherein the substrate of the acoustic cavity is provided with: an acoustic transducer disposed in a first region of the substrate; an integrated circuit chip comprising a first bonding pad and a second bonding pad, wherein the first bonding pad is connected to the acoustic transducer via lead wires, the second bonding pad communicates with a groove formed at a bottom of the integrated circuit chip; a metal connection layer is formed on a surface of the groove and a portion where the metal connection layer extends to a bottom surface of the integrated circuit chip serves as a metal connection area. The integrated circuit chip is connected to a second region of the substrate through the metal connection area.

Abstract: The invention discloses a microphone structure with an improved substrate, comprising: a L-shaped substrate having an L-shaped normal cross section; an encapsulation shell, wherein the encapsulation shell and the L-shaped substrate form an acoustic cavity; the acoustic cavity is provided with: an acoustic transducer; an ASIC (Application Specific Integrated Circuit) chip, electrically connected to the acoustic transducer; and an acoustic through-hole disposed on the L-shaped substrate or the encapsulation shell. The present invention has the beneficial effects that, an L-shaped ceramic substrate is provided, a plurality of bonding pads are arranged on a vertical surface of the L-shaped substrate, so that electronic devices may be welded to the vertical surface of the L-shaped substrate, so that the problem of an excessive large area of the substrate being occupied by the electronic devices due to the presence of an excessive number of the electronic devices on the substrate may be avoided.

Abstract: The invention discloses a microphone encapsulation structure having a plurality of transducers, comprising: a housing; a circuit base plate, wherein the circuit base plate and the housing form an acoustic cavity, and a first acoustic through-hole is provided on the circuit base plate; a PCB (Printed Circuit Board) substrate disposed at a top of the circuit base plate, wherein the PCB substrate is provided with a plurality of second acoustic through-holes and the PCB substrate is provided with: a plurality of acoustic transducers each disposed directly above one of the plurality of second acoustic through-holes; and a plurality of ASIC (Application Specific Integrated Circuit) chips each connected to one of the plurality of acoustic transducers via gold wire.

Abstract: The invention relates to the field of electronic technology, and more particularly, to a microphone structure. A MEMS (Micro-Electro-Mechanical System)-based bone conduction sensor comprises: a closed cavity within which a uniaxial or biaxial accelerometer sensor is arranged to be adjacent to bones of a human ear; an ASIC (application-specific integrated circuit) processing chip coupled to the uniaxial or biaxial accelerometer sensor, the ASIC processing chip being provided with an output end for a vibration signal. By adopting the above-mentioned technical solution, a bone conduction sensor with a closed cavity is provided in the present invention. Furthermore, a uniaxial or biaxial accelerometer sensor and an ASIC processing chip are arranged inside the closed cavity. In this way, the production costs are reduced, and interference of the sensor caused by ambient environment is reduced.

Abstract: The invention discloses a microphone structure with an improved substrate, comprising: a L-shaped substrate having an L-shaped normal cross section; an encapsulation shell, wherein the encapsulation shell and the L-shaped substrate form an acoustic cavity; the acoustic cavity is provided with: an acoustic transducer; an ASIC (Application Specific Integrated Circuit) chip, electrically connected to the acoustic transducer; and an acoustic through-hole disposed on the L-shaped substrate or the encapsulation shell. The present invention has the beneficial effects that, an L-shaped ceramic substrate is provided, a plurality of bonding pads are arranged on a vertical surface of the L-shaped substrate, so that electronic devices may be welded to the vertical surface of the L-shaped substrate, so that the problem of an excessive large area of the substrate being occupied by the electronic devices due to the presence of an excessive number of the electronic devices on the substrate may be avoided.

Abstract: A MEMS microphone for a frame-free device, comprising a substrate, wherein the substrate comprises a first substrate region provided with an acoustic sensor, an ASIC chip, and a MEMS chip, and a second substrate region provided with a plurality of pads; both the first substrate region and the second substrate region are disposed at the same side of the substrate; an acoustic through-hole is disposed at the back of the first substrate region; a microphone connection structure further comprises a flexible circuit board, wherein the flexible circuit board electrically connects the plurality of pads of the MEMS microphone to a circuit board of the frame-free device; the acoustic through-hole is aligned with an acoustic opening of the frame-free device; by adopting the MEMS microphone for a frame-free device, the MEMS microphone may be more widely used in many high-tech industries and has better acoustic performance over the conventional MEMS microphone.

Abstract: The present invention relates to a microphone, and more particularly, to a microphone with a mechanical switch function. A microphone with a mechanical switch function according to the present invention comprises a microphone body, wherein the microphone body comprises a circuit substrate above which a metal cover is disposed, an acoustic cavity formed by the metal cover and the circuit substrate; and a metal elastic piece, wherein a gap is formed between the metal elastic piece and the metal cover, and the metal elastic piece electrically contacts with the metal cover under an effect of a pressing force. By adopting the above-mentioned technical solutions, the present invention provides a microphone with functions of a mechanical switch, and the new type of microphone occupies less space, has a lower cost and is convenient to use.

Abstract: The invention relates to the field of electronic technology, and more particularly, to a microphone structure. A MEMS (Micro-Electro-Mechanical System)-based bone conduction sensor comprises: a closed cavity within which a uniaxial or biaxial accelerometer sensor is arranged to be adjacent to bones of a human ear; an ASIC (application-specific integrated circuit) processing chip coupled to the uniaxial or biaxial accelerometer sensor, the ASIC processing chip being provided with an output end for a vibration signal. By adopting the above-mentioned technical solution, a bone conduction sensor with a closed cavity is provided in the present invention. Furthermore, a uniaxial or biaxial accelerometer sensor and an ASIC processing chip are arranged inside the closed cavity. In this way, the production costs are reduced, and interference of the sensor caused by ambient environment is reduced.