Patents by Inventor Jinghua Ye
Jinghua Ye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200228887Abstract: The present invention relates to a microphone, and more particularly, to a microphone with a mechanical switch function. A microphone with a mechanical switch function according to the present invention comprises a microphone body, wherein the microphone body comprises a circuit substrate above which a metal cover is disposed, an acoustic cavity formed by the metal cover and the circuit substrate; and a metal elastic piece, wherein a gap is formed between the metal elastic piece and the metal cover, and the metal elastic piece electrically contacts with the metal cover under an effect of a pressing force. By adopting the above-mentioned technical solutions, the present invention provides a microphone with functions of a mechanical switch, and the new type of microphone occupies less space, has a lower cost and is convenient to use.Type: ApplicationFiled: July 12, 2019Publication date: July 16, 2020Applicants: ZILLTEK TECHNOLOGY (SHANGHAI) CORP., ZILLTEK TECHNOLOGY CORP.Inventor: Jinghua Ye
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Publication number: 20200178002Abstract: A MEMS microphone for a frame-free device, comprising a substrate, wherein the substrate comprises a first substrate region provided with an acoustic sensor, an ASIC chip, and a MEMS chip, and a second substrate region provided with a plurality of pads; both the first substrate region and the second substrate region are disposed at the same side of the substrate; an acoustic through-hole is disposed at the back of the first substrate region; a microphone connection structure further comprises a flexible circuit board, wherein the flexible circuit board electrically connects the plurality of pads of the MEMS microphone to a circuit board of the frame-free device; the acoustic through-hole is aligned with an acoustic opening of the frame-free device; by adopting the MEMS microphone for a frame-free device, the MEMS microphone may be more widely used in many high-tech industries and has better acoustic performance over the conventional MEMS microphone.Type: ApplicationFiled: July 12, 2019Publication date: June 4, 2020Applicants: ZILLTEK TECHNOLOGY (SHANGHAI) CORP., ZILLTEK TECHNOLOGY CORP.Inventor: Jinghua YE
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Patent number: 10547924Abstract: The invention discloses a novel microphone structure and a flip-type electronic device, comprising: a first layer plate, an acoustic sensor and a circuit chip being connected to the first layer plate; a second layer plate, covered on the first layer plate; wherein, the first layer plate and second layer plate form a microphone acoustic cavity, and the microphone acoustic cavity is provided with two acoustic through-holes located at two opposite sides or two adjacent sides of the microphone acoustic cavity. The beneficial effects of the technical schemes of the invention include: two acoustic through-holes are provided on the microphone acoustic cavity of the novel microphone structure, and the two acoustic through-holes are disposed on two opposing sides or two adjacent sides of the microphone acoustic cavity, such that sound received from inside corresponds to that received from outside when using the flip-type electronic device.Type: GrantFiled: January 25, 2018Date of Patent: January 28, 2020Assignees: ZILLTEK TECHNOLOGY (SHANGHAI) CORP., ZILLTEK TECHNOLOGY CORP.Inventor: Jinghua Ye
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Patent number: 10542349Abstract: The invention relates to the field of micro-electromechanical technology, and more particularly, to a microphone structure with an enhanced back cavity and an electronic device, comprising: a first layer plate, an groove is configured on the first layer plate, wherein an acoustic sensor is installed above the groove by means of a support, and the acoustic sensor is provided with a back cavity facing towards the support, and a through-hole for penetrating through the back cavity and the groove is provided on the support; a second layer plate, covering the first layer plate, wherein an acoustic through-hole is configured on the second layer plate; wherein, the first layer plate and second layer plate form a microphone acoustic cavity.Type: GrantFiled: May 30, 2018Date of Patent: January 21, 2020Assignees: Zilltek Technology (Shanghai) Corp., Zilltek Technology Corp.Inventor: Jinghua Ye
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Patent number: 10484799Abstract: A photoelectric MEMS microphone and an electronic device, have an acoustic cavity, the acoustic cavity includes a MEMS transducer, configured for capturing an acoustic signal, a signal processing chip, connected to a signal output terminal of the MEMS transducer. The signal processing chip includes a signal output terminal pin and a ground pin, and a light emitting device, a driving terminal of the light emitting device being connected to the signal output terminal pin. The light emitting device packaged in the microphone cavity provides the user indication that the microphone of the terminal device is turned on, avoiding the exposure of personal privacy. Furthermore, it helps to reduce costs in that the signal output terminal pin and the ground pin are integrated into the microphone.Type: GrantFiled: September 26, 2018Date of Patent: November 19, 2019Assignees: ZILLTEK TECHNOLOGY (SHANGHAI) CORP., ZILLTEK TECHNOLOGY CORP.Inventor: Jinghua Ye
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Patent number: 10448134Abstract: The invention discloses a two-wire type microphone with ultrasonic identification, comprising: an acoustic transducer for capturing an acoustic signal; a signal processing chip, connected to a signal output terminal of the acoustic transducer, wherein the signal processing chip comprises a signal output terminal pin, a ground pin and an ultrasonic generator, wherein the ultrasonic generator is the configured for generating an ultrasonic signal, and a control terminal of the ultrasonic generator is connected to the signal processing chip. The beneficial effects of the present invention includes: the ultrasonic signal generated by the ultrasonic generator is utilized to match the ultrasonic signal with the encoding unit in the signal processing chip for identification, and a remote authentication by the client is useful for matching the electronic device with the microphone.Type: GrantFiled: May 29, 2018Date of Patent: October 15, 2019Assignees: ZILLTEK TECHNOLOGY (SHANGHAI) CORP., TELLTEK TECHNOLOGY CORP.Inventor: Jinghua Ye
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Publication number: 20190297405Abstract: The invention discloses a two-wire type microphone with ultrasonic identification, comprising: an acoustic transducer for capturing an acoustic signal; a signal processing chip, connected to a signal output terminal of the acoustic transducer, wherein the signal processing chip comprises a signal output terminal pin, a ground pin and an ultrasonic generator, wherein the ultrasonic generator is the configured for generating an ultrasonic signal, and a control terminal of the ultrasonic generator is connected to the signal processing chip. The beneficial effects of the present invention includes: the ultrasonic signal generated by the ultrasonic generator is utilized to match the ultrasonic signal with the encoding unit in the signal processing chip for identification, and a remote authentication by the client is useful for matching the electronic device with the microphone.Type: ApplicationFiled: May 29, 2018Publication date: September 26, 2019Inventor: Jinghua Ye
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Patent number: 10341769Abstract: A sound amplification system integrated with back cavity pressure sensing, including: a loudspeaker body, including: a vibrating diaphragm, a voice coil connected with the vibrating diaphragm, and a back cavity, wherein the voice coil is connected to a driving unit, a microphone is in the back cavity, and the microphone senses an internal pressure of the back cavity; a computing unit, making an estimation of a displacement of the vibrating diaphragm based on the internal pressure; and a processing unit, determining the displacement of the vibrating diaphragm when compared with a reference displacement, when it is determined that the displacement exceeds a set threshold, a pre-compensation signal is generated and provided to the driving unit.Type: GrantFiled: May 8, 2018Date of Patent: July 2, 2019Assignees: ZILLTEK TECHNOLOGY (SHANGHAI) CORP., ZILLTEK TECHNOLOGY CORP.Inventor: Jinghua Ye
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Publication number: 20190182604Abstract: The invention relates to the field of micro-electromechanical technology, and more particularly, to a microphone structure with an enhanced back cavity and an electronic device, comprising: a first layer plate, an groove is configured on the first layer plate, wherein an acoustic sensor is installed above the groove by means of a support, and the acoustic sensor is provided with a back cavity facing towards the support, and a through-hole for penetrating through the back cavity and the groove is provided on the support; a second layer plate, covering the first layer plate, wherein an acoustic through-hole is configured on the second layer plate; wherein, the first layer plate and second layer plate form a microphone acoustic cavity.Type: ApplicationFiled: May 30, 2018Publication date: June 13, 2019Inventor: Jinghua Ye
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Publication number: 20190166417Abstract: The invention discloses a novel microphone structure and a flip-type electronic device, comprising: a first layer plate, an acoustic sensor and a circuit chip being connected to the first layer plate; a second layer plate, covered on the first layer plate; wherein, the first layer plate and second layer plate form a microphone acoustic cavity, and the microphone acoustic cavity is provided with two acoustic through-holes located at two opposite sides or two adjacent sides of the microphone acoustic cavity. The beneficial effects of the technical schemes of the invention include: two acoustic through-holes are provided on the microphone acoustic cavity of the novel microphone structure, and the two acoustic through-holes are disposed on two opposing sides or two adjacent sides of the microphone acoustic cavity, such that sound received from inside corresponds to that received from outside when using the flip-type electronic device.Type: ApplicationFiled: January 25, 2018Publication date: May 30, 2019Applicants: ZILLTEK TECHNOLOGY (SHANGHAI) CORP., ZILLTEK TECHNOLOGY (SHANGHAI) CORP.Inventor: Jinghua Ye
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Patent number: 9936584Abstract: The present invention relates to the field of voice signal collecting device, more specifically, to a PCB, a waterproof microphone and a production process thereof. A waterproof microphone, comprising: a first PCB; a second PCB, stacked along two parallel ends of the first PCB; a third PCB, configured with an acoustics through-hole and located at an upper end of the second PCB; wherein, an acoustics cavity is formed at a space surrounded with the first PCB, the second PCB and the third PCB; the third PCB is formed by a plurality of substrate; each of the substrates is configured with an through-hole at same location and with same shape; an opening is formed on the PCB by interconnecting the through-holes; between every two adjacent ones of the substrate, a waterproof membrane is configured. The waterproof performance of the waterproof membrane is better, and the efficiency of the attachment is higher.Type: GrantFiled: November 10, 2015Date of Patent: April 3, 2018Inventor: Jinghua Ye
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Publication number: 20160366767Abstract: The present invention relates to the field of voice signal collecting device, more specifically, to a PCB, a waterproof microphone and a production process thereof. A waterproof microphone, comprising: a first PCB; a second PCB, stacked along two parallel ends of the first PCB; a third PCB, configured with an acoustics through-hole and located at an upper end of the second PCB; wherein, an acoustics cavity is formed at a space surrounded with the first PCB, the second PCB and the third PCB; the third PCB is formed by a plurality of substrate; each of the substrates is configured with an through-hole at same location and with same shape; an opening is formed on the PCB by interconnecting the through-holes; between every two adjacent ones of the substrate, a waterproof membrane is configured. The waterproof performance of the waterproof membrane is better, and the efficiency of the attachment is higher.Type: ApplicationFiled: November 10, 2015Publication date: December 15, 2016Inventor: Jinghua Ye
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Patent number: 9326063Abstract: This present disclosure relates to the speech processing technology, more specifically, to a microphone. A microphone with voice wake-up function includes a microphone body with at least one transducer for collecting sound signals, a control module and a determining module. The microphone body is performed in a sleeping mode or an operating mode through the control module in accordance with the determined result. The invention enables the microphone body to switch between the sleeping mode and the operating mode. The sleeping mode reduces unnecessary power consumption and saves electrical energy. When a certain condition is satisfied, the body of the microphone is activated from the sleeping mode and enters into the normal operating mode.Type: GrantFiled: April 2, 2014Date of Patent: April 26, 2016Assignees: Shanghai Sniper Microelectronics Co. Ltd., Zilltek Technology Corp.Inventor: Jinghua Ye
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Patent number: 9226081Abstract: The invention relates to the technical field of voice processing equipment, more specifically, to a microphone. A new-type microphone structure comprises a first layer structure, a second layer structure located on the first layer structure, a microphone acoustic cavity formed by the first layer structure and the second layer structure, at least one acoustic hole for acquiring sound signals, which is arranged on the microphone acoustic cavity, and a dustproof component which covers the inside of the acoustic hole. The invention can prevent most of the dust particles and the moisture and the siphoning effect when in actual use, which does not need to change the size of the existing microphone. It can be used in thin structures, and can prolong the service life of the microphone.Type: GrantFiled: November 21, 2014Date of Patent: December 29, 2015Assignees: Zilltek Technology (Shanghai) Corp., Zilltek Technology Corp.Inventor: Jinghua Ye
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Patent number: 9161112Abstract: The present invention provides a single wire programmable Micro Electromechanical System (MEMS) microphone and a programming method and system thereof. The single wire programmable MEMS microphone includes an MEMS sensor and an Application Specific Integrated Circuit (ASIC) chip connected to each other; the MEMS sensor is used for implementing acoustic-electric conversion; the ASIC chip includes an OUT interface, so that an upper computer judges, according to an output signal of the OUT interface, whether the ASIC chip is in a normal start mode or a programming mode, where if the output signal of the OUT interface is at a high level, the ASIC chip is in the normal start mode, and otherwise, the ASIC chip enters the programming mode.Type: GrantFiled: January 16, 2013Date of Patent: October 13, 2015Assignees: SHANGHAI SNIPER MICROELECTRONICS, ZILLTEK TECHNOLOGY CORPORATIONInventor: Jinghua Ye
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Publication number: 20150195656Abstract: The invention relates to the technical field of voice processing equipment, more specifically, to a microphone. A new-type microphone structure comprises a first layer structure, a second layer structure located on the first layer structure, a microphone acoustic cavity formed by the first layer structure and the second layer structure, at least one acoustic hole for acquiring sound signals, which is arranged on the microphone acoustic cavity, and a dustproof component which covers the inside of the acoustic hole. The invention can prevent most of the dust particles and the moisture and the siphoning effect in actual use, which does not need to change the size of the existing microphone. It can be used in thin structures, and can prolong the service life of the microphone.Type: ApplicationFiled: June 18, 2014Publication date: July 9, 2015Inventor: Jinghua Ye
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Patent number: 9073747Abstract: The present invention provides a MEMS microphone and an electronic equipment having the MEMS microphone. The electronic equipment of the present invention at least comprises: a MEMS microphone and a printed circuit board, wherein, the microphone comprises: a microphone chip containing acoustic and electric sensor, a package shell packaging the microphone chip, wherein, it is provided a sound hole on the package shell, the sound hole is positioned on the side of the microphone chip, it is also provided pins derived from the microphone chip on the side face of the package shell adjacent to the sound hole; the printed circuit board electrically connect with the pins of the MEMS microphone, which is used to output the electric signal generated by the microphone. The present invention avoids the sound air flow directly to the microphone chip, reduces dust interference on acoustic and electric sensor in microphone chip by means of changing the position of the sound hole of the microphone.Type: GrantFiled: September 6, 2013Date of Patent: July 7, 2015Assignee: SHANGAI SNIPER MICROELECTRONICS CO., LTD.Inventor: Jinghua Ye
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Publication number: 20150049884Abstract: This present disclosure relates to the speech processing technology, more specifically, to a microphone. A microphone with voice wake-up function includes a microphone body with at least one transducer for collecting sound signals, a control module and a determining module. The microphone body is performed in a sleeping mode or an operating mode through the control module in accordance with the determined result. The invention enables the microphone body to switch between the sleeping mode and the operating mode. The sleeping mode reduces unnecessary power consumption and saves electrical energy. When a certain condition is satisfied, the body of the microphone is activated from the sleeping mode and enters into the normal operating mode.Type: ApplicationFiled: April 2, 2014Publication date: February 19, 2015Applicants: ZILLTEK TECHNOLOGY CORP., SHANGHAI SNIPER MICROELECTRONICS CO., LTD.Inventor: Jinghua Ye
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Publication number: 20140353779Abstract: The present invention provides a MEMS microphone and an electronic equipment having the MEMS microphone. The electronic equipment of the present invention at least comprises: a MEMS microphone and a printed circuit board, wherein, the microphone comprises: a microphone chip containing acoustic and electric sensor, a package shell packaging the microphone chip, wherein, it is provided a sound hole on the package shell, the sound hole is positioned on the side of the microphone chip, it is also provided pins derived from the microphone chip on the side face of the package shell adjacent to the sound hole; the printed circuit board electrically connect with the pins of the MEMS microphone, which is used to output the electric signal generated by the microphone. The present invention avoids the sound air flow directly to the microphone chip, reduces dust interference on acoustic and electric sensor in microphone chip by means of changing the position of the sound hole of the microphone.Type: ApplicationFiled: September 6, 2013Publication date: December 4, 2014Applicants: Zilltek Technology Corp., Shanghai Sniper Microelectronics Co., Ltd.Inventor: Jinghua YE
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Patent number: 8228124Abstract: A class G headphone amplifier circuit with improved power efficiency and low EMI. It may use an automatic signal level detector to detect the signal level of incoming signals and determine positive and negative power supplies for headphone amplifiers accordingly. A voltage generator may generate pairs of differential output voltages at a plurality of amplitude steps, and supply to headphone amplifiers the pair with the amplitude determined by the automatic signal level detector. As a result, headphone amplifiers are biased according to the input signal level, and the multiple voltage rails may improve power efficiency and avoid clipping.Type: GrantFiled: January 3, 2011Date of Patent: July 24, 2012Assignee: Analog Devices, Inc.Inventors: Jinghua Ye, Hui Shen, Danny Li