Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system.

Abstract: A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.

Abstract: An apparatus for preventing drag-out is provided. The apparatus is arranged at an exit where a workpiece leaves a plating chamber. Brush members are arranged to contact both sides of the workpiece as it leaves the plating chamber. The brush members are adjustably arranged in a housing such that the angle of the brush member relative to the workpiece can be varied. A locking mechanism is provided to hold the brush member at a selected angle. The entire apparatus is adjustably inward and outward with respect to the workpiece as well as with respect to the plating chamber.

Abstract: A substrate that is substantially non-wettable to adhesive resin is disclosed. The substrate is coated with a fluorinated silane composition.

Abstract: An electrode array containing individual electrode segments having means to electrically bias each of the segments individually and to control the quantity of current supplied to each of the electrode segments individually; and use of the array.

Abstract: An automatic loading mechanism for use in the manufacture of thin, metallic circuit board panels. The invention includes a lower drum unit which accepts the metallic panels from a conveyor system. The lower drum unit is rotatably mounted within a frame assembly, and includes a plurality of clamps which can automatically receive several metallic panels of varying size. The lower unit includes automatic clamp control means, and has the capability of rotating the panels from a horizontal to a vertical position or vice-versa. The lower drum unit guidingly feeds the metallic panels, through a spline assembly, to an upper unit. The uppper unit includes a plurality of clamps, in diametrically placed pairs, which delicately handle only the peripheral edge of the metallic panels while feeding them automatically into a rack assembly.