Abstract: A device for hermetically protecting integrated circuits is disclosed. The device includes a plastic housing which has a cavity. The cavity forms an opening at the top of the housing and extends toward the bottom of the housing where a metallic slug is positioned. The cavity also includes one or more bond shelves descending from the top of the housing toward the bottom of the housing. The bond shelves support conducting bond pads which are coupled to connecting pins which extend from the housing. An integrated circuit with a number of integrated circuit bond pads is attached by an epoxy to the bottom of the cavity. Bond wires couple the integrated circuit bond pads and the bond shelf pads. A liquid is dispensed in the cavity such that the liquid extends from the bottom of the cavity to a position above the bond wires. A properly selected liquid provides protection for the integrated circuit and its electrical connections.

Abstract: A wafer cooling chuck (10) uses 3M micro-channel stock (12). A coolant manifold (14) surrounds ends (16) and (18) of the stock (12). A vacuum manifold (17) surrounds the coolant manifold (14) at end (16). A heat transfer fluid supply manifold (15) surrounds the coolant manifold (14) at end (18). A first set of alternate channels (22) of the stock (12) are connected to the coolant manifolds (14) at each end (16) and (18). A second set of alternate channels (24) are connected to the vacuum manifold (17) by apertures (25, 26) connected to them from top surface (28) of the stock (12). The apertures (26) are connected to every other one of the alternate channels (24) at end (16). A set of apertures (35) are connected to the same channels (24) as the apertures (26) at end (16). A second set of apertures (37) are connected to the same channels as the apertures (25) at end (18).