Abstract: A multilayered torsional hinged scanning mirror including a hinge layer with a mirror attaching member pivotally supported by torsional hinges. A mirror layer is bonded to the front side of the attaching member and a back layer is bonded to the back side of the attaching member. The mirror layer and the back layer are equal in mass and weight to balance the moment of inertia and stresses on the torsional hinges. The back layer may be a permanent magnet if the mirror oscillating drive is a magnetic drive. Alternately, the back layer may be another silicon slice.

Abstract: A multilayered torsional hinged device such as a scanning mirror including a hinge layer with an attaching member pivotally supported by torsional hinges. A front layer is bonded to the front side of the attaching member and a back layer is bonded to the back side of the attaching member. The front layer and the back layer have equal mass moments to balance the moment of inertia and stresses on the torsional hinges. Further, the attaching member and a back portion of the front layer define a spine structure that extends to the tips of the mirror. The spine structure allows reduction of weight and mass of the mirror while maintaining mirror stiffness. The back layer may be a permanent magnet if the mirror oscillating drive is a magnetic drive. Alternately, the back layer may be another silicon slice.

Abstract: A functional surface, such as a reflective surface, is supported by a pair of torsional hinges for pivoting about a first axis which in turn is supported by a pair of anchors, according to one embodiment. The reflective surface may be driven into resonant oscillations about the first axis by inertially coupling energy to the device. According to a dual axis embodiment, the reflective surface is attached by torsional hinges to a gimbals portion which in turn is attached to the support members by a second pair of torsional hinges which are orthogonal with the first pair of hinges so as to provide for pivoting of the surface about both pairs of torsional hinges. Thus, a light source may be reflected from a reflective surface to produce a beam sweep and moved orthogonally by the gimbals portion. The devices may be etched from silicon.

Abstract: A system and method for using a single axis resonant scanning mirror for high quality bi-directional printing. The system moves the photosensitive medium or paper at a constant rate having a selected speed such that image lines of an image overlap.

Abstract: A multilayered torsional hinged scanning mirror including a hinge layer with a mirror attaching member pivotally supported by torsional hinges. A mirror layer is bonded to the front side of the attaching member and a back layer is bonded to the back side of the attaching member. The mirror layer and the back layer are equal in mass and weight to balance the moment of inertia and stresses on the torsional hinges. The back layer may be a permanent magnet if the mirror oscillating drive is a magnetic drive. Alternately, the back layer may be another silicon slice.

Abstract: An improved wafer level encapsulated micro-electromechanical device fabricated on a semiconductor wafer and a method of manufacture using state-of-the-art wafer fabrication and packaging technology. The device is contained within a hermetic cavity produced by bonding a silicon wafer with active circuits to an etched silicon wafer having cavities which surround each device, and bonding the two wafer by either thin film glass seal or by solder seal. The etched wafer and thin film sealing allow conductors to be kept to a minimum length and matched for improved electrical control of the circuit. Further, the device has capability for a ground ring in the solder sealed device. The devices may be packaged in plastic packages with wire bond technology or may be solder connected to an area array solder connected package.

Abstract: An optical matrix switch station (1) is shown mounting a plurality of optical switch units (15, 17), each of which includes a mirror (29), moveable in two axes, for purpose of switching optical beams from one optical fiber to another. A mirror assembly (41) includes a single body of silicon comprising a frame portion (43), gimbals (45), mirror portion (47), and related hinges (55). Magnets (53, 54) and air coils (89) are utilized to position the central mirror surface (29) to a selected orientation. The moveable mirror and associated magnets along with control LED's (71) are hermetically packaged in a header (81) and mounted with the air coils on mounting bracket (85) to form a micromirror assembly package (99) mounted in each optical switch unit.

Abstract: A packaged micromirror assembly (21, 21′) is disclosed. The assembly (21, 21′) includes a mirror element (41) having a mirror surface (29) that can rotate in two axes. Magnets (53) are attached to the mirror element (41), to permit rotation of the mirror surface (29) responsive to the energizing of coil drivers (36). A sensor (63, 80) is disposed under the mirror surface (29) to detect mirror orientation. In one aspect of the invention, the sensor (63) includes a light source such as an LED (68) that imparts light through an aperture (66) at the underside of the mirror surface (29). Light detectors (65) are arranged at varying angles, and detect relative intensity of light reflected from the underside of the mirror surface (29), from which the rotational position of the mirror (29) can be derived. According to another aspect of the invention, a conical sensor (80) with multiple insulated segmented capacitor plates are arranged under the mirror surface (29).

Abstract: A process for manufacturing a wafer from a layer of material such as silicon and having a multiplicity of MEMS devices such as mirrors with gimbals formed thereon is disclosed. The features of the devices on the wafer as well as the boundaries which separate individual devices are defined by lines having a constant width so as to avoid microloading effects. Waste areas of the layer of material which are greater than the constant line width are removed as breakout pieces during the release process.

Abstract: The present invention discloses drive apparatus for rotating a mirror used for switching light signals. The drive apparatus has reduced internal wiring and uses a base printed circuit board which is mounted to a support printed circuit board by sandwiching conductive ball connections between matching traces or pads on the two printed circuit boards. A drive module is also included between the two printed circuit boards which can be either a drive coil or an electrostatic plate and is used to rotate the mirrors. The use of the bump grid array or conductive ball connections significantly reduces the amount of internal wiring required.

Abstract: A functional surface, such as a reflective surface, is supported by a pair of torsional hinges for pivoting about a first axis which in turn is supported by a pair of anchors, according to one embodiment. The reflective surface may be driven into resonant oscillations about the first axis by inertially coupling energy to the device. According to a dual axis embodiment, the reflective surface is attached by torsional hinges to a gimbals portion which in turn is attached to the support members by a second pair of torsional hinges which are orthogonal with the first pair of hinges so as to provide for pivoting of the surface about both pairs of torsional hinges. Thus, a light source may be reflected from a reflective surface to produce a beam sweep and moved orthogonally by the gimbals portion. The devices may be etched from silicon.

Abstract: A temperature stabilized optical mirror is disclosed. A rotatable mirror for switching optical light signals between optical fibers is mounted on a support structure. One or more PTC (Positional Temperature Coefficient) resistors are mounted to the support structure to provide heat to the combination support structure and mirror so as to maintain the mirror and support structure above a lower limit of a selected temperature range. The PTC resistor is selected to have a switching temperature substantially equal to the lower limit of the select temperature range.

Abstract: A device such as a mirror assembly comprises a movable structure (41) having a first movable portion (45) hinged to a frame portion (43) by a first pair of torsional hinges (47A and 47B) spaced apart along a first axis (49). The device may also have a second movable portion (51) and a second pivot axis provided by set of torsional hinge (53A and 53B). The movable structure or mirror assembly (41) having a first coefficient of expansion is attached to a support structure (42) having a different coefficient of expansion at a single attaching or anchor point (63) such as by epoxy or a clamp (101). The single attaching point (63) allows expansion and/or contraction along two dimensions and thereby prevents compression and/or tension forces resulting from different coefficients of expansion between the mirror assembly 41 and the support structure 42 from being applied to the torsional hinges 47A, 47B, 53A and 53B.

Abstract: A packaged micromirror assembly (21, 21′) is disclosed. The assembly (21, 21′) includes a mirror element (41) having a mirror surface (29) that can rotate in two axes. Magnets (53) are attached to the mirror element (41), to permit rotation of the mirror surface (29) responsive to the energizing of coil drivers (36). A sensor (63, 80) is disposed under the mirror surface (29) to detect mirror orientation. In one aspect of the invention, the sensor (63) includes a light source such as an LED (68) that imparts light through an aperture (66) at the underside of the mirror surface (29). Light detectors (65) are arranged at varying angles, and detect relative intensity of light reflected from the underside of the mirror surface (29), from which the rotational position of the mirror (29) can be derived.

Abstract: An optical matrix switch station (1) is shown mounting a plurality of optical switch units (15, 17), each of which includes a mirror (29), moveable in two axes, for purpose of switching optical beams from one optical fiber to another. A mirror assembly (41) includes a single body of silicon comprising a frame portion (43), gimbals (45), mirror portion (47), and related hinges (55). Magnets (53, 54) and air coils (89) are utilized to position the central mirror surface (29) to a selected orientation. The moveable mirror and associated magnets along with control LED's (71) are hermetically packaged in a header (81) and mounted with the air coils on mounting bracket (85) to form a micromirror assembly package (99) mounted in each optical switch unit.

Abstract: A temperature stabilized optical mirror is disclosed. A rotatable mirror for switching optical light signals between optical fibers is mounted on a support structure. One or more PTC (Positional Temperature Coefficient) resistors are mounted to the support structure to provide heat to the combination support structure and mirror so as to maintain the mirror and support structure above a lower limit of a selected temperature range. The PTC resistor is selected to have a switching temperature substantially equal to the lower limit of the select temperature range.

Abstract: A process for manufacturing a wafer from a layer of material such as silicon and having a multiplicity of MEMS devices such as mirrors with gimbals formed thereon is disclosed. The features of the devices on the wafer as well as the boundaries which separate individual devices are defined by lines having a constant width so as to avoid microloading effects. Waste areas of the layer of material which are greater than the constant line width are removed as breakout pieces during the release process.

Abstract: A method of making a ball grid array package wherein there is provided a partially fabricated package including a semiconductor die, leads and balls secured to predetermined ones of the leads. The leads and balls are concurrently coated with palladium. The die, leads and at least a portion of each of the balls are then encapsulated. Encapsulation includes providing a mold including a plurality of recesses, each recesses for receiving one of the balls. A plurality of cavities is provided in the package, each extending to one of the leads at the location of one of the balls. A plurality of mold members is provided, each extendable into one of the cavities to apply a force against the ball associated with the lead to which the cavity extends. The partially fabricated package is placed into the mold so that the balls extend into the recesses and the mold members extends into the cavities. The molding material is applied to the mold cavity to provide the encapsulation.

Abstract: An improved wafer level encapsulated micro-electromechanical device fabricated on a semiconductor wafer and a method of manufacture using state-of-the-art wafer fabrication and packaging technology. The device is contained within a hermetic cavity produced by bonding a silicon wafer with active circuits to an etched silicon wafer having cavities which surround each device, and bonding the two wafer by either thin film glass seal or by solder seal. The etched wafer and thin film sealing allow conductors to be kept to a minimum length and matched for improved electrical control of the circuit. Further, the device has capability for a ground ring in the solder sealed device. The devices may be packaged in plastic packages with wire bond technology or may be solder connected to an area array solder connected package.

Abstract: An improved wafer level encapsulated micro-electromechanical device fabricated on a semiconductor wafer and a method of manufacture using state-of-the-art wafer fabrication and packaging technology. The device is contained within a hermetic cavity produced by bonding a silicon wafer with active circuits to an etched silicon wafer having cavities which surround each device, and bonding the two wafer by either thin film glass seal or by solder seal. The etched wafer and thin film sealing allow conductors to be kept to a minimum length and matched for improved electrical control of the circuit. Further, the device has capability for a ground ring in the solder sealed device. The devices may be packaged in plastic packages with wire bond technology or may be solder connected to an area array solder connected package.