Abstract: The present invention discloses drive apparatus for rotating a mirror used for switching light signals. The drive apparatus has reduced internal wiring and uses a base printed circuit board which is mounted to a support printed circuit board by sandwiching conductive ball connections between matching traces or pads on the two printed circuit boards. A drive module is also included between the two printed circuit boards which can be either a drive coil or an electrostatic plate and is used to rotate the mirrors. The use of the bump grid array or conductive ball connections significantly reduces the amount of internal wiring required.

Abstract: A printed circuit board micromirror assembly (10) is disclosed. The assembly (10) includes a mirror device (12) having a mirror surface (16) that can rotate in two axes. Actuation elements (14) are attached to the mirror device (12), to permit rotation of the mirror surface (16) responsive to the energizing of drivers (30). A spacer (22) connects between a printer circuit board (20) and mirror element (12) to permit sufficient movement of the mirror surface (16). In the alternative, the printed circuit board (20) includes a recess to form a gap to permit sufficient movement of the mirror surface (16). One or more sensors (40) are disposed under the mirror surface (16) to detect mirror orientation. According to another aspect of the invention, control circuitry is arranged under the mirror surface (16) to control the deflection of mirror element (36).

Abstract: A packaged micromirror assembly (21, 21′) is disclosed. The assembly (21, 21′) includes a mirror element (41) having a mirror surface (29) that can rotate in two axes. Magnets (53) are attached to the mirror element (41), to permit rotation of the mirror surface (29) responsive to the energizing of coil drivers (36). A sensor (63, 80) is disposed under the mirror surface (29) to detect mirror orientation. In one aspect of the invention, the sensor (63) includes a light source such as an LED (68) that imparts light through an aperture (66) at the underside of the mirror surface (29). Light detectors (65) are arranged at varying angles, and detect relative intensity of light reflected from the underside of the mirror surface (29), from which the rotational position of the mirror (29) can be derived. According to another aspect of the invention, a conical sensor (80) with multiple insulated segmented capacitor plates are arranged under the mirror surface (29).

Abstract: A packaged micromirror assembly (21, 21′) is disclosed. The assembly (21, 21′) includes a mirror element (41) having a mirror surface (29) that can rotate in two axes. Magnets (53) are attached to the mirror element (41), to permit rotation of the mirror surface (29) responsive to the energizing of coil drivers (36). A sensor (63, 80) is disposed under the mirror surface (29) to detect mirror orientation. In one aspect of the invention, the sensor (63) includes a light source such as an LED (68) that imparts light through an aperture (66) at the underside of the mirror surface (29). Light detectors (65) are arranged at varying angles, and detect relative intensity of light reflected from the underside of the mirror surface (29), from which the rotational position of the mirror (29) can be derived. According to another aspect of the invention, a conical sensor (80) with multiple insulated segmented capacitor plates are arranged under the mirror surface (29).

Abstract: A packaged micromirror assembly (10, 10′, 10″, 110) is disclosed. The assembly (10, 10′, 10″, 110) includes a mirror element (41) having a mirror surface (29) that can rotate in two axes. Magnets (53) are attached to the mirror element (41), to permit rotation of the mirror surface (29). Coil drivers (36) are attached to a circuit board (38) or to a lead frame (65, 65′). A plastic body (30, 70) is formed around the coil drivers (36) to have an upper surface with an inner shelf (34, 74) to which the mirror element (41) is attached, and an outer shelf (32, 72) to which a transparent window (31) is attached. A resistance heater (80) may be included within the body (30, 70) to prevent internal condensation in harsh environments. Alternative embodiments of the molded assembly (120, 150) include electrostatic plates (145, 146; 155, 156) that mate with widened gimbal portions (135, 136) of the mirror element (130) to electrostatically deflect the mirror surface (124).

Abstract: A packaged micromirror assembly (10; 110) is disclosed. The assembly (10) includes a micromirror (70) formed of a lower element (60) having a central mounting portion (63) surrounded by an intermediate gimbal portion (62) and a frame portion (61). A magnet standoff (68) is attached to the central mounting portion (63) and an upper mirror surface (65) is attached to the magnet standoff (68). The micromirror (70) may be packaged into a body (30) with coil drivers (36). A magnetic field generated by the coil drivers (36) applies a torque to the magnet standoff (68) causing it to rotate; because of silicon hinges in the lower element (60), the upper mirror (65) can rotate in two axes. An alternative embodiment of the assembly (110) rotates a lower mirror element (130) and an upper mirror (15) attached thereto by a standoff (68) by way of an electrostatic force.

Abstract: An optical matrix switch station (1) is shown mounting a plurality of optical switch units (15, 17), each of which includes a mirror (29), moveable in two axes, for purpose of switching optical beams from one optical fiber to another. A mirror assembly (41) includes a single body of silicon comprising a frame portion (43), gimbals (45), mirror portion (47), and related hinges (55). Magnets (53, 54) and air coils (89) are utilized to position the central mirror surface (29) to a selected orientation. The moveable mirror and associated magnets along with control LED's (71) are hermetically packaged in a header (81) and mounted with the air coils on mounting bracket (85) to form a micromirror assembly package (99) mounted in each optical switch unit.

Abstract: An optical matrix switch station (1) is shown mounting a plurality of optical switch units (15, 17), each of which includes a mirror (29), moveable in two axes, for purpose of switching optical beams from one optical fiber to another. A mirror assembly (41) includes a single body of silicon comprising a frame portion (43), gimbals (45), mirror portion (47), and related hinges (55). Magnets (53, 54) and air coils (89) are utilized to position the central mirror surface (29) to a selected orientation. The moveable mirror and associated magnets along with control LED's (71) are hermetically packaged in a header (81) and mounted with the air coils on mounting bracket (85) to form a micromirror assembly package (99) mounted in each optical switch unit.

Abstract: An integrated circuit in a package having a ground and/or power ring and bond wires crossing the ground and/or power ring, the bond wires further coupled to signal traces. A semiconductor integrated circuit is provided in a die cavity in a substrate. Signal traces are formed on the surface of the substrate. At least one conductive area is formed surrounding the die cavity. At least one signal trace is formed on the substrate and electrically isolated from the conductive ring. Bond wires are used to couple the die bond pads to the signal traces. At least some of the bond wires are coupled to signal traces and must cross the conductive ring. The bond wires are raised a clearance distance over the power or ground ring by forming a spacer on the inner end of the signal traces. The spacer formed on the signal trace then provides a clearance spacing to prevent the bond wires which cross the power ring from becoming shorted to the power ring.

Abstract: A method of forming a ball grid array package wherein a mold comprising a first mold die (1) having a cavity therein for receiving a ball (5) and a second mold die (7) for mating with the first mold die are provided. A deformable material (3) is placed in the cavity, the deformable material being preferably non-adherent to the ball and the molding composition. The ball (5) is placed in the cavity over the deformable material and the mold is closed to cause the ball to deform the deformable material within the cavity. The molding composition (13) is then injected between the first and second mold dies. The second mold die can be provided with a depending finger (9) disposed opposed to the cavity to cause the ball to deform the deformable material in the cavity when the mold is closed. A lead frame (11) is provided between the ball and the first mold die with the ball being preferably attached to the lead frame.

Abstract: A capillary for bonding a wire between two bonding locations which comprises a capillary (1) having a body having an exterior surface, a bore (23) therethrough and a wall disposed between and defined by the bore and the exterior surface, the bore terminating at an end portion (9) of said body. The wall has at one end portion thereof first (21) and second opposing sectors spaced from each other by third and fourth opposing sectors (31), the first sector having a thickness greater than the rest of the sectors and the second sector having a thickness intermediate the first sector and the third and fourth sectors. A first bond, generally a ball bond (3), is formed at a first bonding location with the capillary. The capillary is moved to a second bonding location and a stitch bond is formed at the second location while the portion of the capillary of greater thickness is downstream of the path of travel of the capillary while making the stitch bond.

Abstract: A capillary for bonding a wire between two bonding locations which comprises a capillary (1) having a body having an exterior surface, a bore (23) therethrough and a wall disposed between and defined by the bore and the exterior surface, the bore terminating at an end portion (9) of said body. The wall has at one end portion thereof first (21) and second opposing sectors spaced from each other by third and fourth opposing sectors (31), the first sector having a thickness greater than the rest of the sectors and the second sector having a thickness intermediate the first sector and the third and fourth sectors. A first bond, generally a ball bond (3), is formed at a first bonding location with the capillary. The capillary is moved to a second bonding location and a stitch bond is formed at the second location while the portion of the capillary of greater thickness is downstream of the path of travel of the capillary while making the stitch bond.

Abstract: A method of scribing and separating chips on a semiconductor wafer (21) wherein the wafer (21) is patterned and a pattern of intersecting grooves is etched on a selected surface of the semiconductor wafer (21) in a pattern, preferably in a grid pattern, to define chip areas on that surface. Trenches (27) are then formed in the shape of the pattern and the selected surface is adhered to a tape (29). Light is then passed through the tape (29) and semiconductor wafer (21) from the pattern and a pattern of intersecting saw cuts or grooves (28) aligned with the light passing through the wafer (21) is formed. The saw cuts (28) extend from a surface of the wafer (21) opposing the selected surface and are aligned with the pattern of intersecting trenches (27).

Abstract: A method of making a semiconductor device and the device wherein a chip is provided having plural bond pads thereon. A plurality of adjacent wires is provided, each wire having one end thereof coupled to and extending from one of the bond pads. The other end of each wire is coupled to one of a plurality of lead fingers. A mass of hardenable, flowable adhesive having a viscosity in its flowable state sufficient to enable the adhesive to rest on a the wire until hardened, preferably an epoxy, is disposed on adjacent wires and the adhesive is then hardened. Optionally, some of the adhesive is permitted to be disposed on a surface of the chip and beneath a wire and then hardened.

Abstract: A method of making a wire connection in a microelectronic device, preferably a semiconductor device, which includes providing a microelectronic device (7) having a bond pad (5) thereon and a wire bonding location (9) external to the microelectronic device, such as the lead finger of a lead frame. A wire (1) is provided for connection to the lead finger and the bond pad (5) to which a ball (21) has first been bonded. The ball (21) is preferably of gold and is of a material electrically compatible with the material of the wire on the bond pad. One end of the wire is connected to the lead finger (9) by a ball bond (23) and then the other end of the wire is connected to the ball (21) to complete the connection and provide a connection without a loop over the bond pad.

Abstract: A polar motion bond head for bonding semiconductor devices includes voice coil motors for providing positioning motion to the bond head, and a vision system that has an optical path that allows the camera to see all polar positions with the image staying on the camera centerline.

Abstract: An wire bonding apparatus for forming ball and stitch bonds includes a bond head (42) having a shaved capillary (20), a carrier (43) for holding the bond head (42), a bearing (44) on which the carrier (43) is mounted, and a bearing table (46) on which the bearing (44) is mounted. The bearing table (46) and bearing (44) provide rotary movement about a z axis for the capillary (20). An x-y table (48) on which the carrier bearing table (46) is mounted provides movement in x and y directions for the capillary (20). A fixed work holder (50) supports a semiconductor die (11) and a leadframe (52) adjacent the capillary (20). The relative rotation provided between shaved capillary (20) and work holder (50) provides proper orientation of the capillary (20) with respect to leadframe (52) to form high quality stitch bonds on leadframe (52) while permitting fine pitch ball bonds to be formed on the semiconductor die (11).

Abstract: A polar motion bond head for bonding semiconductor devices includes voice coil motors for providing positioning motion to the bond head, and a vision system that has an optical path that allows the camera to see all polar positions with the image staying on the camera centerline.

Abstract: A method for looping the bond wires used to connected a semiconductor bond pad to a lead frame finger during bonding to improve the clearance between adjacent bond wires.

Abstract: A lead from 10 carries an integrated circuit on a die support pad 14. The lead frame has a dam bar including a transverse portion that extends between adjacent leads (20) for limiting mold flash. The dam bar transverse portion 26 is entirely severed from the adjacent leads for final removal by a metal punch 33 along with the supporting web 16.