Patents by Inventor Jong Kyu Kim

Jong Kyu Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10608173
    Abstract: An ion beam apparatus may include a chamber assembly configured to hold a material and direct an ion beam on the material, a detector configured to detect a signal generated from the material based on the ion beam being directed on the material, and a controller configured to control at least one parameter associated with the chamber assembly based on the signal, such that at least one of an ion energy associated with the ion beam, an ion current associated with the ion beam, and an incident angle of the ion beam with respect to a top surface of the material is changed continuously with time.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: March 31, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yil-hyung Lee, Jong-Kyu Kim, Jongchul Park, Sang-Kuk Kim, Jongsoon Park, Hyeji Yoon, Woohyun Lee
  • Patent number: 10583777
    Abstract: Provided is a soft upper trim of a vehicle door, in which an upper substrate, a foam, and a transparent skin are laminated, and particularly, to a soft upper trim for switch assembly of a vehicle door, in which a switch, which is configured to preserve continuity of a transparent skin and display lock and unlock symbols on the transparent skin, is easily assembled to an upper substrate, and a method of manufacturing the same.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: March 10, 2020
    Assignees: SEOYON E-HWA CO., LTD., SEOYON AMERICA CORPORATION
    Inventors: Ji Hyun Cho, Dong Suk Kim, Jong Kyu Kim
  • Patent number: 10580933
    Abstract: Disclosed herein is a highly reliable light emitting diode. In the light emitting diode, a connector connecting light emitting cells to each other is spaced apart from bump pads in a lateral direction so as not to overlap each other. Accordingly, it is possible to provide a chip-scale flip-chip type light emitting diode having good properties in terms of heat dissipation performance and electrical reliability.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: March 3, 2020
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Se Hee Oh, Jong Kyu Kim, Hyun A Kim
  • Publication number: 20200052175
    Abstract: A light emitting device includes a first light emitting cell, a second light emitting cell, a first conductive pattern, a second conductive pattern, and a connection pattern. The connection pattern includes contact portions electrically connected to a second conductivity type semiconductor layer of the first light emitting cell and a first conductivity type semiconductor layer of the second light emitting cell. At an edge of a first region facing the second light emitting cell, one contact portion of the first conductive pattern is disposed between the contact portions of the connection pattern electrically connected to the second conductivity type semiconductor layer of the first light emitting cell, and one contact portion of the first conductive pattern is open outwards.
    Type: Application
    Filed: August 9, 2019
    Publication date: February 13, 2020
    Applicant: SEOUL VIOSYS CO., LTD.
    Inventors: Se Hee OH, Min Woo KANG, Jong Kyu KIM, Hyun A KIM
  • Patent number: 10549685
    Abstract: Provided is a soft upper trim of a vehicle door, in which an upper substrate, a foam, and a transparent skin are laminated, and particularly, to a soft upper trim for switch assembly of a vehicle door, in which a switch, which is configured to preserve continuity of a transparent skin and display lock and unlock symbols on the transparent skin, is easily assembled to an upper substrate, and a method of manufacturing the same.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: February 4, 2020
    Assignees: SEOYON E-HWA CO., LTD., SEOYON AMERICA CORPORATION
    Inventors: Ji Hyun Cho, Dong Suk Kim, Jong Kyu Kim
  • Publication number: 20200035751
    Abstract: A light-emitting element includes a light-emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a first contact electrode and a second contact electrode located on the light-emitting structure, and respectively making ohmic contact with the first conductive semiconductor layer and the second conductive semiconductor layer; an insulation layer for covering a part of the first contact electrode and the second contact electrode so as to insulate the first contact electrode and the second contact electrode; a first electrode pad and a second electrode pad electrically connected to each of the first contact electrode and the second contact electrode; and a radiation pad formed on the insulation layer, and radiating heat generated from the light-emitting structure.
    Type: Application
    Filed: October 7, 2019
    Publication date: January 30, 2020
    Inventors: Jong Kyu KIM, So Ra LEE, Yeo Jin YOON, Jae Kwon KIM, Joon Sup LEE, Min Woo KANG, Se Hee OH, Hyun A. KIM, Hyoung Jin LIM
  • Patent number: 10438992
    Abstract: A light-emitting element includes a light-emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a first contact electrode and a second contact electrode located on the light-emitting structure, and respectively making ohmic contact with the first conductive semiconductor layer and the second conductive semiconductor layer; an insulation layer for covering a part of the first contact electrode and the second contact electrode so as to insulate the first contact electrode and the second contact electrode; a first electrode pad and a second electrode pad electrically connected to each of the first contact electrode and the second contact electrode; and a radiation pad formed on the insulation layer, and radiating heat generated from the light-emitting structure.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: October 8, 2019
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Jong Kyu Kim, So Ra Lee, Yeo Jin Yoon, Jae Kwon Kim, Joon Sup Lee, Min Woo Kang, Se Hee Oh, Hyun A Kim, Hyoung Jin Lim
  • Patent number: 10431459
    Abstract: An etching target layer is formed on a substrate. An upper mask layer is formed on the etching target layer. A plurality of preliminary mask patterns is formed on the upper mask layer. The plurality of preliminary mask patterns is arranged at a first pitch. Two neighboring preliminary mask patterns of the plurality of preliminary mask patterns define a preliminary opening. An ion beam etching process is performed on the upper mask layer using the plurality of preliminary mask patterns as an etch mask to form a first preliminary-interim-mask pattern and a pair of second preliminary-interim-mask patterns. The first preliminary-interim-mask pattern is formed between one of the pair of second preliminary-interim-mask patterns and the other of the pair of second preliminary-interim-mask patterns.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: October 1, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Woohyun Lee, Sang-Kuk Kim, Jong-Kyu Kim, Yil-hyung Lee, Jongsoon Park, Hyeji Yoon
  • Publication number: 20190275930
    Abstract: Provided is a soft upper trim of a vehicle door, in which an upper substrate, a foam, and a transparent skin are laminated, and particularly, to a soft upper trim for switch assembly of a vehicle door, in which a switch, which is configured to preserve continuity of a transparent skin and display lock and unlock symbols on the transparent skin, is easily assembled to an upper substrate, and a method of manufacturing the same.
    Type: Application
    Filed: November 9, 2018
    Publication date: September 12, 2019
    Inventors: Ji Hyun CHO, Dong Suk KIM, Jong Kyu KIM, Sung Won LEE
  • Publication number: 20190275934
    Abstract: Provided is a soft upper trim of a vehicle door, in which an upper substrate, a foam, and a transparent skin are laminated, and particularly, to a soft upper trim for switch assembly of a vehicle door, in which a switch, which is configured to preserve continuity of a transparent skin and display lock and unlock symbols on the transparent skin, is easily assembled to an upper substrate, and a method of manufacturing the same.
    Type: Application
    Filed: November 9, 2018
    Publication date: September 12, 2019
    Inventors: Ji Hyun CHO, Dong Suk KIM, Jong Kyu KIM
  • Publication number: 20190275932
    Abstract: Provided is a soft upper trim of a vehicle door, in which an upper substrate, a foam, and a transparent skin are laminated, and particularly, to a soft upper trim for switch assembly of a vehicle door, in which a switch, which is configured to preserve continuity of a transparent skin and display lock and unlock symbols on the transparent skin, is easily assembled to an upper substrate, and a method of manufacturing the same.
    Type: Application
    Filed: November 9, 2018
    Publication date: September 12, 2019
    Inventors: Ji Hyun CHO, Dong Suk KIM, Jong Kyu KIM
  • Publication number: 20190280178
    Abstract: A light emitting diode having a plurality of light emitting cells is provided. The light emitting diode according to an exemplary embodiment includes a lower insulation layer covering an ohmic reflection layer, connectors disposed on the lower insulation layer to connect the light emitting cells, and an upper insulation layer covering the connectors and the lower insulation layer. An edge of the lower insulation layer is spaced apart farther from an edge of the upper insulation layer than an edge of the light emitting cell. The lower insulation layer susceptible to moisture may be protected and reliability of the light emitting diode may improve.
    Type: Application
    Filed: May 28, 2019
    Publication date: September 12, 2019
    Applicant: SEOUL VIOSYS CO., LTD.
    Inventors: Se Hee OH, Hyun A KIM, Jong Kyu KIM, Jong Hyeon CHAE
  • Publication number: 20190275931
    Abstract: Provided is a soft upper trim of a vehicle door, in which an upper substrate, foam, and a transparent skin are laminated, and particularly, to a soft upper trim for switch assembly of a vehicle door, in which a switch, which is configured to preserve continuity of a transparent skin and display lock and unlock symbols on the transparent skin, is easily assembled to an upper substrate, and a method of manufacturing the same.
    Type: Application
    Filed: November 9, 2018
    Publication date: September 12, 2019
    Inventors: Ji Hyun CHO, Dong Suk KIM, Jong Kyu KIM, Sung Won LEE
  • Patent number: 10410839
    Abstract: In an example embodiment a method of processing a substrate includes forming a plasma in a plasma chamber and using charged grids to form an ion beam and to thereby accelerate ions from the plasma chamber to a processing chamber. An auxiliary heater, which may be a radiant heater, may be used to pre-heat a grid to a saturation state to accelerate heating and concomitant distortion of the grid. A process recipe may pre-compensate for distortion of the grid.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: September 10, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yil-Hyung Lee, Yoo-Chul Kong, Jong-Kyu Kim, Seok-Woo Nam, Jong-Soon Park, Kyoung-Sub Shin
  • Publication number: 20190272979
    Abstract: In an example embodiment a method of processing a substrate includes forming a plasma in a plasma chamber and using charged grids to form an ion beam and to thereby accelerate ions from the plasma chamber to a processing chamber. An auxiliary heater, which may be a radiant heater, may be used to pre-heat a grid to a saturation state to accelerate heating and concomitant distortion of the grid. A process recipe may pre-compensate for distortion of the grid.
    Type: Application
    Filed: May 16, 2019
    Publication date: September 5, 2019
    Inventors: Yil-Hyung Lee, Yoo-Chul Kong, Jong-Kyu Kim, Seok-Woo Nam, Jong-Soon Park, Kyoung-Sub Shin
  • Patent number: 10403473
    Abstract: An ion beam etching device comprises: an ion source configured to generate ions; a grid on a side of the ion source, the grid configured to accelerate the generated ions to generate an ion beam; a process chamber configured to have an etching process using the ion beam performed therein; and a variable magnetic field application part adjacent to the process chamber, the variable magnetic field application part configured to apply a variable magnetic field.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: September 3, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Han-Na Cho, Jong-Kyu Kim, Hyuk Kim, Jongchul Park
  • Patent number: 10403969
    Abstract: Various examples are provided for spherical monopole antennas. In one example, among others, a spherical monopole antenna includes a spherical conductor on a first side of a substrate and a ground plane disposed on the substrate. The spherical conductor is electrically coupled to a connector via a tapered feeding line and the ground plane surrounds at least a portion of the connector on the second side of the substrate. In another example, among others, a method includes forming a tapered mold in a die layer disposed on a first side of a substrate, filling the tapered mold with a conductive paste, and disposing a spherical conductor on a large end of the tapered mold. The conductive paste is in contact with a signal line extending through the substrate into a small end of the tapered mold and in contact with the spherical conductor.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: September 3, 2019
    Assignee: UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC.
    Inventors: Yong-Kyu Yoon, Cheolbok Kim, Jong-Kyu Kim
  • Patent number: 10361078
    Abstract: A method of forming fine patterns includes forming an upper mask layer on a substrate, forming preliminary mask patterns on the upper mask layer, and forming upper mask patterns by etching the upper mask layer using the preliminary mask patterns as etch masks. Forming the upper mask patterns includes etching the upper mask layer by performing an etching process using an ion beam. The upper mask patterns include a first upper mask pattern formed under each of the preliminary mask patterns, and a second upper mask pattern formed between the preliminary mask patterns in a plan view and spaced apart from the first upper mask pattern.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: July 23, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yil-hyung Lee, Jongchul Park, Jong-Kyu Kim, Jongsoon Park
  • Patent number: 10337772
    Abstract: Provided is an hybrid solar heat absorption cooling system comprising: an absorption refrigerator; a solar heat steam generator configured to generate steam using solar heat; a daytime steam supplying unit configured to supply steam generated by the solar heat steam generator during the day as a heat source for the absorption refrigerator; a daytime hot water storage tank configured to store hot water discharged from the absorption refrigerator during the day; a nighttime hot water supplying unit configured to supply hot water stored in the daytime hot water storage tank during the night as a heat source for the absorption refrigerator; a nighttime hot water storage tank configured to store hot water discharged from the absorption refrigerator during the night; and a daytime hot water supplying unit configured to supply hot water stored in the nighttime hot water storage tank during the day to the solar heat steam generator.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: July 2, 2019
    Assignee: KOREA INSTITUTE OF ENERGY RESEARCH
    Inventors: Jong Kyu Kim, Yong Heack Kang, Hyun Jin Lee, Sang Nam Lee
  • Publication number: 20190189680
    Abstract: A chip-scale package type light emitting diode is provided. In the light emitting diode according to one embodiment, an opening exposing a pad metal layer is separated from an opening of a lower insulation layer which exposes an ohmic reflection layer formed on a mesa. Therefore, it is possible to prevent solder, particularly Sn, from diffusing and contaminating the ohmic reflection layer.
    Type: Application
    Filed: February 25, 2019
    Publication date: June 20, 2019
    Inventors: Se Hee OH, Jong Kyu Kim, Joon Sub Lee