Patents by Inventor Joseph Charles Reed

Joseph Charles Reed has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11725277
    Abstract: Embodiments related to measuring process pressure in low-pressure semiconductor processing environments are provided. In one example, a semiconductor processing module for processing a substrate with a process gas in a vacuum chamber is provided. The example module includes a reactor positioned within the vacuum chamber for processing the substrate with the process gas and a pressure-sensitive structure operative to transmit a pressure transmission fluid pressure to a location exterior to the vacuum chamber. In this example, the pressure transmission fluid pressure varies in response to the process gas pressure within the vacuum chamber.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: August 15, 2023
    Assignee: ASM IP Holding B.V.
    Inventor: Joseph Charles Reed
  • Publication number: 20200102649
    Abstract: Embodiments related to measuring process pressure in low-pressure semiconductor processing environments are provided. In one example, a semiconductor processing module for processing a substrate with a process gas in a vacuum chamber is provided. The example module includes a reactor positioned within the vacuum chamber for processing the substrate with the process gas and a pressure-sensitive structure operative to transmit a pressure transmission fluid pressure to a location exterior to the vacuum chamber. In this example, the pressure transmission fluid pressure varies in response to the process gas pressure within the vacuum chamber.
    Type: Application
    Filed: November 22, 2019
    Publication date: April 2, 2020
    Inventor: Joseph Charles Reed
  • Publication number: 20130023129
    Abstract: Embodiments related to measuring process pressure in low-pressure semiconductor processing environments are provided. In one example, a semiconductor processing module for processing a substrate with a process gas in a vacuum chamber is provided. The example module includes a reactor positioned within the vacuum chamber for processing the substrate with the process gas and a pressure-sensitive structure operative to transmit a pressure transmission fluid pressure to a location exterior to the vacuum chamber. In this example, the pressure transmission fluid pressure varies in response to the process gas pressure within the vacuum chamber.
    Type: Application
    Filed: July 20, 2011
    Publication date: January 24, 2013
    Applicant: ASM AMERICA, INC.
    Inventor: Joseph Charles Reed