Patents by Inventor Joseph Kelly

Joseph Kelly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11719453
    Abstract: An HVAC system is provided. Embodiments of the present disclosure generally relate to an HVAC system in which multiple indoor units are coupled to central outdoor unit, where at least one of the indoor units is configured to provide conditioned air through ductwork and at least one indoor unit is configured to provide conditioned air without ductwork. Moreover, a gas furnace can be provided in the system, for harsher environments that benefit from more robust heating. Additional systems, devices, and methods are also disclosed.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: August 8, 2023
    Assignees: Daikin Industries, Ltd., Daikin Manufacturing Company, L.P.
    Inventors: Masahiro Oka, Junichi Shimoda, Takashi Shimamura, Yuuji Yamada, Hideyuki Nakagawa, Hiroyuki Imada, David Palazzolo, Joseph Kelly Hearnsberger, Sriram Venkat, Chris Bellshaw, John Clements
  • Patent number: 11722036
    Abstract: This disclosure enables an assembly for driving an arm of a windshield wiper of a vehicle. The assembly includes a support structure in a housing that is secured against rotation relative to the housing. The support structure has an opening with a bearing surface, where the opening is configured to receive a boss of a worm wheel such that the bearing surface faces the boss of the worm wheel.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: August 8, 2023
    Assignee: COMMERCIAL VEHICLE GROUP, INC.
    Inventor: Joseph Kelly
  • Publication number: 20230175711
    Abstract: An HVAC system is provided. Embodiments of the present disclosure generally relate to heat exchangers having tubing with a reduced diameter compared to traditional systems. In one embodiment, a ducted HVAC system comprises an outdoor heat exchanger with tubing that has an outer diameter of eight millimeters (8 mm) or less and an indoor heat exchanger with tubing that has an outer diameter of nine millimeters (9 mm) or less. Additional systems, devices, and methods are also disclosed.
    Type: Application
    Filed: February 7, 2023
    Publication date: June 8, 2023
    Applicants: Daikin Industries, Ltd., Goodman Manufacturing Company, L.P.
    Inventors: Miki Yamada, Junichi Shimoda, Takamune Okui, Yuko Ishida, Joseph Kelly Heamsberger, David Palazzolo, Sriram Venkat
  • Patent number: 11647842
    Abstract: A wall bed is configured to allow a user to maximize a living space with a functional bed that can transform from daytime use to nighttime use. The wall bed is configured to function and serve a plurality of purposes as an entertainment center, a bedroom, or an office and is easily operable between these purposes with simple movements. The wall bed system comprises of a fireplace that has an embedded television which can function both as a television and be used to simulate an active fire via an external source connected to the television. Additionally, the fireplace feature may be removed with ease and transferred to another part of the room. The wall bed also comprises of an adjustable workstation where a height of the workstation may be adjusted to suit a user to work either standing up or sitting down. The wall bed also comprises of a bed and other fixtures such as and not limited to a mirror and an artwork.
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: May 16, 2023
    Inventor: William Joseph Kelly
  • Publication number: 20230103058
    Abstract: A transportation management system generates routing guidance from an origin location to a destination location by modifying edge weights in a graph of a geographic location to penalize difficult immediate maneuvers. Responsive to receiving a routing request, the system identifies a position of a provider device in a base map having edges representing road segments and nodes representing intersections between road segments. A sub-graph is generated for the edges in the base graph located up to a threshold distance from the origin location, and the system modifies the weight of one or more edges in the sub-graph corresponding to a difficult immediate maneuver. When applying a routing algorithm to generate the routing guidance, the system uses the edge weights of the generated sub-graph for a first portion of the routing guidance and the original edge weights of the base graph for a second portion of the routing guidance.
    Type: Application
    Filed: September 28, 2021
    Publication date: March 30, 2023
    Inventors: Rifat Berk, Joseph Kelly Barker, Pranav Deepak Agrawal, Vineet Khosla, Nishanth Mohan
  • Patent number: 11600716
    Abstract: Methods for manufacturing semiconductor structures are provided. The method for manufacturing the semiconductor structure includes forming a fin structure protruding from a substrate and forming a source/drain structure over the fin structure. The method for manufacturing a semiconductor structure further includes forming a metallic layer over the source/drain structure and forming an oxide film on a sidewall of the source/drain structure. In addition, the oxide film and the metallic layer are both in direct contact with the source/drain structure.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: March 7, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Andrew Joseph Kelly, Yusuke Oniki
  • Patent number: 11578880
    Abstract: An HVAC system is provided. Embodiments of the present disclosure generally relate to heat exchangers having tubing with a reduced diameter compared to traditional systems. In one embodiment, a ducted HVAC system comprises an outdoor heat exchanger with tubing that has an outer diameter of eight millimeters (8 mm) or less and an indoor heat exchanger with tubing that has an outer diameter of nine millimeters (9 mm) or less. Additional systems, devices, and methods are also disclosed.
    Type: Grant
    Filed: April 14, 2022
    Date of Patent: February 14, 2023
    Assignee: Daikin Industries, Ltd.
    Inventors: Miki Yamada, Junichi Shimoda, Takamune Okui, Yuko Ishida, Joseph Kelly Hearnsberger, David Palazzolo, Sriram Venkat
  • Publication number: 20220399780
    Abstract: This disclosure enables an assembly for driving an arm of a windshield wiper of a vehicle. The assembly includes a support structure in a housing that is secured against rotation relative to the housing. The support structure has an opening with a bearing surface, where the opening is configured to receive a boss of a worm wheel such that the bearing surface faces the boss of the worm wheel.
    Type: Application
    Filed: October 25, 2021
    Publication date: December 15, 2022
    Applicant: Commercial Vehicle Group, Inc.
    Inventor: Joseph Kelly
  • Publication number: 20220359689
    Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a channel structure extending between a first source/drain region and a second source/drain region. Further, a gate electrode is arranged directly over the channel structures, and an upper interconnect contact is arranged over and coupled to the gate electrode. A backside contact is arranged below and coupled to the first source/drain region. The backside contact has a width that decreases from a bottommost surface of the backside contact to a topmost surface of the backside contact.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 10, 2022
    Inventors: Yi-Hsiu Chen, Andrew Joseph Kelly
  • Patent number: 11437480
    Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a channel structure extending between a first source/drain region and a second source/drain region. Further, a gate electrode is arranged directly over the channel structures, and an upper interconnect contact is arranged over and coupled to the gate electrode. A backside contact is arranged below and coupled to the first source/drain region. The backside contact has a width that decreases from a bottommost surface of the backside contact to a topmost surface of the backside contact.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: September 6, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Hsiu Chen, Andrew Joseph Kelly
  • Patent number: 11411262
    Abstract: A casing for the thermal management and protection of an electrochemical cell, the casing comprises a first material, an inner surface configured to be in physical contact with an electrochemical cell, wherein the inner surface is substantially solid at room temperature; and a polymer matrix dispersed within the first material and comprising two or more temperature management materials. At least one of the two or more temperature management materials comprise a phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and an elastomeric material. The polymer matrix is substantially homogeneous, and in an environment where the electrochemical cell and a second electrochemical cell operate under the same charging and discharging conditions, the casing reduces a first operating temperature of the electrochemical cell by at least 10° C.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: August 9, 2022
    Assignee: Latent Heat Solutions, LLC
    Inventors: Mark Hartmann, Joseph Kelly
  • Publication number: 20220235949
    Abstract: An HVAC system is provided. Embodiments of the present disclosure generally relate to heat exchangers having tubing with a reduced diameter compared to traditional systems. In one embodiment, a ducted HVAC system comprises an outdoor heat exchanger with tubing that has an outer diameter of eight millimeters (8 mm) or less and an indoor heat exchanger with tubing that has an outer diameter of nine millimeters (9 mm) or less. Additional systems, devices, and methods are also disclosed.
    Type: Application
    Filed: April 14, 2022
    Publication date: July 28, 2022
    Inventors: Miki Yamada, Junichi Shimoda, Takamune Okui, Yuko Ishida, Joseph Kelly Hearnsberger, David Palazzolo, Sriram Venkat
  • Publication number: 20220199399
    Abstract: A method of semiconductor fabrication includes positioning a substrate on a susceptor in a chamber and growing an epitaxial feature on the substrate. The growing includes providing UV radiation to a first region of a surface of the substrate and while providing the UV radiation, growing a first portion of the epitaxial feature on the first region of the surface while concurrently growing a second portion of the epitaxial feature on a second region of the surface of the substrate. The first portion of the epitaxial feature can be greater in thickness than the second portion of the epitaxial feature.
    Type: Application
    Filed: February 21, 2022
    Publication date: June 23, 2022
    Inventors: Winnie Victoria Wei-Ning CHEN, Andrew Joseph KELLY
  • Publication number: 20220167750
    Abstract: A wall bed is configured to allow a user to maximize a living space with a functional bed that can transform from daytime use to nighttime use. The wall bed is configured to function and serve a plurality of purposes as an entertainment center, a bedroom, or an office and is easily operable between these purposes with simple movements. The wall bed system comprises of a fireplace that has an embedded television which can function both as a television and be used to simulate an active fire via an external source connected to the television. Additionally, the fireplace feature may be removed with ease and transferred to another part of the room. The wall bed also comprises of an adjustable workstation where a height of the workstation may be adjusted to suit a user to work either standing up or sitting down. The wall bed also comprises of a bed and other fixtures such as and not limited to a mirror and an artwork.
    Type: Application
    Filed: September 20, 2021
    Publication date: June 2, 2022
    Inventor: William Joseph Kelly
  • Patent number: 11338115
    Abstract: An angioplasty balloon (1) comprises an elongate tube (16) having a relaxed delivery configuration and an expanded deployed configuration. The elongate tube (16) comprises a proximal neck portion (10), a distal neck portion (8), a main body region, a tapered proximal portion (11) extending between the main body region and the proximal neck portion (10); and a tapered distal portion (9) extending between the main body region (3) and the distal neck portion (8), the elongate tube has only three fins (4, 5, 6) which are integrally formed with the tube and which are spaced equidistant from one another about the exterior of the tube. The fins (4, 5, 6) project radially outwardly from the exterior surface of the tube and the fins (4, 5, 6) extending longitudinally only along part of the main body region (3), resulting in the end-sections of the balloon main body being fin-free.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: May 24, 2022
    Inventors: David Slattery, John Joseph Kelly, Jonathan Akehurst, John Paul Culloty, Tomás Christopher Brosnan, David Fleming
  • Publication number: 20220157956
    Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a channel structure extending between a first source/drain region and a second source/drain region. Further, a gate electrode is arranged directly over the channel structures, and an upper interconnect contact is arranged over and coupled to the gate electrode. A backside contact is arranged below and coupled to the first source/drain region. The backside contact has a width that decreases from a bottommost surface of the backside contact to a topmost surface of the backside contact.
    Type: Application
    Filed: November 13, 2020
    Publication date: May 19, 2022
    Inventors: Yi-Hsiu Chen, Andrew Joseph Kelly
  • Patent number: 11313568
    Abstract: An HVAC system is provided. Embodiments of the present disclosure generally relate to heat exchangers having tubing with a reduced diameter compared to traditional systems. In one embodiment, a ducted HVAC system comprises an outdoor heat exchanger with tubing that has an outer diameter of eight millimeters (8 mm) or less and an indoor heat exchanger with tubing that has an outer diameter of nine millimeters (9 mm) or less. Additional systems, devices, and methods are also disclosed.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: April 26, 2022
    Assignee: Daikin Industries, Ltd.
    Inventors: Miki Yamada, Junichi Shimoda, Takamune Okui, Yuko Ishida, Joseph Kelly Hearnsberger, David Palazzolo, Sriram Venkat
  • Patent number: 11257671
    Abstract: A method of semiconductor fabrication includes positioning a substrate on a susceptor in a chamber and growing an epitaxial feature on the substrate. The growing includes providing UV radiation to a first region of a surface of the substrate and while providing the UV radiation, growing a first portion of the epitaxial feature on the first region of the surface while concurrently growing a second portion of the epitaxial feature on a second region of the surface of the substrate. The first portion of the epitaxial feature can be greater in thickness than the second portion of the epitaxial feature.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: February 22, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Winnie Victoria Wei-Ning Chen, Andrew Joseph Kelly
  • Patent number: 11221043
    Abstract: A split stabilizer bearing for a mast of a rotary distributor includes a split cylindrical housing, a split filament wound bushing, a plurality of polytetrafluoroethylene-coated carbon fiber ring seals, an annular split seal retainer, and multiple fasteners. The filament wound bushing is disposed inside the housing, along an inner surface thereof. The bushing has a backing layer of high-strength glass fiber and an inner sliding layer of polytetrafluoroethylene (PTFE) and polymer fiber, the two layers both embedded in a epoxy resin matrix. The carbon fiber ring seals are disposed on axially or longitudinally opposed sides of the bushing and along an inner side or surface of the cylindrical housing, preferably in respective annular recesses or offsets along the inner side or surface of the housing. The fasteners, nylon-patch locking screws or bolts, couple the bushing and the split seal retainer to the housing.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: January 11, 2022
    Assignee: OVIVO INC.
    Inventors: Robert Eugene Holder, Richard Darin Swan, Brendan Joseph Kelly
  • Patent number: RE48942
    Abstract: A FinFET device includes a substrate, a fin, and isolation regions on either side of the fin. The device also includes sidewall spacers above the isolation regions and formed along the fin structure. A recessing trench is formed by the sidewall spacers and the fin, and an epitaxially-grown semiconductor material is formed in and above the recessing trench, forming an epitaxial structure.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: February 22, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Andrew Joseph Kelly, Po-Ruwe Tzng, Pei-Shan Chien, Wei-Hsiung Tseng